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    Methods for assembling electronic devices with adhesive
    2.
    发明授权
    Methods for assembling electronic devices with adhesive 有权
    用粘合剂组装电子设备的方法

    公开(公告)号：US09565773B2

    公开(公告)日：2017-02-07

    申请号：US14231454

    申请日：2014-03-31

    Applicant: Apple Inc.

    Inventor： John J. Baker

    IPC: B05D3/00 ,  H05K3/28 ,  H01L21/56 ,  C09J5/00 ,  B05D3/02 ,  B05D3/06 ,  B05D3/10 ,  H05K1/02

    CPC classification number: H05K3/284 ,  B05D3/0254 ,  B05D3/067 ,  B05D3/108 ,  C09J5/00 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2205/31 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2924/181 ,  H05K1/0284 ,  H05K3/288 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2203/0126 ,  H05K2203/0285 ,  H05K2203/0292 ,  H05K2203/0783 ,  H05K2203/092 ,  H05K2203/102 ,  H05K2203/107 ,  H05K2203/1163 ,  H05K2203/1194 ,  H01L2924/00012

    Abstract: An electronic device may have housing structures, electrical components, and other electronic device structures. Adhesive may be used to join electronic device structures. Adhesive may be dispensed as liquid adhesive and cured to form adhesive joints. Adhesive joints may be debonded. Chain reactions may be initiated by applying a localized initiator such as a chemical or localized energy to the adhesive. Once initiated, the chain reaction may spread throughout the adhesive to cure the adhesive, to globally change adhesive viscosity, or to weaken the adhesive to facilitate debonding. Local changes to adhesive may also be made such as local increases and decreases to adhesive viscosity. Chain reaction curing may be used to cure adhesive or debond adhesive that is hidden from view within gaps in the electronic device structures. Viscosity changes may be used to control where adhesive flows.

    Abstract translation: 电子设备可以具有壳体结构，电气部件和其他电子设备结构。 粘合剂可用于连接电子器件结构。 粘合剂可以作为液体粘合剂分配并固化以形成粘合剂接合部。 粘合接头可能脱粘。 可以通过将局部引发剂例如化学或局部化的能量施加到粘合剂来引发连锁反应。 一旦开始，连锁反应可能会蔓延到整个粘合剂中以固化粘合剂，从而全局地改变粘合剂粘度，或者削弱粘合剂以促进剥离。 还可以对粘合剂进行局部变化，例如局部增加和降低粘合剂粘度。 链反应固化可用于固化在电子设备结构的间隙内隐藏的粘合剂或脱粘合剂。 粘度变化可用于控制粘合剂流动的位置。

    Method for producing laminate board containing uniformly distributed filler particles
    7.
    发明授权
    Method for producing laminate board containing uniformly distributed filler particles 失效
    含有均匀分布的填料颗粒的层压板的制造方法

    公开(公告)号：US4661301A

    公开(公告)日：1987-04-28

    申请号：US765476

    申请日：1985-08-14

    Applicant: Reisuke Okada ,  Hisami Fujino

    Inventor： Reisuke Okada ,  Hisami Fujino

    IPC: B32B27/12 ,  H05K1/03 ,  B29C47/34

    CPC classification number: H05K1/0373 ,  B32B27/12 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0254 ,  Y10S264/06 ,  Y10T29/49126 ,  Y10T29/49158

    Abstract: A process for continuously molding a plate for an electrical printed circuit board wherein a resin containing uniformly distributed hollow microspheres having a specific gravity different from that of the resin is extruded into a vertically disposed moving double belt press maintained at a temperature which allows the extruded plate to harden almost completely. The plate exists the vertically disposed press maintaining a flexibility sufficient to be passed around a roller into a horizonal position where subsequent processing steps may be applied, such as lamination of reinforcing fiber and coating with a conductive material.

    Abstract translation: 一种用于连续模制用于电气印刷电路板的板的方法，其中将具有不同于树脂的比重的均匀分布的中空微球的树脂挤出成垂直布置的移动双带压机，保持在允许挤出板 几乎完全硬化。 该板存在垂直设置的压力机，保持足够的柔性以使辊子绕过水平位置，其中可以应用后续的加工步骤，例如增强纤维的层压和导电材料的涂层。

    WIRING SUBSTRATE
    8.
    发明公开
    WIRING SUBSTRATE 审中-公开

    公开(公告)号：US20240206061A1

    公开(公告)日：2024-06-20

    申请号：US18537877

    申请日：2023-12-13

    Applicant: IBIDEN CO., LTD.

    Inventor： Ryo ANDO ,  Nobuhisa KURODA ,  Shogo FUKUI ,  Kosei ICHIKAWA ,  Makoto KATO

    IPC: H05K1/03 ,  H05K1/02

    CPC classification number: H05K1/0373 ,  H05K1/0298 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2201/0269

    Abstract: A wiring substrate includes an insulating layer including a first layer and a second layer, and a conductor layer including a metal film formed on a surface of the second layer of the insulating layer such that the conductor layer includes a conductor pattern. The first layer includes resin and first inorganic particles, the second layer includes resin and second inorganic particles at the content rate that is lower than the content rate of the first inorganic particles in the first layer, and the thickness of the first layer is 90% or more of the thickness of the insulating layer. The second layer of the insulating layer includes a composite layer having the thickness in the range of 0.1 to 0.3 μm, and the composite layer includes part of the metal film in the conductor layer formed in gaps between the second inorganic particles and resin in the second layer.

    Reducing dielectric loss in solder masks
    9.
    发明授权
    Reducing dielectric loss in solder masks 有权
    降低焊料掩模中的介电损耗

    公开(公告)号：US09526180B2

    公开(公告)日：2016-12-20

    申请号：US13995667

    申请日：2011-12-09

    Applicant: Dennis J. Miller

    Inventor： Dennis J. Miller

    IPC: H05K1/00 ,  H05K3/00 ,  H05K3/28 ,  B01F3/12

    CPC classification number: H05K3/0076 ,  B01F3/12 ,  H05K3/28 ,  H05K3/285 ,  H05K2201/0254

    Abstract: A circuit board may include a substrate, an interconnected structure associated with the substrate, and a solder mask associated with the interconnected structure and the substrate. The solder mask may be based on a mixture that includes epoxy and a powder. The powder may be hollow glass micro-balloons.

    Abstract translation: 电路板可以包括衬底，与衬底相关联的互连结构，以及与互连结构和衬底相关联的焊接掩模。 焊接掩模可以基于包括环氧树脂和粉末的混合物。 粉末可以是中空玻璃微球。

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