公开(公告)号：US20160381828A1

公开(公告)日：2016-12-29

申请号：US14749645

申请日：2015-06-25

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Jianwu Yin ,  Rongxian Zhang

IPC: H05K7/20

CPC classification number: G06F1/16 ,  F01P5/10 ,  F28D15/00 ,  G06F1/203 ,  G06F2200/201 ,  H01L23/473

Abstract: A bendable water-cooling device includes: a pump unit having a pump case and a driver. The pump case has a pump chamber, a first inlet and a first outlet. The pump case is formed with a first pivotal connection section on the same side as the first outlet; a heat exchange unit having a liquid reservoir case and a heat dissipation member, the liquid reservoir case having a heat exchange chamber, a second inlet and a second outlet, the liquid reservoir case being formed with a second pivotal connection section on the same side as the second inlet; and a pivot unit having a first mating section and a second mating section respectively pivotally connected with the first and second pivotal connection sections. The pump unit and the heat exchange unit are bendable around the pivot unit from a horizontal position to an upper and lower overlapping position.

Abstract translation: 可弯曲的水冷装置包括：具有泵壳和驱动器的泵单元。 泵壳具有泵室，第一入口和第一出口。 泵壳形成有与第一出口相同侧的第一枢转连接部分; 具有储液箱和散热构件的热交换单元，所述储液箱具有热交换室，第二入口和第二出口，所述储液箱形成有与所述储液箱相同侧的第二枢转连接部， 第二个入口; 以及枢转单元，具有分别与第一和第二枢转连接部分枢转地连接的第一配合部分和第二配合部分。 泵单元和热交换单元可绕枢轴单元从水平位置到上部和下部重叠位置是可弯曲的。

公开(公告)号：US20160377358A1

公开(公告)日：2016-12-29

申请号：US14751287

申请日：2015-06-26

Applicant: International Business Machines Corporation

Inventor： Robert K. Mullady

IPC: F28F9/22 ,  F16K15/00

CPC classification number: H05K7/20281 ,  F28D15/00 ,  F28F2250/06 ,  G06F1/20 ,  G06F2200/201

Abstract: A source of liquid provided an input of liquid into a liquid cooling system. The liquid from the source of liquid flows through a check valve assembly which includes an input, a first output, and a second output. The second output includes a check valve configured to open when the pressure of the liquid exceeds a threshold pressure value. A connector is attached to the first output of the check valve assembly. The connector is a quick connect fitting equipped with a self-sealing valve.

Abstract translation: 液体源提供液体输入到液体冷却系统中。 来自液体源的液体流过包括输入，第一输出和第二输出的止回阀组件。 第二输出包括止回阀，其构造成当液体的压力超过阈值压力值时打开。 连接器连接到止回阀组件的第一输出端。 连接器是配有自密封阀的快速连接配件。

公开(公告)号：US09501112B2

公开(公告)日：2016-11-22

申请号：US14125654

申请日：2013-08-10

Applicant: Intel Corporation

Inventor： Daryl Nelson ,  Kevin Daniel ,  Daniel Chiang ,  Mark Gallina ,  Steven Lofland

IPC: G06F1/20

CPC classification number: G06F1/206 ,  G06F1/203 ,  G06F2200/201

Abstract: Mobile platforms and methods may provide for an integrated circuit such as a system on chip (SoC), a first heat spreader thermally coupled to the integrated circuit and a phase change material configuration thermally coupled to the first heat spreader. The integrated circuit may include logic to operate the integrated circuit in a performance burst mode according to a duty cycle, wherein the performance burst mode causes a phase change material to enter a liquid state within a graphite matrix of the phase change material configuration.

Abstract translation: 移动平台和方法可以提供诸如片上系统（SoC）的集成电路，热耦合到集成电路的第一散热器和热耦合到第一散热器的相变材料配置。 集成电路可以包括根据占空比以性能突发模式操作集成电路的逻辑，其中性能突发模式导致相变材料在相变材料配置的石墨矩阵内进入液态。

公开(公告)号：US20160330873A1

公开(公告)日：2016-11-10

申请号：US14703566

申请日：2015-05-04

Applicant: Google Inc.

Inventor： Soheil Farshchian ,  Madhu Krishnan Iyengar

IPC: H05K7/20

CPC classification number: H05K7/20818 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/2029 ,  H05K7/20336 ,  H05K7/20545 ,  H05K7/20663 ,  H05K7/20672 ,  H05K7/20681 ,  H05K7/20809

Abstract: A server rack thermosiphon system includes a plurality of evaporators, each evaporator including a thermal interface for one or more heat-generating server rack devices; at least one condenser mounted to an external structure of a server rack, the condenser including a fluid-cooled heat transfer module; a liquid conduit that fluidly couples each of the evaporators to the condenser to deliver a liquid phase of a working fluid from the condenser to the evaporators; and a vapor conduit that fluidly couples each of the evaporators to the condenser to deliver a mixed phase of the working fluid from the evaporators to the condenser.

Abstract translation: 服务器机架热虹吸系统包括多个蒸发器，每个蒸发器包括用于一个或多个发热服务器机架装置的热接口; 至少一个安装到服务器机架的外部结构的冷凝器，所述冷凝器包括流体冷却的传热模块; 将每个蒸发器流体耦合到冷凝器以将工作流体的液相从冷凝器输送到蒸发器的液体管道; 以及将每个蒸发器流体耦合到冷凝器以将工作流体的混合相从蒸发器输送到冷凝器的蒸汽导管。

公开(公告)号：US20160327351A1

公开(公告)日：2016-11-10

申请号：US15213421

申请日：2016-07-19

Applicant: Acer Incorporated

Inventor： Cheng-Wen Hsieh ,  Wen-Neng Liao

IPC: F28F23/02 ,  F28F9/22 ,  F28D15/00

CPC classification number: F28F23/02 ,  F28D15/00 ,  F28D15/02 ,  F28D2021/0028 ,  F28F1/00 ,  F28F9/22 ,  F28F13/08 ,  F28F2009/226 ,  F28F2250/06 ,  F28F2250/08 ,  F28F2265/00 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20809 ,  H01L2924/00

Abstract: A fluid heat exchange apparatus including a casing, and a heat-dissipating device is provided. The casing includes a chamber, an inlet, and an outlet. The chamber includes a first channel including a first entrance and a first exit and a second channel including a second entrance and a second exit. The cross-sectional area of the first channel decreases from the first entrance to the first exit and the cross-sectional area of the second channel decreases from the second entrance to the second exit. The heat-dissipating device is located between the first exit and the outlet. A first fluid flows from the inlet and flows through the first channel and the heat-dissipating device and then flows to the outlet. Part of the first fluid flowing through the heat-dissipating device absorbs heat and forms bubbles moving to the second channel and then forms a second fluid converging into the first channel.

Abstract translation: 提供一种包括壳体和散热装置的流体热交换装置。 壳体包括腔室，入口和出口。 腔室包括包括第一入口和第一出口的第一通道和包括第二入口和第二出口的第二通道。 第一通道的横截面积从第一入口到第一出口减小，第二通道的横截面积从第二入口减小到第二出口。 散热装置位于第一出口和出口之间。 第一流体从入口流出并流过第一通道和散热装置，然后流到出口。 流过散热装置的第一流体的一部分吸收热量并且形成移动到第二通道的气泡，然后形成会聚到第一通道中的第二流体。

公开(公告)号：US20160309619A1

公开(公告)日：2016-10-20

申请号：US14689157

申请日：2015-04-17

Applicant: COOLER MASTER CO., LTD.

Inventor： SHUI-FA TSAI ,  SHIH-YI CHANG

IPC: H05K7/20 ,  B23P15/26

CPC classification number: B23P15/26 ,  F28D15/0233 ,  F28D15/046 ,  F28D2021/0029 ,  F28F3/048 ,  F28F3/12 ,  F28F2255/16 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/3736 ,  H01L23/473

Abstract: A liquid cooling heat dissipation structure includes a heat conduction module, a heat dissipation module, and a liquid supply module. The heat conduction module includes a first heat-conducting substrate contacting at least one heat-generating source and a second heat-conducting substrate disposed on the first heat-conducting substrate. The heat dissipation module is disposed on the heat conduction module. The liquid supply module is detachably disposed on the heat conduction module to cover the heat dissipation module. The liquid supply module includes an external cover body and a radial-flow centrifugal impeller detachably disposed on the external cover body. The heat conductivity coefficient and the temperature uniformity of the heat conduction module is larger than the heat conductivity coefficient and the temperature uniformity of the heat dissipation module, and the heat-dissipating area of the heat dissipation module is larger than the heat-dissipating area of the heat conduction module.

Abstract translation: 液体冷却散热结构包括导热模块，散热模块和液体供应模块。 热传导模块包括与至少一个发热源和设置在第一导热基板上的第二导热基板接触的第一导热基板。 散热模块设置在热传导模块上。 液体供应模块可拆卸地设置在热传导模块上以覆盖散热模块。 液体供应模块包括可拆卸地设置在外盖体上的外盖体和径向离心式叶轮。 热传导模块的导热系数和温度均匀性大于散热模块的导热系数和温度均匀性，散热模块的散热面积大于散热模块的散热面积 热传导模块。

公开(公告)号：US20160295739A1

公开(公告)日：2016-10-06

申请号：US15082761

申请日：2016-03-28

Applicant: FUJIKURA LTD.

Inventor： Mohammad Shahed AHAMED ,  Yuji SAITO

IPC: H05K7/20 ,  F28F21/08 ,  F28F3/08 ,  F28D15/02 ,  F28D15/04

CPC classification number: F28F21/085 ,  F28D15/0233 ,  F28D15/0275 ,  F28D15/046 ,  F28F21/084 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/427

Abstract: A heat spreading module for a portable electronic device includes a metal plate to which a heat generation body contacts, a first heat pipe that is attached along the metal plate, transfers heat of a heating region of the metal plate, to which the heat generation body contacts, to a region that is away from the heating region of the metal plate, comprises a first end portion and a second end portion, has a predetermined length, and a portion of the first end portion is arranged in the heating region, and a second heat pipe that is arranged away from the heating region and is longer in length than the first heat pipe.

Abstract translation: 一种用于便携式电子设备的散热模块包括发热体接触的金属板，沿金属板附着的第一热管，传递金属板的加热区域的热量，发热体 接触到远离金属板的加热区域的区域包括第一端部和第二端部，具有预定长度，并且第一端部的一部分布置在加热区域中，并且 第二热管远离加热区域设置并且比第一热管长。

公开(公告)号：US20160286693A1

公开(公告)日：2016-09-29

申请号：US15179257

申请日：2016-06-10

Applicant: Iceotope Limited

Inventor： Daniel CHESTER ,  Peter HOPTON ,  Jason BENT ,  Keith DEAKIN

IPC: H05K7/20

CPC classification number: H05K7/20281 ,  B65B7/00 ,  B65B63/08 ,  F25D23/12 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/473 ,  H05K7/20 ,  H05K7/20218 ,  H05K7/20236 ,  H05K7/20263 ,  H05K7/2039 ,  H05K7/20509 ,  H05K7/20763 ,  H05K7/20772 ,  H05K7/20781 ,  H05K13/00 ,  Y10T29/49002 ,  Y10T29/4935

Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.

公开(公告)号：US20160281704A1

公开(公告)日：2016-09-29

申请号：US14777510

申请日：2014-03-14

Applicant: COOLIT SYSTEMS, INC.

Inventor： Geoff Sean Lyon ,  Mike Holden

IPC: F04B49/06 ,  G06F1/20 ,  G05B17/02

CPC classification number: F04B49/065 ,  G01F1/103 ,  G01M3/165 ,  G01M3/18 ,  G01M3/2807 ,  G05B17/02 ,  G06F1/20 ,  G06F2200/201

Abstract: An observed operational state can include an operational state of one or more system devices. A sensor can emit, in response to a detected observable condition reflective of a given operational state, a simulated signal reflective of a different operational state as a proxy for the detected condition. A controller receiving such a proxy signal can, at least partially responsively to the proxy signal, issue a command corresponding to the given operational state. For example, a leak detector can emit in response to a detected leak, or a flow-rate sensor can emit in response to a detected flow-rate of a liquid, a simulated fan-speed tachometer signal representative of a selected fan speed. At least partially in response to observing a simulated tachometer signal, a controller can issue a system command corresponding to an underlying system condition for which the simulated tachometer signal is a proxy.

Abstract translation: 观察到的操作状态可以包括一个或多个系统设备的操作状态。 传感器可以响应于反映给定操作状态的检测到的可观察条件而发射反映作为检测条件的代理的不同操作状态的模拟信号。 接收这种代理信号的控制器可以至少部分地响应于代理信号发出对应于给定操作状态的命令。 例如，泄漏检测器可以响应于检测到的泄漏而发射，或者流量传感器可以响应于检测到的液体流率而发射，代表所选择的风扇速度的模拟风扇转速计信号。 至少部分地响应于观察模拟转速计信号，控制器可以发出对应于模拟转速计信号是代理的基础系统条件的系统命令。

公开(公告)号：US09441640B2

公开(公告)日：2016-09-13

申请号：US13963302

申请日：2013-08-09

Applicant: ZALMAN TECH CO., LTD.

Inventor： Sang Woong Park ,  Hak Bong Lee ,  Hyun Woo Lee

IPC: F04D29/58 ,  F04D13/06

CPC classification number: F04D29/586 ,  F04D13/0606 ,  G06F2200/201

Abstract: A pump for a water cooler is positioned inside or outside an electronic device having heating parts in order to cool heat generated by the heating parts via a circulating refrigerant.

Abstract translation: 用于水冷却器的泵位于具有加热部件的电子设备的内部或外部，以便通过循环制冷剂冷却由加热部件产生的热量。