公开(公告)号：US20150362363A1

公开(公告)日：2015-12-17

申请号：US14302186

申请日：2014-06-11

Applicant: Raytheon Company

Inventor： Evan Haynes

IPC: G01J1/02 ,  G01J1/04

CPC classification number: G01J1/0271 ,  G01J1/0403 ,  G01J5/044 ,  G01J5/047 ,  G01J5/061 ,  G01J5/089 ,  G01J5/0893 ,  G01J2005/0077 ,  G02B27/644 ,  G03B17/48

Abstract: An assembly that enables precise mounting of a sensor with improved heat transfer and rotation compensation includes an integrated dewar cooler assembly incorporating the sensor. The dewar assembly is mated to a motorized mount that is controlled to stabilize the rotation of the scene. The sensor is radially aligned relative to the axis of rotation in two adjustment stages. A first stage of adjustment controls the radial position of the sensor inside a bearing. And a second stage of adjustment controls radial translation of the entire assembly outside the bearing. Passive heat transfer is accomplished through a pair of heat sinks that effectively sandwich a hot expander end cap of the dewar, providing multiple heat paths. The entire dewar assembly is rotated during operation to stabilize the scene. The rotating mass of a cooling compressor coupled to the dewar is counter-balanced to avoid torque due to inertia.

Abstract translation: 能够精确地安装具有改进的热传递和旋转补偿的传感器的组件包括结合有传感器的集成的杜瓦瓶冷却器组件。 杜瓦组件配合到被控制以稳定场景旋转的电动安装座。 传感器在两个调节阶段相对于旋转轴线径向对准。 第一级调节控制传感器在轴承内的径向位置。 而第二阶段的调整控制了轴承外部整个组件的径向平移。 被动热传递是通过一对散热器实现的，这对散热器有效地夹住了杜瓦瓶的热膨胀器端盖，从而提供了多个热路径。 整个杜瓦组件在操作过程中旋转以稳定场景。 耦合到杜瓦瓶的冷却压缩机的旋转质量是平衡的，以避免由于惯性而产生的扭矩。

公开(公告)号：US09442003B2

公开(公告)日：2016-09-13

申请号：US14302186

申请日：2014-06-11

Applicant: Raytheon Company

Inventor： Evan Haynes

IPC: G01J5/02 ,  G01J1/02 ,  G01J1/04 ,  G01J5/04 ,  G01J5/06 ,  G03B17/48 ,  G02B27/64 ,  G01J5/08 ,  G01J5/00

CPC classification number: G01J1/0271 ,  G01J1/0403 ,  G01J5/044 ,  G01J5/047 ,  G01J5/061 ,  G01J5/089 ,  G01J5/0893 ,  G01J2005/0077 ,  G02B27/644 ,  G03B17/48

Abstract: An assembly that enables precise mounting of a sensor with improved heat transfer and rotation compensation includes an integrated dewar cooler assembly incorporating the sensor. The dewar assembly is mated to a motorized mount that is controlled to stabilize the rotation of the scene. The sensor is radially aligned relative to the axis of rotation in two adjustment stages. A first stage of adjustment controls the radial position of the sensor inside a bearing. And a second stage of adjustment controls radial translation of the entire assembly outside the bearing. Passive heat transfer is accomplished through a pair of heat sinks that effectively sandwich a hot expander end cap of the dewar, providing multiple heat paths. The entire dewar assembly is rotated during operation to stabilize the scene. The rotating mass of a cooling compressor coupled to the dewar is counter-balanced to avoid torque due to inertia.

Abstract translation: 能够精确地安装具有改进的热传递和旋转补偿的传感器的组件包括结合有传感器的集成的杜瓦瓶冷却器组件。 杜瓦组件配合到被控制以稳定场景旋转的电动安装座。 传感器在两个调节阶段相对于旋转轴线径向对准。 第一级调节控制传感器在轴承内的径向位置。 而第二阶段的调整控制了轴承外部整个组件的径向平移。 被动热传递是通过一对散热器实现的，这对散热器有效地夹住了杜瓦瓶的热膨胀器端盖，从而提供了多个热路径。 整个杜瓦组件在操作过程中旋转以稳定场景。 耦合到杜瓦瓶的冷却压缩机的旋转质量是平衡的，以避免由于惯性而产生的扭矩。

公开(公告)号：US11963328B2

公开(公告)日：2024-04-16

申请号：US17069762

申请日：2020-10-13

Applicant: Raytheon Company

Inventor： Don W. West ,  Evan Haynes

IPC: H05K7/20 ,  H01R13/622

CPC classification number: H05K7/20009 ,  H01R13/622 ,  H05K7/20145

Abstract: An electronic component connector cooling device can include a base portion and a conduit portion extending from the base portion. The conduit portion can have a cooling channel. The electronic component connector cooling device can further include a housing coupling interface formed in the base portion and operable to facilitate coupling the electronic component connector cooling device to a housing that at least partially forms an enclosure about an electronic component. The electronic component connector cooling device can also include a connector coupling interface formed in the base portion and operable to facilitate coupling a connector to the electronic component connector cooling device. The connector can operably connect the electronic component to a component external to the enclosure. The electronic component connector cooling device can further include an inlet port formed in the conduit portion and in fluid communication with the cooling channel. The inlet port can be operable to couple to a cooling fluid source external to the enclosure and to receive a cooling fluid from the cooling fluid source. The electronic component connector cooling device can include one or more outlet ports formed in the base portion and in fluid communication with the cooling channel operable to direct the cooling fluid internal to the enclosure to cool the electronic component.

公开(公告)号：US20230387645A1

公开(公告)日：2023-11-30

申请号：US17827610

申请日：2022-05-27

Applicant: Raytheon Company

Inventor： Evan Haynes ,  Kyle Douglas Weichman ,  Jeffrey L. Sabala

IPC: H01S3/08 ,  H01S3/00

CPC classification number: H01S3/0809 ,  H01S3/0085 ,  H01S3/0071

Abstract: An modular optical switching system and switching mechanism for a multispectral laser transmitter are provided. The system includes a modular housing; a moveable carrier connected to and disposed within the modular housing; a first optical member supported by the moveable carrier; and a second optical member supported by the moveable carrier. The moveable carrier is operable to selectively move the first optical member into alignment with a laser beam of the multispectral laser transmitter and to selectively move the second optical member into alignment with the laser beam of the multispectral laser transmitter.

公开(公告)号：US20220117108A1

公开(公告)日：2022-04-14

申请号：US17069762

申请日：2020-10-13

Applicant: Raytheon Company

Inventor： Don W. West ,  Evan Haynes

IPC: H05K7/20 ,  H01R13/622

Abstract: An electronic component connector cooling device can include a base portion and a conduit portion extending from the base portion. The conduit portion can have a cooling channel. The electronic component connector cooling device can further include a housing coupling interface formed in the base portion and operable to facilitate coupling the electronic component connector cooling device to a housing that at least partially forms an enclosure about an electronic component. The electronic component connector cooling device can also include a connector coupling interface formed in the base portion and operable to facilitate coupling a connector to the electronic component connector cooling device. The connector can operably connect the electronic component to a component external to the enclosure. The electronic component connector cooling device can further include an inlet port formed in the conduit portion and in fluid communication with the cooling channel. The inlet port can be operable to couple to a cooling fluid source external to the enclosure and to receive a cooling fluid from the cooling fluid source. The electronic component connector cooling device can include one or more outlet ports formed in the base portion and in fluid communication with the cooling channel operable to direct the cooling fluid internal to the enclosure to cool the electronic component.