公开(公告)号：US20050062120A1

公开(公告)日：2005-03-24

申请号：US10980516

申请日：2004-11-03

Applicant: Qing Ma ,  Valluri Rao ,  John Heck ,  Daniel Wong ,  Michele Berry

Inventor： Qing Ma ,  Valluri Rao ,  John Heck ,  Daniel Wong ,  Michele Berry

IPC: B81B7/00 ,  H01L23/10 ,  H01L21/00 ,  G02B26/00 ,  H01L27/14 ,  H01L29/82

CPC classification number: B81B7/0006 ,  H01L23/10 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A MEMS device may be formed in a hermetic cavity by sealing a pair of semiconductor structures to one another, enclosing the MEMS device. The two structures may be coupled using surface mount techniques as one example, so that the temperatures utilized may be compatible with many MEMS applications. Electrical interconnection layers in one or the other of these structures may be utilized to allow electrical interconnections from the exterior world to the MEMS components within the cavity.

公开(公告)号：US06861783B2

公开(公告)日：2005-03-01

申请号：US10716750

申请日：2003-11-19

Applicant: Li-Peng Wang ,  Qing Ma ,  Valluri Rao

Inventor： Li-Peng Wang ,  Qing Ma ,  Valluri Rao

IPC: H03H3/02 ,  H03H9/17 ,  H01L41/08

CPC classification number: H03H9/174 ,  H03H3/02 ,  H03H2003/023 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49156

Abstract: A film bulk acoustic resonator is formed on a substrate. The film bulk acoustic resonator includes a layer of piezoelectric material having a first surface proximate the substrate, and a second surface distal from the substrate. The first conductive layer deposited on the first surface of the piezoelectric material includes a first portion having a surface on a different plane than a surface associated with a second portion.

公开(公告)号：US20050035420A1

公开(公告)日：2005-02-17

申请号：US10939286

申请日：2004-09-10

Applicant: Qing Ma ,  Li-Peng Wang ,  Valluri Rao

Inventor： Qing Ma ,  Li-Peng Wang ,  Valluri Rao

IPC: H03H3/02 ,  H03H9/17 ,  H01L21/00 ,  H01L21/4763 ,  H01L27/14 ,  H03H9/00

CPC classification number: H03H9/174 ,  H03H3/02 ,  H03H2003/023 ,  Y10T29/42

Abstract: A film bulk acoustic resonator may be formed with a piezoelectric film having improved quality. The piezoelectric film may be deposited directly onto a single crystal silicon substrate. That substrate may be removed and selectively replaced with a lower electrode to form the film bulk acoustic resonator.

公开(公告)号：US06808955B2

公开(公告)日：2004-10-26

申请号：US10005667

申请日：2001-11-02

Applicant: Qing Ma

Inventor： Qing Ma

IPC: H01L2166

CPC classification number: B81C1/0023 ,  B81C2201/019 ,  B81C2203/019 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A method of fabricating an integrated circuit that includes a microelectromechanical (MEMS) device. The method includes forming a MEMS device on a substrate and forming an integrated circuit. The method further includes coupling the substrate to the integrated circuit to form a sealed cavity that includes the MEMS device. The substrate and the integrated circuit are coupled together in a controlled environment to establish a controlled environment within the cavity where the MEMS device is located.

Abstract translation: 一种制造包括微机电（MEMS）器件的集成电路的方法。 该方法包括在衬底上形成MEMS器件并形成集成电路。 该方法还包括将衬底耦合到集成电路以形成包括MEMS器件的密封腔。 衬底和集成电路在受控的环境中耦合在一起，以在MEMS器件所在的空腔内建立受控的环境。

公开(公告)号：US06784524B2

公开(公告)日：2004-08-31

申请号：US10349812

申请日：2003-01-22

Applicant: Qing Ma

Inventor： Qing Ma

IPC: H01L2330

CPC classification number: H01L23/16 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/19 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A stress shield made of a material having a CTE similar to that of the material used in the fabrication of a microelectronic die, including but not limited silicon, molybdenum, and aluminum nitride, which abuts at least one corner and/or edge of the microelectronic die. When the stress shield is positioned to abut the microelectronic die corners and/or edges, the mechanical stresses on the microelectronic die are greatly reduced or substantially eliminated.

公开(公告)号：US06753747B2

公开(公告)日：2004-06-22

申请号：US10113718

申请日：2002-04-01

Applicant: Qing Ma

Inventor： Qing Ma

IPC: H01H5122

CPC classification number: H01H59/0009 ,  H01H2001/0052

Abstract: An integrated microspring switch may be provided for relatively high frequency switching applications. A spring arm may be formed over a microspring dimple, which may be hemispherical and hollow in one embodiment. When the spring arm contacts the dimple, the spring dimple may resiliently deflect away or collapse, increasing the contact area between the spring arm and the dimple.

Abstract translation: 可以提供用于相对高频切换应用的集成微动开关。 弹性臂可以形成在微小凹坑上，在一个实施例中可以是半球形和中空的。 当弹簧臂接触凹坑时，弹簧凹坑可以弹性偏转或折叠，增加弹簧臂和凹坑之间的接触面积。

公开(公告)号：US06750078B2

公开(公告)日：2004-06-15

申请号：US10007941

申请日：2001-11-02

Applicant: Qing Ma

Inventor： Qing Ma

IPC: H01L2100

CPC classification number: H01H59/0009 ,  H01H2059/0036

Abstract: A microelectromechanical system (MEMS) switch has a beam with a high-resonance frequency. The MEMS switch includes a substrate having an electrical contact and a hexsil beam coupled to the substrate in order to transfer electric signals between the beam and the contact when an actuating voltage is applied to the switch. A method of fabricating a MEMS switch includes forming a substrate having a contact and forming a beam. The method further includes attaching the beam to the substrate such that the beam is, maneuverable into and out of contact with the substrate.

Abstract translation: 微机电系统（MEMS）开关具有高谐振频率的光束。 MEMS开关包括具有电触点和耦合到衬底的六极管的衬底，以便当致动电压施加到开关时，在光束和触点之间传递电信号。 制造MEMS开关的方法包括形成具有接触并形成束的衬底。 该方法还包括将光束附接到基板，使得光束可操纵地进入和离开与基板的接触。

公开(公告)号：US06709898B1

公开(公告)日：2004-03-23

申请号：US09679733

申请日：2000-10-04

Applicant: Qing Ma ,  Harry H. Fujimoto ,  Steven Towle ,  John E. Evert

Inventor： Qing Ma ,  Harry H. Fujimoto ,  Steven Towle ,  John E. Evert

IPC: H01L2144

CPC classification number: H01L24/83 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/97 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

Abstract: Microelectronic packages including a microelectronic die disposed within a recess in a heat spreader and build-up layers of dielectric materials and conductive traces are then fabricated on the microelectronic die and the heat spreader to form the microelectronic package, and methods for the fabrication of the same, including methods to align the microelectronic die within the heat spreader. In another embodiment, a microelectronic die is disposed on a heat spreader which has a filler material disposed therearound and build-up layers of dielectric materials and conductive traces are then fabricated on the microelectronic die and the filler material to form the microelectronic package, and methods for the fabrication of the same, including methods to align the microelectronic die on the heat spreader.

Abstract translation: 然后在微电子管芯和散热器上制造微电子封装，其中包括设置在散热器的凹槽内的微电子管芯和介电材料和导电迹线的堆积层，以形成微电子封装，以及制造相同的方法 包括在散热器内对准微电子管芯的方法。 在另一个实施例中，微电子管芯设置在散热器上，散热器具有设置在其周围的填充材料，然后在微电子管芯和填充材料上制造介电材料和导电迹线的层，以形成微电子封装，以及方法 用于制造它们，包括在散热器上对准微电子管芯的方法。

公开(公告)号：US06686820B1

公开(公告)日：2004-02-03

申请号：US10194096

申请日：2002-07-11

Applicant: Qing Ma ,  Valluri Rao ,  John Heck ,  Li-Peng Wang ,  Dong Shim ,  Quan Tran

Inventor： Qing Ma ,  Valluri Rao ,  John Heck ,  Li-Peng Wang ,  Dong Shim ,  Quan Tran

IPC: H01P110

CPC classification number: H01H59/0009 ,  H01H2001/0078 ,  H01H2059/0036

Abstract: This application discloses a microelectromechanical (MEMS) switch apparatus comprising an anchor attached to a substrate and an electrically conductive beam attached to the anchor and in electrical contact therewith. The beam comprises a tapered portion having a proximal end and a distal end, the proximal end being attached to the anchor, an actuation portion attached to the distal end of the tapered portion, a tip attached to the actuation portion, the tip having a contact dimple thereon. The switch apparatus also includes an actuation electrode attached to the substrate and positioned between the actuation portion and the substrate. Additional embodiments are also described and claimed.

Abstract translation: 本申请公开了一种微机电（MEMS）开关设备，其包括附接到基板的锚固件和附接到锚固件并与其接触的导电梁。 所述梁包括具有近端和远端的锥形部分，所述近端附接到所述锚固件，附接到所述锥形部分的远端的致动部分，附接到所述致动部分的尖端，所述尖端具有触点 在其上的凹坑。 开关装置还包括附接到基板并位于致动部分和基板之间的致动电极。 还描述和要求保护附加实施例。

公开(公告)号：US06586836B1

公开(公告)日：2003-07-01

申请号：US09516652

申请日：2000-03-01

Applicant: Qing Ma ,  Xiao-Chun Mu ,  Quat Vu ,  Steve Towle

Inventor： Qing Ma ,  Xiao-Chun Mu ,  Quat Vu ,  Steve Towle

IPC: H01L2348

CPC classification number: H01L24/19 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/96 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/20 ,  H01L2224/92 ,  H01L2224/92144 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method of fabricating microelectronic dice by providing or forming a first encapsulated die assembly and a second encapsulated die assembly. Each of the encapsulated die assemblies includes at least one microelectronic die disposed in an encapsulation material. Each of the encapsulated die assemblies has an active surface and a back surface. The encapsulated die assemblies are attached together in a back surface-to-back surface arrangement. Build-up layers are then formed on the active surfaces of the first and second encapsulated assemblies, preferably, simultaneously. Thereafter, the microelectronic dice are singulated, if required, and the microelectronic dice of the first encapsulated die assembly are separated from the microelectronic dice of the second encapsulated die assembly.

Abstract translation: 一种通过提供或形成第一封装模具组件和第二封装模具组件来制造微电子模具的方法。 每个封装的管芯组件包括设置在封装材料中的至少一个微电子管芯。 每个封装的模具组件具有活性表面和后表面。 封装的模头组件以后表面对背表面布置连接在一起。 然后，优选地，同时地，在第一和第二封装组件的活性表面上形成积层。 此后，如果需要，微电子骰子是单切的，并且第一封装模具组件的微电子骰子与第二封装模具组件的微电子骰子分开。