公开(公告)号：US11056765B2

公开(公告)日：2021-07-06

申请号：US16345173

申请日：2016-12-20

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Sasha N. Oster

IPC: H01Q1/22 ,  H01L23/31 ,  H01L23/538 ,  H01L23/66 ,  H01L25/065 ,  H01Q1/38 ,  H01L23/13 ,  H01Q9/04 ,  H01Q13/10 ,  H01L23/00 ,  H01L23/498 ,  H01Q21/06

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) circuits and a second substrate coupled to the first substrate. The second substrate includes a first section and a second section with the second substrate being foldable in order to obtain a desired orientation of an antenna unit of the second section for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US11024933B2

公开(公告)日：2021-06-01

申请号：US16325351

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Brandon M. Rawlings ,  Shawna M. Liff ,  Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Johanna M. Swan ,  Richard J. Dischler

IPC: H01P3/16 ,  H01P3/12 ,  H01P3/123 ,  H01P3/14 ,  H01P11/00

Abstract: A method of making a waveguide, comprises: extruding a first dielectric material as a waveguide core of the waveguide, wherein the waveguide core is elongate; and coextruding an outer layer with the waveguide core, wherein the outer layer is arranged around the waveguide core.

公开(公告)号：US10921349B2

公开(公告)日：2021-02-16

申请号：US16096968

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Jelena Culic-Viskota ,  Thomas L. Sounart ,  Feras Eid ,  Sasha N. Oster

IPC: G01R15/20 ,  H01L41/06 ,  G01R15/14 ,  H01L41/113 ,  G01R15/24 ,  H01L41/12

Abstract: Embodiments of the invention include a current sensing device for sensing current in an organic substrate. The current sensing device includes a released base structure that is positioned in proximity to a cavity of the organic substrate and a piezoelectric film stack that is positioned in proximity to the released base structure. The piezoelectric film stack includes a piezoelectric material in contact with first and second electrodes. A magnetic field is applied to the current sensing device and this causes movement of the released base structure and the piezoelectric stack which induces a voltage (potential difference) between the first and second electrodes.

公开(公告)号：US10594029B2

公开(公告)日：2020-03-17

申请号：US15283140

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Shawna M. Liff ,  Adel A. Elsherbini ,  Sasha N. Oster ,  Feras Eid ,  Georgios C. Dogiamis ,  Thomas L. Sounart ,  Johanna M. Swan

IPC: H01Q1/52 ,  H01L41/09 ,  H01L41/047 ,  H04L29/06 ,  H01Q1/27 ,  H04W12/12 ,  H04L29/08 ,  H01Q15/00 ,  H04W12/00

Abstract: Embodiments of the invention include a reconfigurable communication system, that includes a substrate and a metamaterial shield formed over the substrate. In an embodiment, the metamaterial shield surrounds one or more components on the substrate. Additionally, a plurality of first piezoelectric actuators may be formed on the substrate. The first piezoelectric actuators may be configured to deform the metamaterial shield and change a frequency band that is permitted to pass through the metamaterial shield. Embodiments may also include a reconfigurable antenna that includes a metamaterial. In an embodiment, a plurality of second piezoelectric actuators may be configured to deform the metamaterial of the antenna and change a central operating frequency of the antenna. Embodiments may also include an integrated circuit electrically coupled to the plurality of first piezoelectric actuators and second piezoelectric actuators.

公开(公告)号：US10566672B2

公开(公告)日：2020-02-18

申请号：US15277504

申请日：2016-09-27

Applicant: INTEL CORPORATION

Inventor： Adel A. Elsherbini ,  Sasha N. Oster ,  Johanna M. Swan ,  Georgios C. Dogiamis ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Telesphor Kamgaing

IPC: H01P5/10 ,  H01Q13/08

Abstract: The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide connector. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a planar first member and a planar second member that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide connector.

公开(公告)号：US10452571B2

公开(公告)日：2019-10-22

申请号：US15746318

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Sasha N. Oster ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Georgios C. Dogiamis ,  Brandon M. Rawlings

IPC: G06F13/14 ,  G06F13/00 ,  H04M9/06 ,  G06F3/14

Abstract: Microelectronic package communications are described that use radio interfaces that are connected through waveguides. One example includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, and a radio on the package substrate coupled to the radio chip to modulate the data over a carrier and to transmit the modulated data. A waveguide connector is coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide carries the modulated data to an external component.

公开(公告)号：US10410983B2

公开(公告)日：2019-09-10

申请号：US15773152

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Vijay K. Nair

IPC: H01L23/00 ,  H01L23/66 ,  H01L23/538 ,  H01L25/10 ,  H01L23/552 ,  H01L25/18 ,  H01Q1/38 ,  H01Q1/24

Abstract: Embodiments of the invention include a microelectronic device that includes an overmolded component having a first die with a silicon based substrate. A second die is coupled to the first die with the second die being formed with compound semiconductor materials in a different substrate. A substrate is coupled to the first die. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US10386204B2

公开(公告)日：2019-08-20

申请号：US15636599

申请日：2017-06-28

Applicant: Intel Corporation

Inventor： Sasha Oster ,  Feras Eid ,  Thomas L. Sounart ,  Georgios C. Dogiamis

IPC: G01C25/00 ,  G01C19/5656 ,  G01P15/08 ,  G01P1/02 ,  G01P1/00 ,  G01P15/18 ,  G01P15/097 ,  G01P21/00

Abstract: An apparatus is provided which comprises: a substrate; a sensor including a sensing element, wherein the sensor is integrated within the substrate; and a calibration structure integrated within the substrate, wherein the calibration structure is to exhibit one or more physical or chemical properties same as the sensor but without the sensing element.

公开(公告)号：US20190198965A1

公开(公告)日：2019-06-27

申请号：US16325522

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Brandon M. Rawlings ,  Aleksandar Aleksov ,  Shawna M. Liff ,  Richard J. Dischler ,  Johanna M. Swan

IPC: H01P11/00 ,  H01P3/12

CPC classification number: H01P11/002 ,  H01P3/122

Abstract: An apparatus comprises a waveguide section including an outer layer of conductive material tubular in shape and having multiple ends; and a joining feature on at least one of the ends of the waveguide section configured for joining to a second separate waveguide section.

公开(公告)号：US20190173149A1

公开(公告)日：2019-06-06

申请号：US16325301

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/12 ,  H01P11/00 ,  H01P3/127 ,  H01P3/16

Abstract: An apparatus comprises a waveguide including: an elongate waveguide core including a dielectric material, wherein the waveguide core includes at least one space arranged lengthwise along the waveguide core that is void of the dielectric material; and a conductive layer arranged around the waveguide core.