公开(公告)号：US20230199410A1

公开(公告)日：2023-06-22

申请号：US17833915

申请日：2022-06-07

Applicant: AAC Kaitai Technologies (Wuhan) CO., LTD

Inventor： Kaijie Wang

IPC: H04R19/04 ,  H04R1/04

CPC classification number: H04R19/04 ,  H04R1/04 ,  H04R2201/003

Abstract: A MEMS microphone includes a substrate, a connecting base, and a capacitance system. Connecting ports are formed on the connecting base, where the at least two connecting ports are recessed outwards from an inner wall of the connecting base and are disposed at intervals. The capacitance system includes a system main body and connecting pins. A system main body of the capacitance system is fixed to the connecting ports of the connecting base through the connecting pins. In addition, the slit is formed between the outer side of the system main body and the inner wall of the connecting base, the capacitance system is stably and reliably assembled in the connecting base through a connecting structure where the connecting pins are matched with the connecting ports, and compliance of vibration of the system main body of the capacitance system is increased through matching the connecting pins with slit.

公开(公告)号：US20230199408A1

公开(公告)日：2023-06-22

申请号：US17739202

申请日：2022-05-09

Applicant: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.

Inventor： Zhengyu Shi ,  Linlin Wang ,  Rui Zhang

IPC: H04R19/04 ,  H04R7/04 ,  H04R7/18 ,  B81B3/00

CPC classification number: H04R19/04 ,  H04R7/04 ,  H04R7/18 ,  B81B3/0045 ,  H04R2201/003 ,  B81B2201/0257

Abstract: The present invention discloses a MEMS chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate; the protruding portion comprises an annular first protruding portion and an annular second protruding portion surrounding the first protruding portion. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.

公开(公告)号：US11683624B1

公开(公告)日：2023-06-20

申请号：US17318991

申请日：2021-05-12

Applicant: Qualcomm Technologies Inc.

Inventor： Julian Aschieri

IPC: H04R3/00 ,  H04R1/00 ,  H04R29/00 ,  H03M7/00 ,  H03M3/00 ,  H04R1/08 ,  H03F3/183 ,  H03K5/24 ,  H01L41/113 ,  H03M7/32

CPC classification number: H04R1/08 ,  H01L41/1132 ,  H03F3/183 ,  H03K5/24 ,  H03M3/39 ,  H03M7/3004 ,  H04R3/00 ,  H04R29/00 ,  H03F2200/03 ,  H04R2201/003

Abstract: A transducer system has 1) a MEMS transducer configured to produce an analog output signal in response to an incident acoustic signal, and 2) a modulator apparatus. The modulator apparatus includes an analog modulator configured to receive the analog output signal and produce a first digital signal as a function of the analog output signal. In addition, the modulator apparatus also has a digital converter configured to receive the first digital signal and produce a second digital signal as a function of the first digital signal. The analog modulator has an analog order while, in a corresponding manner, the digital converter has a digital order. Preferably, the digital order is higher than the analog order.

公开(公告)号：US20230188904A1

公开(公告)日：2023-06-15

申请号：US18063374

申请日：2022-12-08

Applicant: INVENSENSE, INC.

Inventor： Jeremy Parker

IPC: H04R19/04

CPC classification number: H04R19/04 ,  H04R2201/003

Abstract: The present invention relates to a microelectromechanical system (MEMS) microphone array capsule. In one embodiment, a MEMS microphone includes a MEMS microphone die; an acoustic sensor array formed into the MEMS microphone die, the acoustic sensor array comprising a plurality of MEMS acoustic sensor elements, wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies; and an interconnect that electrically couples the acoustic sensor array to an impedance converter circuit.

公开(公告)号：US11659309B2

公开(公告)日：2023-05-23

申请号：US16343467

申请日：2017-11-10

Applicant: Sony Group Corporation

Inventor： Toshihiko Masuda ,  Hiroshi Yoshioka ,  Hideyuki Taguchi ,  Hiroki Matsuoka ,  Shinpei Kondo

IPC: H04R1/02 ,  H04M1/03 ,  H04R7/04 ,  H04R9/02 ,  H04R9/06 ,  G09F9/00

CPC classification number: H04R1/028 ,  G09F9/00 ,  H04M1/035 ,  H04R7/04 ,  H04R7/045 ,  H04R9/022 ,  H04R9/025 ,  H04R9/066 ,  H04R2201/003 ,  H04R2499/15

Abstract: A display apparatus according to an embodiment of the present disclosure includes a thin plate-shaped display cell that displays image and a plurality of exciters disposed on a back surface of the display cell and causing the display cell to vibrate. The plurality of exciters is such configured that the plurality of exciters is regarded as one exciter when the plurality of exciters generates vibration in the display cell.

公开(公告)号：US11649161B2

公开(公告)日：2023-05-16

申请号：US17385084

申请日：2021-07-26

Applicant: Knowles Electronics, LLC

Inventor： Vahid Naderyan ,  Mohammad Mohammadi ,  Xin Song

IPC: H04R7/00 ,  B81B3/00 ,  H04R7/04

CPC classification number: B81B3/007 ,  H04R7/04 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0361 ,  B81B2203/04 ,  B81B2207/012 ,  B81B2207/056 ,  H04R2201/003

Abstract: A microelectromechanical systems (MEMS) diaphragm assembly comprises a first diaphragm and a second diaphragm. A plurality of pillars connects the first and second diaphragms, wherein the plurality of pillars has a higher distribution density at a geometric center of the MEMS diaphragm assembly than at an outer periphery thereof.

公开(公告)号：US20190245133A1

公开(公告)日：2019-08-08

申请号：US16385621

申请日：2019-04-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Keiichi Umeda ,  Toshio Imanishi ,  Ville Kaajakari

IPC: H01L41/113 ,  H04R17/02 ,  H01L41/047 ,  H04R19/01

CPC classification number: H01L41/1138 ,  H01L41/0478 ,  H01L41/187 ,  H04R17/02 ,  H04R17/025 ,  H04R19/016 ,  H04R2201/003

Abstract: A piezoelectric device that includes: a diaphragm; a supporting part configured to support at least a portion of an end of the diaphragm; a piezoelectric film disposed along a portion supported by the supporting part on the diaphragm, a width of the film along the supported portion being narrower than a width of the portion; a lower electrode disposed at a face of the piezoelectric film on a diaphragm side; and an upper electrode disposed on a face of the piezoelectric film on an opposite side to the diaphragm.

公开(公告)号：US20190239000A1

公开(公告)日：2019-08-01

申请号：US16256816

申请日：2019-01-24

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Giorgio ALLEGATO ,  Federico VERCESI ,  Laura Maria CASTOLDI ,  Laura OGGIONI ,  Matteo PERLETTI

IPC: H04R19/04 ,  B81C1/00

CPC classification number: H04R19/04 ,  B81C1/00309 ,  B81C2201/0133 ,  H04R1/021 ,  H04R1/086 ,  H04R19/005 ,  H04R31/00 ,  H04R2201/003

Abstract: A method for manufacturing a semiconductor die, comprising the steps of: providing a MEMS device having a structural body, provided with a cavity, and a membrane structure suspended over the cavity; coupling the structural body to a filtering module via direct bonding or fusion bonding so that a first portion of the filtering module extends over the cavity and a second portion of the filtering module extends seamlessly as a prolongation of the structural body; and etching selective portions of the filtering module in an area corresponding to the first portion, to form filtering openings fluidically coupled to the cavity. The semiconductor die is, for example, a microphone.

公开(公告)号：US20190238998A1

公开(公告)日：2019-08-01

申请号：US16236400

申请日：2018-12-29

Applicant: AAC Acoustic Technologies (Shenzhen) Co., Ltd.

Inventor： Jinyu Zhang

IPC: H04R19/04 ,  H04R1/04 ,  H04R7/04 ,  B81B3/00

CPC classification number: H04R19/04 ,  B81B3/0072 ,  B81B2201/0257 ,  B81B2203/0127 ,  H04R1/04 ,  H04R7/04 ,  H04R2201/003

Abstract: A microphone is provided, including a base having a chamber; and a capacitor system fixed to the base. The capacitor system includes a backplate fixed to the base and a diaphragm located in the chamber. The backplate and the diaphragm form a capacitor structure. The diaphragm is fixed to the backplate and partitions the chamber into a front chamber and a back chamber. The backplate is provided with a sound receiving hole in communication with the front chamber. The base or the backplate is provided with a vent hole for communicating the back chamber with the outside. The microphone provided by the present disclosure has the advantages of high reliability.

公开(公告)号：US10343898B1

公开(公告)日：2019-07-09

申请号：US16025074

申请日：2018-07-02

Applicant: Fortemedia, Inc.

Inventor： Jien-Ming Chen ,  Nai-Hao Kuo ,  Wen-Shan Lin ,  Hsin-Li Lee

IPC: H04R9/08 ,  B81B7/02 ,  H04R19/04 ,  H04R19/00 ,  H04R7/08

CPC classification number: B81B7/02 ,  B81B2201/0257 ,  B81B2203/0127 ,  H04R7/08 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

Abstract: A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate, a diaphragm, a first insulating protrusion and a plurality of second insulating protrusions. The backplate is disposed on a side of the substrate. The diaphragm is disposed between the substrate and the backplate and is movable relative to the backplate. The first insulating protrusion and the second insulating protrusions are formed on the side of the backplate facing the diaphragm. The first insulating protrusion is connected to and affixed to the diaphragm permanently, and an air gap is formed between the diaphragm and each of the second insulating protrusions.