公开(公告)号：US99410A

公开(公告)日：1870-02-01

申请号：US99410D

CPC classification number: H01L24/11 ,  B23K2201/40

公开(公告)号：US6133634A

公开(公告)日：2000-10-17

申请号：US129663

申请日：1998-08-05

Applicant: Rajeev Joshi

Inventor： Rajeev Joshi

IPC: B23K1/00 ,  B23K3/06 ,  H01L23/492 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: B23K1/0008 ,  B23K3/0623 ,  H01L23/492 ,  B23K2201/40 ,  H01L2924/0002

Abstract: An improved semiconductor package that reduces package resistance to a negligible level, and offers superior thermal performance. A silicon die is attached to a carrier (or substrate) that has a cavity substantially surrounding the die. Direct connection of the active surface of the silicon die to the printed circuit board is then made by an array of solder bumps that is distributed across the surface of the die as well as the edges of the carrier surrounding the die.

Abstract translation: 改进的半导体封装，将封装电阻降低到可忽略的水平，并提供出色的散热性能。 将硅片连接到具有基本上围绕裸片的空腔的载体（或基底）上。 然后通过分布在模具表面以及围绕模具的载体的边缘的焊料凸块的阵列制造硅片的有源表面与印刷电路板的直接连接。

公开(公告)号：US6131795A

公开(公告)日：2000-10-17

申请号：US187222

申请日：1998-11-06

Applicant: Seiichi Sato

Inventor： Seiichi Sato

IPC: B23K3/03 ,  B23K20/02 ,  H01L21/60 ,  H01L21/603 ,  B23K1/06 ,  B23K31/02

CPC classification number: B23K20/023 ,  B23K3/03 ,  H01L24/81 ,  B23K2201/40 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/758 ,  H01L2224/759 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/014

Abstract: A thermal compression bonding method of an electronic part with a solder bump comprises the steps of, pressing the electronic part with the solder bump to a circuit board by a thermal compression bonding tool vertically moving by vertical moving means and thermally compression bonding said electronic part to the circuit board while detecting the pressing force by load detecting means. In this method, there is included the steps of descending the thermal compression bonding tool so as to press the solder bump of said electronic part to the electrode of the circuit board, and judging that the solder bump is melted when a load detected value by said load detecting means is reduced to a value equal to or less than a predetermined value after heating of said electronic part is started so as to ascend the thermal compression bonding tool. Accordingly, it is unnecessary to wait a time-up of a supposed melting time set by a timer in accordance with a conventional method, so that a useless time can be omitted and a productivity can be improved.

Abstract translation: 具有焊料凸块的电子部件的热压接方法包括以下步骤：通过垂直移动装置垂直移动的热压接工具将具有焊料凸块的电子部件压向电路板，并将所述电子部件热压接合到 电路板，同时通过负载检测装置检测按压力。 在该方法中，包括如下步骤：使热压接工具下降，以将所述电子部件的焊料凸块按压到电路板的电极，并且当所述焊接凸块的负载检测值由所述 负荷检测装置在开始加热电子部件之后降低到等于或小于预定值的值，以便升高热压接工具。 因此，不需要按照常规方法等待由定时器设定的假定的熔化时间的时间，从而可以省略无用的时间并且可以提高生产率。

公开(公告)号：US6123248A

公开(公告)日：2000-09-26

申请号：US99522

申请日：1998-06-18

Applicant: Masahiro Tadauchi ,  Makoto Gonda ,  Yoshiyuki Goto ,  Tomiaki Furuya ,  Kouichi Teshima ,  Izuru Komatsu ,  Takeshi Gotanda

Inventor： Masahiro Tadauchi ,  Makoto Gonda ,  Yoshiyuki Goto ,  Tomiaki Furuya ,  Kouichi Teshima ,  Izuru Komatsu ,  Takeshi Gotanda

IPC: B23K1/06 ,  B23K3/04 ,  B23K31/02 ,  B23K35/26 ,  C22C13/00 ,  H05K3/34 ,  B23K20/10 ,  B23K35/38

CPC classification number: B23K1/06 ,  B23K35/262 ,  B23K2201/40

Abstract: Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components is 0.1% by weight or less and the content of oxygen is 100 ppm or less. The binary solder is melted in a non-oxidizing environment and dispensed to the base material in an atmosphere in which the oxygen content is 2,000 ppm or less, to solder the base material with the binary solder. The soldering apparatus comprises an oscillator for supplying oscillatory wave energy having frequency of 15 KHz to 1 MHz to the base material. The soldering apparatus can also be realized in the form of a soldering nozzle or a soldering iron.

公开(公告)号：US6116494A

公开(公告)日：2000-09-12

申请号：US144656

申请日：1998-09-01

Applicant: Paul I. Brown ,  Natalia Balingit

Inventor： Paul I. Brown ,  Natalia Balingit

IPC: B23K1/012 ,  H05K3/34 ,  B23K31/00 ,  B23K31/02

CPC classification number: H05K3/3494 ,  B23K1/012 ,  B23K2201/40 ,  H05K2201/10689 ,  H05K2203/0195 ,  H05K2203/081 ,  H05K3/3421

Abstract: The present invention provides an efficient method for attaching computer system components which greatly reduces or eliminates damage to the PC board or components. The method for attaching the computer component includes the steps of: positioning the component on the PC board so that the component leads are aligned with the corresponding pads on the PC board; attaching the anchoring leads to its corresponding pads on the PC board; and heating the attachment media with a heated air jet so that the heated air jet heats the attachment media to a temperature between the melting point of the attachment media and the vaporization point of the attachment media, wherein the heated air jet is moved back and forth along the edge of the component being attached.

Abstract translation: 本发明提供了一种用于附接计算机系统组件的有效方法，其大大减少或消除了对PC板或组件的损坏。 用于安装计算机组件的方法包括以下步骤：将组件定位在PC板上，使得组件引线与PC板上的相应焊盘对齐; 将锚定引线连接到PC板上的相应焊盘; 并且用加热的空气射流加热附着介质，使得加热的空气射流将附着介质加热到附着介质的熔点和附着介质的蒸发点之间的温度，其中加热的空气射流来回移动 沿着附接的部件的边缘。

公开(公告)号：US06102273A

公开(公告)日：2000-08-15

申请号：US120314

申请日：1998-07-22

Applicant: Ryoko Satoh

Inventor： Ryoko Satoh

IPC: H01L21/52 ,  B23K1/00 ,  B23K3/06 ,  B23K3/08 ,  H01L21/00 ,  B23K5/00 ,  B23K20/14

CPC classification number: H01L21/67138 ,  B23K1/0008 ,  B23K3/0607 ,  B23K3/08 ,  H01L24/75 ,  B23K2201/40

Abstract: In a die bonding apparatus, above a work placing table shrouded in the atmosphere of an inert gas, there are provided a pair of gas injecting heads which can be separated from each other to enlarge the opening to the degree that the largest semiconductor package can be inserted through the opening and which can reduce the opening to the degree that a bonding head can be inserted through the opening. The pair of gas injecting heads form at least two layers of gas curtain by injecting an inert gas from the inner wall of the opening, so that the inert gas atmosphere is ensured within a space, so as to maintain the oxygen concentration at a low level thereby to prevent generation of an oxide film. Thus, the oxide film is prevented from generating at a surface of a bonding agent when the bonding agent is molten at the time of a die bonding.

Abstract translation: 在芯片接合装置中，在惰性气体气氛中覆盖的工作台上方，设置有可以彼此分离的一对气体注入头，以将开口扩大到最大半导体封装可以的程度 插入通过开口并且可以将开口减小到结合头可以穿过开口插入的程度。 一对气体注入头通过从开口的内壁注入惰性气体而形成至少两层气帘，从而在空间内确保惰性气体气氛，以将氧浓度保持在低水平 从而防止氧化膜的产生。 因此，当在芯片接合时粘合剂熔融时，防止氧化膜在粘合剂的表面产生。

公开(公告)号：US6095398A

公开(公告)日：2000-08-01

申请号：US88069

申请日：1998-06-01

Applicant: Nobuaki Takahashi ,  Naoji Senba ,  Yuzo Shimada

Inventor： Nobuaki Takahashi ,  Naoji Senba ,  Yuzo Shimada

IPC: H05K13/02 ,  B23K3/06 ,  B23K35/02 ,  H01L21/48 ,  H01L21/60 ,  H05K3/34 ,  B23K1/00 ,  B23K35/12

CPC classification number: B23K35/0244 ,  B23K3/0623 ,  H01L21/4853 ,  H01L24/11 ,  H05K3/3478 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/0116 ,  H05K2203/041 ,  H05K2203/082

Abstract: A solder ball arrangement device has a thin arrangement plate having a plurality of through-holes of a truncated pyramid shape, a porous member bonded to the arrangement plate, and a housing member for receiving the arrangement plate and the porous member for defining an air space inside the housing member. A suction pump is provided to evacuate the air space and to receive an array of solder balls in the through-holes by suction. The through-holes are formed by etching, and the porous member reinforces the thin arrangement plate.

公开(公告)号：US6083848A

公开(公告)日：2000-07-04

申请号：US52884

申请日：1998-03-31

Applicant: Emery Sugasawara ,  Kevin Weaver ,  Jay Hidy

Inventor： Emery Sugasawara ,  Kevin Weaver ,  Jay Hidy

IPC: B23K1/018 ,  C23F1/44 ,  G01R31/28 ,  H01L21/00 ,  B08B3/00 ,  B08B3/04 ,  C23F1/00

CPC classification number: H01L21/67028 ,  B23K1/018 ,  C23F1/44 ,  B23K2201/40 ,  G01R31/2851

Abstract: A method for removing solder from the leads of ICs including immersing the IC in an acid solution. The acid solution dissolves the excess solder on the IC leads. The acid solution is preferably a hydrogen chloride solution containing about 38% hydrogen chloride and 62% water. The acid solution, however, can contain up to 50% hydrogen chloride. After the IC is immersed for a period of time, preferably ten minutes, it is removed from the acid solution and rinsed with water. The IC is rinsed so as to remove any remaining acid solution residue. Rinsing for 5 minutes or more typically ensures removing all of the acid solution. The IC is then inspected to determine whether substantially all of the excess solder is removed from the IC leads. If excess solder still remains on the IC leads, the IC is reintroduced into the solder removing process including immersing the IC in the acid solution, rinsing the IC with water, and inspecting the IC. The process is repeated until substantially all, if not all, of the excess solder is removed.

Abstract translation: 一种用于从IC引线去除焊料的方法，包括将IC浸入酸溶液中。 酸溶液溶解IC引线上的多余焊料。 酸溶液优选为含有约38％氯化氢和62％水的氯化氢溶液。 然而，酸溶液可以含有高达50％的氯化氢。 将IC浸渍一段时间后，优选10分钟，将其从酸溶液中取出并用水冲洗。 冲洗IC以除去任何剩余的酸溶液残留物。 冲洗5分钟或更长时间通常确保除去所有的酸溶液。 然后对IC进行检查，以确定是否从IC引线中去除了多余的多余焊料。 如果IC引线上仍然存在多余的焊料，则将IC重新引入到除锡工艺中，包括将IC浸入酸溶液中，用水冲洗IC并检查IC。 重复该过程，直到几乎全部（如果不是全部）多余的焊料被去除。

公开(公告)号：US6078020A

公开(公告)日：2000-06-20

申请号：US970146

申请日：1997-11-13

Applicant: Fuminobu Ono

Inventor： Fuminobu Ono

IPC: H01L21/52 ,  B23K1/00

CPC classification number: B23K1/0004 ,  B23K2201/40

Abstract: In semiconductor device manufacturing apparatus and method, in a joining process of a semiconductor pellet (2) and a package (1), the semiconductor pellet (2) is kept to a temperature equilibrium state under an actual use temperature condition while a low melting-point soldering member (3) is interposed between the semiconductor pellet (2) and the package (1), and the electrode pads (9) on the upper surface of the semiconductor pellet (2) and the electrode terminals (8) of the collet (5), which is electrically connected to the output terminal of a high voltage electric pulse source (4), are fitted and electrically connected to each other. Subsequently, a high voltage electric pulse is produced in the high voltage electric pulse source (4) and applied to the electrode pads (9) to melt the low melting-point soldering member (3), causing joining of the package (1) and the semiconductor pellet (2). The joining treatment can be performed under the actual use temperature condition of the semiconductor pellet (2), and thermal stress to the semiconductor pellet (2) is suppressed and the lifetime of the semiconductor pellet (2) can be increased.

Abstract translation: 在半导体器件制造装置和方法中，在半导体芯片（2）和封装（1）的接合工序中，半导体芯片（2）在实际使用温度条件下保持在温度平衡状态， 点焊件（3）插入在半导体芯片（2）和封装（1）之间，电极焊盘（9）位于半导体芯片（2）的上表面和电极端子（8） 电连接到高电压电脉冲源（4）的输出端子（5）彼此并联并电连接。 随后，在高压电脉冲源（4）中产生高压电脉冲，并施加到电极焊盘（9）以熔化低熔点焊接部件（3），从而使封装（1）和 半导体颗粒（2）。 可以在半导体颗粒（2）的实际使用温度条件下进行接合处理，并且抑制对半导体颗粒（2）的热应力，并且可以提高半导体颗粒（2）的寿命。

公开(公告)号：US6068180A

公开(公告)日：2000-05-30

申请号：US991168

申请日：1997-12-16

Applicant: Howard R. Test

Inventor： Howard R. Test

IPC: H01L21/60 ,  B23K20/00 ,  H01L21/603 ,  H01L21/607 ,  H01L23/495 ,  H01L23/50 ,  B23K31/02 ,  B23K37/00 ,  B23K5/22

CPC classification number: H01L24/85 ,  B23K20/002 ,  H01L23/49551 ,  H01L23/49558 ,  H01L24/49 ,  B23K2201/40 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/85201 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165

Abstract: A system (270, 370) for connecting a semiconductor chip (22, 322) to a leadframe (12), the system (270, 370) includes a three-dimensional leadframe (12) and a bonding support mechanism (202, 302, 402). The leadframe (12) may include a first lead (32, 132, 332, 432) having a first base portion (144), a first lead tip (42, 142, 342, 442), and a first longitudinal axis (305); a second lead (30, 130, 330, 430) having a second base portion (140, 321), a second lead tip (36, 136, 336, 436), and a second longitudinal axis. The first lead (32, 132, 332, 432) and second lead (30, 130, 330, 430) formed substantially adjacent to each other, and the second lead (30, 130, 330, 430) having a stepped portion (38, 138, 338, 438) such that the lead tips (42, 142, 342, 442, 36, 136, 336, 436) of the first lead (132, 332, 432) and second lead (130, 330, 430) are separated in a Z-direction (52) and in a Y-direction (52). The bonding support mechanism (202, 302) for holding the three-dimensional leadframe (12) may include a support body (215, 315), a trough (203, 303) formed on the support body (215, 315). The trough (203, 303) may have a first surface (204, 304) at a first elevation, where the first surface (204, 304) is for supporting the second lead tip (36, 136, 336). A second surface (206, 306) may be formed on the support body (215, 315) at a second elevation and substantially adjacent to the first surface (204, 304). The second surface (206, 306) is for supporting the first lead tip (42, 142, 342). The first elevation and second elevation may be displaced from each other. The bonding support mechanism (202, 302) may have an angled surface (210, 310) for accommodating a stepped portion (38, 138, 338, 438) of the second lead (30, 130, 330) and may have additional support surfaces (376, 319).