公开(公告)号：US20070102663A1

公开(公告)日：2007-05-10

申请号：US11432086

申请日：2006-05-11

Applicant: T. Xiao ,  Xinqing Ma ,  Heng Zhang ,  Junfeng Zhou

Inventor： T. Xiao ,  Xinqing Ma ,  Heng Zhang ,  Junfeng Zhou

IPC: G11B11/105 ,  B32B5/16 ,  B32B15/00 ,  H01F1/00

CPC classification number: H05K1/165 ,  B82Y25/00 ,  H01F1/0027 ,  H01F1/0054 ,  H01F1/0063 ,  H01F1/37 ,  H01F17/0006 ,  H01F41/16 ,  H02M3/00 ,  H05K1/0233 ,  H05K2201/0257 ,  H05K2201/086 ,  Y10T428/26 ,  Y10T428/2982 ,  Y10T428/32

Abstract: Disclosed herein is a magnetic paste that generally includes a magnetic component and a liquid organic component. The magnetic component includes a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, or both. Magnetic devices can be formed from the magnetic paste. Methods of making and using the magnetic paste are also described.

Abstract translation: 本文公开了一种通常包括磁性组分和液体有机组分的磁性浆料。 磁性组件包括多个离散的纳米颗粒，多个含纳米颗粒的组件或两者。 磁性装置可以由磁性浆料形成。 还描述了制造和使用磁性糊剂的方法。

公开(公告)号：US20070099345A1

公开(公告)日：2007-05-03

申请号：US11586740

申请日：2006-10-26

Applicant: Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Holger Woerner

Inventor： Michael Bauer ,  Edward Fuergut ,  Simon Jerebic ,  Holger Woerner

IPC: H01L21/00 ,  H01L23/24 ,  H01L23/48 ,  H01L23/22 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L21/486 ,  H01L23/49827 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/92 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H05K1/0373 ,  H05K3/4038 ,  H05K3/4069 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2203/105 ,  H01L2224/96 ,  H01L2224/82

Abstract: A method is described for producing through-contacts through a panel-shaped composite body including semiconductor chips and a plastic mass filled with conductive particles. The panel-shaped composite body is introduced between two high-voltage point electrodes. The point electrodes are oriented at positions at which through-contacts are to be introduced through the plastic mass. A high voltage is applied to the point electrodes thereby, forming the through-contacts through the plastic mass.

Abstract translation: 描述了一种用于通过包括半导体芯片和填充有导电颗粒的塑料块的面板形复合体制造穿孔的方法。 板状复合体被引入两个高压点电极之间。 点电极被定向在穿过接触件通过塑料块引入的位置。 因此，高电压施加到点电极，从而通过塑料块形成通孔。

公开(公告)号：US20060292721A1

公开(公告)日：2006-12-28

申请号：US11315153

申请日：2005-12-23

Applicant: Geo Chae ,  Mi Park

Inventor： Geo Chae ,  Mi Park

IPC: H01L21/00 ,  H01L21/4763

CPC classification number: H05K3/101 ,  H01L21/288 ,  H01L21/76838 ,  H01L27/1292 ,  H05K3/04 ,  H05K3/102 ,  H05K2201/0257 ,  H05K2201/0272 ,  H05K2203/0108 ,  Y10S977/777

Abstract: A fabricating method of a flat panel display device can reduce manufacturing costs of the flat panel display device. A fabricating method of a flat panel display device includes providing a conductive nanopowder thin film material having a first conductive nanopowder and a second conductive nanopowder, spreading the conductive nanopowder thin film material over a substrate, forming a conductive thin film pattern by patterning the conductive nanopowder thin film material, and forming a conductive thin film by baking the conductive thin film pattern, wherein the first conductive nanopowder is located in a middle of the conductive thin film and the second conductive nanopowder is located in an outer part of the conductive thin film.

Abstract translation: 平板显示装置的制造方法可以降低平板显示装置的制造成本。 平板显示装置的制造方法包括提供具有第一导电纳米粉末和第二导电纳米粉末的导电纳米粉末薄膜材料，将导电纳米粉末薄膜材料铺展在基板上，通过图案化导电纳米粉末形成导电薄膜图案 薄膜材料，并通过烘烤导电薄膜图案形成导电薄膜，其中第一导电纳米粉末位于导电薄膜的中间，第二导电纳米粉末位于导电薄膜的外部。

公开(公告)号：US20060267218A1

公开(公告)日：2006-11-30

申请号：US10996038

申请日：2004-11-24

Applicant: Hiroshi Hozoji ,  Toshiaki Morita ,  Hiroshi Sasaki

Inventor： Hiroshi Hozoji ,  Toshiaki Morita ,  Hiroshi Sasaki

IPC: H01L23/48

CPC classification number: H05K3/328 ,  H01L23/24 ,  H01L23/66 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/83 ,  H01L25/072 ,  H01L25/16 ,  H01L2223/6644 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/11332 ,  H01L2224/11505 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/27505 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/29344 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/351 ,  H05K1/183 ,  H05K3/102 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/1131 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/2076 ,  H01L2224/83205 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electronic part mounting method, a semiconductor module, and a semiconductor device, which can reduce a mounting area and a device thickness. In an electronic part mounting method for bonding an electrode formed on a substrate and an electrode formed on an electronic part to each other, the method comprises the step of bonding both the electrodes through a metal layer made up of aggregated particles of at least one kind of metal. Then, the metal particles have an average particle size of 1 to 50 nm. Preferably, the metal particles form a metal layer having a thickness of 5 to 100 μm.

Abstract translation: 电子部件安装方法，半导体模块和半导体器件，其可以减小安装面积和器件厚度。 在将形成在基板上的电极和形成在电子部件上的电极彼此接合的电子部件安装方法中，所述方法包括通过由至少一种类型的聚集粒子构成的金属层将两个电极接合的步骤 的金属。 然后，金属粒子的平均粒径为1〜50nm。 优选地，金属颗粒形成厚度为5至100μm的金属层。

公开(公告)号：US20060250781A1

公开(公告)日：2006-11-09

申请号：US10562252

申请日：2004-06-04

Applicant: Michael Bauer ,  Wolfram Eurskens ,  Rudolf Kerter ,  Heinz Pape ,  Peter Strobe ,  Stephan Stoeckl

Inventor： Michael Bauer ,  Wolfram Eurskens ,  Rudolf Kerter ,  Heinz Pape ,  Peter Strobe ,  Stephan Stoeckl

IPC: H05K1/09

CPC classification number: H05K1/184 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0284 ,  H05K3/105 ,  H05K3/46 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/0919 ,  H05K2201/10446 ,  H05K2203/102 ,  H05K2203/108 ,  H05K2203/1131 ,  H05K2203/1136

Abstract: An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.

公开(公告)号：US07126215B2

公开(公告)日：2006-10-24

申请号：US10815291

申请日：2004-03-30

Applicant: Paul A. Koning ,  James Christopher Matayabas, Jr.

Inventor： Paul A. Koning ,  James Christopher Matayabas, Jr.

IPC: H01L23/053 ,  H01L23/12 ,  H01L23/14

CPC classification number: H01L23/49894 ,  H01L2224/16 ,  H05K1/0373 ,  H05K3/285 ,  H05K3/4626 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0257

Abstract: This application discloses an apparatus comprising a substrate including a plurality of conducting layers and a nanocomposite inter-layer dielectric (ILD) sandwiched between the conducting layers, wherein the nanocomposite ILD layer comprises a nanocomposite including a polymer having a plurality of nanoclay particles dispersed therein, the nanoclay particles having a high aspect ratio. Also disclosed is an apparatus comprising a substrate having a contact surface and a nanocomposite solder resist layer placed on the contact surface, wherein the solder resist comprises a nanocomposite including a polymer binder having a plurality of nanoclay particles dispersed therein, the nanoclay particles having a high aspect ratio. Further disclosed is a process comprising providing a plurality of conducting layers and sandwiching a nanocomposite inter-layer dielectric (ILD) between the conducting layers, wherein the nanocomposite ILD layer comprises a nanocomposite including a polymer binder having a plurality of nanoclay particles dispersed therein, the nanoclay particles having a high aspect ratio. Other apparatus and process embodiments are also disclosed and claimed.

Abstract translation: 本申请公开了一种装置，包括：衬底，其包括多个导电层和夹在导电层之间的纳米复合层间电介质（ILD），其中所述纳米复合物ILD层包含纳米复合材料，所述纳米复合材料包括其中分散有多个纳米粘土颗粒的聚合物， 纳米粘土颗粒具有高纵横比。 还公开了一种装置，其包括具有接触表面的衬底和放置在接触表面上的纳米复合阻焊层，其中阻焊层包括纳米复合材料，其包括其中分散有多个纳米粘土颗粒的聚合物粘合剂，纳米粘土颗粒具有高的 长宽比。 进一步公开的方法包括提供多个导电层并在导电层之间夹住纳米复合层间电介质（ILD），其中纳米复合材料ILD层包括纳米复合材料，该纳米复合材料包括其中分散有多个纳米粘土颗粒的聚合物粘合剂， 具有高纵横比的纳米粘土颗粒。 还公开并要求保护其他装置和方法实施例。

公开(公告)号：US20060151863A1

公开(公告)日：2006-07-13

申请号：US11031085

申请日：2005-01-10

Applicant: Rabindra Das ,  John Lauffer ,  Kostas Papathomas ,  Mark Poliks

Inventor： Rabindra Das ,  John Lauffer ,  Kostas Papathomas ,  Mark Poliks

IPC: H01L23/02

CPC classification number: H05K1/162 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K3/0023 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/09509 ,  H05K2201/09718 ,  H01L2224/0401

Abstract: A material for use as part of an internal capacitor within a circuitized substrate includes a polymer (e.g., a cycloaliphatic epoxy or phenoxy based) resin and a quantity of nano-powders of ferroelectric ceramic material (e.g., barium titanate) having a particle size substantially in the range of from about 0.01 microns to about 0.90 microns and a surface area for selected ones of said particles within the range of from about 2.0 to about 20 square meters per gram. A circuitized substrate adapted for using such a material and capacitor therein and a method of making such a substrate are also provided. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) are also provided.

公开(公告)号：US20060141259A1

公开(公告)日：2006-06-29

申请号：US11359676

申请日：2006-02-22

Applicant: Jessica Voss-Kehi ,  Kurl Halverson ,  Caroline Ylitalo ,  Matthew Lehmann ,  Steven Botzet

Inventor： Jessica Voss-Kehi ,  Kurl Halverson ,  Caroline Ylitalo ,  Matthew Lehmann ,  Steven Botzet

IPC: B32B27/00

CPC classification number: H05K3/105 ,  H05K3/12 ,  H05K3/125 ,  H05K3/22 ,  H05K2201/0125 ,  H05K2201/0257 ,  H05K2201/0329 ,  H05K2203/013 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/2857 ,  Y10T428/31504 ,  Y10T428/31678 ,  Y10T428/31938

Abstract: Methods of creating fine featured circuits by printing a circuit trace onto polymer shrink films or other biaxially-oriented polymer films are disclosed. The shrink films are heated and shrunk after printing, annealing the circuit trace to form conductive features. Compositions suitable for printing onto the films and articles made using the method and composition are also disclosed.

公开(公告)号：US07025607B1

公开(公告)日：2006-04-11

申请号：US11031074

申请日：2005-01-10

Applicant: Rabindra N. Das ,  John M. Lauffer ,  Voya R. Markovich ,  Mark D. Poliks

Inventor： Rabindra N. Das ,  John M. Lauffer ,  Voya R. Markovich ,  Mark D. Poliks

IPC: H01R4/58

CPC classification number: H01G4/206 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/162 ,  H05K3/0023 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0257 ,  H01L2224/0401

Abstract: A material for use as part of an internal capacitor within a circuitized substrate includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ferroelectric ceramic component, the ferroelectric ceramic component nano-particles having a particle size substantially in the range of between about 0.01 microns and about 0.9 microns and a surface within the range of from about 2.0 to about 20 square meters per gram. A circuitized substrate adapted for using such a material and capacitor therein and a method of making such a substrate are also provided. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) are also provided.

Abstract translation: 用作电路化基板内的内部电容器的一部分的材料包括聚合物树脂和一定数量的纳米粉末，其包括至少一种金属组分和至少一种铁电陶瓷组分的混合物，所述铁电陶瓷组分纳米颗粒具有 基本上在约0.01微米至约0.9微米范围内的粒度和约2.0至约20平方米每克的表面。 还提供了适于在其中使用这种材料和电容器的电路化基板和制造这种基板的方法。 还提供电气组件（基板和至少一个电气部件）和信息处理系统（例如，个人计算机）。

公开(公告)号：US20060072944A1

公开(公告)日：2006-04-06

申请号：US10958007

申请日：2004-10-04

Applicant: Manish Sharma ,  Lung Tran

Inventor： Manish Sharma ,  Lung Tran

IPC: G03G15/16

CPC classification number: H04L45/00 ,  G03G15/10 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  H04L45/24 ,  H04L45/245 ,  H04L45/60 ,  H05K3/1266 ,  H05K3/207 ,  H05K2201/0257 ,  H05K2203/0126 ,  H05K2203/0517 ,  Y02D50/30

Abstract: The invention provides a printed circuit board (PCB) printing system. In a particular embodiment, the system includes a liquid electrophotographic printing device. At least one supplier of electrically conductive ink supplying electrically conductive ink to the electrophotographic printing device is also provided. In addition, at least one supplier of dielectric ink supplying dielectric ink to the electrophotographic printing device is also provided. The liquid electrophotographic printing device is operable to apply the electrically conductive ink and the dielectric ink to a provided substrate such that substantially immiscible boundary delineation occurs at any points of contact between the applied electrically conducive ink and the applied dielectric ink. An appropriate method of use for the rendering of a printed circuit board is also provided.