公开(公告)号：US4403107A

公开(公告)日：1983-09-06

申请号：US216573

申请日：1980-12-15

Applicant: Norman E. Hoffman

Inventor： Norman E. Hoffman

IPC: H05K1/03 ,  H05K3/04 ,  H05K3/10 ,  H05K1/02 ,  B05D1/12 ,  B32B3/12 ,  B32B31/00

CPC classification number: H05K1/0373 ,  H05K3/041 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2201/09045 ,  H05K2203/0108 ,  H05K2203/1545 ,  H05K3/107 ,  Y10S428/901 ,  Y10T156/1052 ,  Y10T29/4916 ,  Y10T428/24496 ,  Y10T428/249971 ,  Y10T428/24999

Abstract: A circuit board is fabricated comprising a metal layer laminated to an underlying dielectric substrate. Portions of the metal layer are separated and recessed into stable indented portions of the substrate by a stamping die, roller, or the like. The substrate is composed of a cellular material, for example, polysulfone impregnated with hollow glass spheres, whereby the indented portions of the substrate are compacted by impression of the die profile to receive separated portions of the metal layer therein.

Abstract translation: 制造电路板，其包括层压到下面的电介质基板上的金属层。 通过冲压模具，辊等将金属层的一部分分离并凹入到基板的稳定的凹入部分中。 衬底由细胞材料，例如浸渍有中空玻璃球的聚砜组成，由此通过模具轮廓的压印来压缩衬底的凹陷部分，以在其中接收金属层的分离部分。