公开(公告)号：US09933818B2

公开(公告)日：2018-04-03

申请号：US15124710

申请日：2014-07-14

Applicant: Paulino Vacas Jacques

Inventor： Paulino Vacas Jacques

IPC: G06F1/16 ,  A41B1/08 ,  A41D1/00 ,  A61B5/00 ,  G06F3/01 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: G06F1/163 ,  A41B1/08 ,  A41D1/005 ,  A61B5/6805 ,  G06F3/015 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/115 ,  H05K1/118 ,  H05K1/18 ,  H05K2201/0281 ,  H05K2201/10053

Abstract: The present invention concerns a textile motherboard (TMB) employable in garments, tablecloths, gowns, etc. that incorporates at least a central processing unit (CPU) or a peripheral or a combination thereof, with the intention of monitoring, informing, or controlling parameters of interest. The garments may be utilized or worn by users (human or not). The textile of the garment is utilized as substrate to conform the TMB. The TMB may exhibit multiple-layer structures and VIAs (Vertical Interconnect Accesses). The routings of the TMB are conformed of textile material capable of transmitting signals between CPU and a means to register information or between the CPU and the combination of peripherals. Layers, routings, and VIAs may be incorporated into the TMB by using known textile manipulation techniques such as: knitting, weaving, stamping, perforating, or they may also be printed on the textiles. Every component is modular and interchangeable and connects to the TMB utilizing textile connectors such as snaps, hooks, or similar elements. TMB, CPU, and peripherals are washable. CPU and peripherals may be mounted on textile boards, as well as on rigid or flexible PCBs (printed circuit boards), utilizing discrete electronic and photonic elements. The CPU includes a microcontroller, a microprocessor, or a comparable element. The peripherals include photonic transducers or electronic transducers or combinations thereof such as: capacitive, pulse, humidity, temperature, accelerometers, and gyroscopes sensors. The peripherals also include screens, modules for serial communications, radiofrequency (including Zigbee technology, Bluetooth, etc.) and Wi-Fi, as well as similar elements.

公开(公告)号：US20180033520A1

公开(公告)日：2018-02-01

申请号：US15551431

申请日：2016-02-16

Applicant: National Institute of Advanced Industrial Science and Technology

Inventor： Manabu Yoshida ,  Sei Uemura ,  Taiki Nobeshima

IPC: H01B7/06 ,  H01B13/008

CPC classification number: H01B7/06 ,  H01B7/08 ,  H01B13/00 ,  H01B13/008 ,  H05K1/02 ,  H05K1/0283 ,  H05K1/09 ,  H05K1/18 ,  H05K3/10 ,  H05K2201/0133 ,  H05K2201/0281 ,  H05K2201/0314 ,  H05K2201/09263 ,  H05K2203/1545

Abstract: Conductor wires 2a and 2b are sandwiched between two elastomer sheets 1a and 1b whose adhesive layers face each other, and both adhere. When the elastomer sheets 1a and 1b are their natural lengths without being subjected to any tension, the conducting wires 2a and 2b are wound around into spiral shapes and contract. When tension is applied to the elastomer sheets 1a and 1b, the number of spiral turns of the conductor wires 2a and 2b decreases according to its extension and the conductor wires 2a and 2b extend. The conductor wires 2a and 2b are electrically connected to and fixed to a circuit element at both ends of the elastomer sheets 1a and 1b. As a result, it is possible to mass-produce, at low costs, highly stretchable wirings in which a change in resistance values due to extension thereof is small.

公开(公告)号：US09253873B2

公开(公告)日：2016-02-02

申请号：US13827248

申请日：2013-03-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Wook Park ,  Dong Hwan Lee ,  Jin Gu Kim ,  Chang Bae Lee ,  Christian Romero

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0216 ,  H05K3/4602 ,  H05K3/4673 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0723 ,  H05K2201/09581 ,  Y10T29/49165

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a core layer having a first circuit wiring layer formed on one surface or both surfaces thereof; an insulating layer laminated, as at least one layer, on one surface or both surfaces of the core layer; and a second circuit wiring layer formed on one surface of the insulating layer, wherein a conductive core is included in upper and lower insulating layers contacting the second circuit wiring layer requiring an electromagnetic wave shielding, or the conductive core is included in the insulating layer or the core layer contacting the first circuit wiring layer requiring the electromagnetic wave shielding.

Abstract translation: 这里公开了一种印刷电路板及其制造方法。 印刷电路板包括：具有形成在其一个表面或两个表面上的第一电路布线层的芯层; 在芯层的一个表面或两个表面上层压作为至少一个层的绝缘层; 以及形成在所述绝缘层的一个表面上的第二电路布线层，其中在与需要电磁波屏蔽的第二电路布线层接触的上绝缘层和下绝缘层中包括导电芯，或者导电芯包括在绝缘层中或 芯层与需要电磁波屏蔽的第一电路布线层接触。

公开(公告)号：US08998622B2

公开(公告)日：2015-04-07

申请号：US13601884

申请日：2012-08-31

Applicant: Taylor H. Gilbert ,  Sean S. Corbin

Inventor： Taylor H. Gilbert ,  Sean S. Corbin

IPC: H01R12/00 ,  H05K1/00 ,  H01R12/52 ,  H01R4/04 ,  H01R43/26 ,  H05K3/36 ,  H01R12/62

CPC classification number: H01R12/52 ,  H01R4/04 ,  H01R12/00 ,  H01R12/62 ,  H01R43/26 ,  H05K1/00 ,  H05K3/361 ,  H05K2201/0281 ,  H05K2201/0355 ,  H05K2201/1028 ,  H05K2201/1034

Abstract: Electronic devices may be provided with electronic components and electrical connectors coupled between the electronic components. A connector may be formed in a small gap between the electronic components. The connector may be a thin sheet of flexible conductive material with a conductive adhesive on one surface. The connector may be installed between the components using an applicator that is attached to the connector. The applicator may be a pull-tab liner having a first surface that is tacky and a second opposing surface that is non-stick. The applicator may have an extended portion that can be held by a technician while installing the connector. The connector may be installed by inserting the connector and applicator between the components, pinching the components against the connector and applicator, and removing the applicator by pulling the extended portion to peel the applicator from the connector.

Abstract translation: 电子设备可以设置有电子部件和耦合在电子部件之间的电连接器。 连接器可以形成在电子部件之间的小间隙中。 连接器可以是在一个表面上具有导电粘合剂的柔性导电材料薄片。 可以使用附接到连接器的施加器将连接器安装在组件之间。 施用器可以是具有粘性的第一表面和不粘的第二相对表面的拉片衬里。 涂抹器可以具有在安装连接器的同时由技术人员保持的延伸部分。 连接器可以通过将连接器和施加器插入到部件之间，将部件夹持在连接器和施加器上，并且通过拉动延伸部分从连接器剥离施加器来移除施加器来安装。

公开(公告)号：US08823395B2

公开(公告)日：2014-09-02

申请号：US13119451

申请日：2009-09-10

Applicant: Rabin Bhattacharya

Inventor： Rabin Bhattacharya

IPC: G01R27/26

CPC classification number: H05K1/038 ,  D03D1/0088 ,  D10B2401/16 ,  H05K1/0289 ,  H05K1/162 ,  H05K1/189 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10106 ,  Y10T442/3976

Abstract: The invention relates to a method for determining a functional area of an electronic textile (100;200). The electronic textile comprises a textile substrate having a first plurality of conductors (108a-b;202a-d), a second plurality of conductors (104a-c;204a-d), and a plurality of capacitors (112;212a-p), each capacitor comprising a conductor from the first plurality of conductors (108a-b;202a-d) and a conductor from the second plurality of conductors (104a-c;204a-d), separated by a dielectric (103a), the capacitors (112;212a-p) being distributed across substantially an entire surface of the electronic textile, wherein each capacitor (112;212a-p) has a capacitance of at least 10 pF.The method comprises, for each of the capacitors, the steps of (a) applying (301) a voltage between the conductor from the first plurality of conductors associated with the capacitor and the conductor from the second plurality of conductors associated with the capacitor, (b) detecting (302) an electrical characteristic indicative of a capacitance of the capacitor, (c) evaluating (303) the detected electrical characteristic, and (d) determining (304) whether the capacitor is included in the functional area of the electronic textile based on the evaluation.As the method takes advantages of physical characteristics inherent in the electronic textile, such as the capacitors formed between conductors in the electronic textile, no electronic devices need to be arranged on the electronic textile to determine the functional area.

Abstract translation: 本发明涉及一种用于确定电子织物（100; 200）的功能区域的方法。 电子纺织品包括具有第一多个导体（108a-b; 202a-d），第二多个导体（104a-c; 204a-d）和多个电容器（112; 212a-p）的织物基底， 每个电容器包括来自第一多个导体（108a-b; 202a-d）的导体和由电介质（103a）隔开的来自第二多个导体（104a-c; 204a-d）的导体，电容器 （112; 212a-p）分布在所述电子纺织品的基本上整个表面上，其中每个电容器（112; 212a-p）具有至少10pF的电容。 对于每个电容器，该方法包括以下步骤：（a）在来自与电容器相关联的第一多个导体的导体与来自与电容器相关联的第二多个导体的导体之间施加（301）电压（ b）检测（302）表示电容器的电容的电特性，（c）评估（303）检测到的电特性，以及（d）确定（304）电容器是否包括在电子纺织品的功能区域 基于评估。 由于该方法利用电子纺织品固有的物理特性，例如在电子纺织品中形成的电容器之间形成的电容器，则不需要在电子纺织品上布置电子装置来确定功能区域。

公开(公告)号：US20140190730A1

公开(公告)日：2014-07-10

申请号：US13863548

申请日：2013-04-16

Applicant: Cornell University

Inventor： Margaret Frey ,  Daehwan Cho ,  SangGap Lee ,  Chae Un Kim ,  Nikolas Hoepker ,  Mark W. Tate ,  Meryem Oznur Pehlivaner Kara

IPC: H01B1/12 ,  H05K1/03 ,  H05K1/09 ,  D01D5/00

CPC classification number: H05K1/09 ,  C08G2261/1424 ,  C08G2261/3223 ,  C08G2261/51 ,  C08G2261/94 ,  C08L65/00 ,  D01D5/0038 ,  D01D5/0046 ,  D01F6/44 ,  H01B1/127 ,  H05K1/16 ,  H05K2201/0278 ,  H05K2201/0281 ,  H05K2201/10151 ,  C08L25/18 ,  C08L29/04

Abstract: Provided are conducting polymer nanofibers, methods of making conducting polymer nanofibers, and uses thereof. The conducting polymer nanofibers can be formed by, for example, electrospinning, force spinning, and centrifugal spinning using a spinning dope. The conducting polymer nanofibers can be used in devices, such as a radiation detecting device.

Abstract translation: 提供导电聚合物纳米纤维，制备导电聚合物纳米纤维的方法及其用途。 导电聚合物纳米纤维可以通过例如静电纺丝，力纺丝和使用纺丝原液的离心纺丝形成。 导电聚合物纳米纤维可用于诸如辐射检测装置的装置中。

公开(公告)号：US08728959B2

公开(公告)日：2014-05-20

申请号：US12531676

申请日：2008-06-27

Applicant: Gi Soo Chung ,  Dae Hoon Lee ,  Jae Sang An

Inventor： Gi Soo Chung ,  Dae Hoon Lee ,  Jae Sang An

IPC: D03D15/00 ,  D02G3/00 ,  H05K9/00 ,  H05B3/00

CPC classification number: D03D15/00 ,  D02G3/12 ,  D02G3/36 ,  D02G3/441 ,  D03D1/0088 ,  D03D3/005 ,  D03D15/0027 ,  D03D15/0066 ,  D10B2101/20 ,  D10B2401/16 ,  D10B2501/06 ,  H05K1/038 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/09809 ,  Y10T428/2942 ,  Y10T428/2944 ,  Y10T428/2947 ,  Y10T442/3065 ,  Y10T442/3976

Abstract: The present invention relates to a textile digital band which is capable of providing a high-speed communication path with surrounding computing devices, through easy and convenient attachment thereof to a conventional garment, and a fabrication method thereof. For this purpose, disclosed herein is a textile digital band comprising a plurality of warps formed parallel to each other in the first direction, and a plurality of wefts formed parallel to each other in the second direction perpendicular to the first direction, wherein the warp includes at least one digital yarn through which electrical currents can flow.

Abstract translation: 本发明涉及一种纺织数字带，其能够通过简单方便地将其连接到常规服装上而与周围的计算设备提供高速通信路径及其制造方法。 为此目的，本文公开了一种纺织数字带，其包括在第一方向上彼此平行形成的多个经纱和在垂直于第一方向的第二方向上彼此平行地形成的多个纬纱，其中，经纱包括 至少一个电流可流过的数字纱线。

公开(公告)号：US20140124258A1

公开(公告)日：2014-05-08

申请号：US13827248

申请日：2013-03-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Wook PARK ,  Dong Hwan Lee ,  Jin Gu Kim ,  Chang Bae Lee ,  Christian Romero

IPC: H05K1/02 ,  H05K3/40

CPC classification number: H05K1/0216 ,  H05K3/4602 ,  H05K3/4673 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0723 ,  H05K2201/09581 ,  Y10T29/49165

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a core layer having a first circuit wiring layer formed on one surface or both surfaces thereof; an insulating layer laminated, as at least one layer, on one surface or both surfaces of the core layer; and a second circuit wiring layer formed on one surface of the insulating layer, wherein a conductive core is included in upper and lower insulating layers contacting the second circuit wiring layer requiring an electromagnetic wave shielding, or the conductive core is included in the insulating layer or the core layer contacting the first circuit wiring layer requiring the electromagnetic wave shielding.

Abstract translation: 这里公开了一种印刷电路板及其制造方法。 印刷电路板包括：具有形成在其一个表面或两个表面上的第一电路布线层的芯层; 在芯层的一个表面或两个表面上层压作为至少一个层的绝缘层; 以及形成在所述绝缘层的一个表面上的第二电路布线层，其中在与需要电磁波屏蔽的第二电路布线层接触的上绝缘层和下绝缘层中包括导电芯，或者导电芯包括在绝缘层中或 芯层与需要电磁波屏蔽的第一电路布线层接触。

公开(公告)号：US20140027038A1

公开(公告)日：2014-01-30

申请号：US14042867

申请日：2013-10-01

Applicant: Korea Institute of Machinery & Materials

Inventor： Hye Moon LEE

IPC: H01B13/30 ,  H05K3/10

CPC classification number: H01B13/30 ,  D06M11/83 ,  D06M13/144 ,  H05K1/038 ,  H05K3/103 ,  H05K3/105 ,  H05K2201/0281 ,  H05K2203/1157 ,  Y10T29/49826 ,  Y10T156/10

Abstract: A method for manufacturing a conductive fiber and/or fabric, a conductive fiber and/or fabric, and a method for manufacturing a circuit board are provided, the method for manufacturing a conductive fiber and/or fabric including: preparing a composition including a solvent and a metal precursor; impregnating a fiber and/or fabric with the composition; and reducing the metal precursor in the fiber and/or fabric impregnated with the composition into a metal to obtain a conductive fiber and/or fabric, wherein the composition includes 50 to 99 wt % of the solvent and 1 to 50 wt % of the metal precursor.

Abstract translation: 提供一种制造导电纤维和/或织物，导电纤维和/或织物的方法和制造电路板的方法，所述制造导电纤维和/或织物的方法包括：制备包含溶剂的组合物 和金属前体; 用该组合物浸渍纤维和/或织物; 并且将浸渍有组合物的纤维和/或织物中的金属前体还原成金属以获得导电纤维和/或织物，其中所述组合物包含50至99重量％的溶剂和1至50重量％的金属 前体

公开(公告)号：US08512856B2

公开(公告)日：2013-08-20

申请号：US12672599

申请日：2008-08-07

Applicant: Koji Takeuchi ,  Masami Matsuda ,  Kaoru Ono ,  Makoto Hosoda

Inventor： Koji Takeuchi ,  Masami Matsuda ,  Kaoru Ono ,  Makoto Hosoda

IPC: B32B5/16 ,  B32B9/04 ,  B32B9/06

CPC classification number: H05K1/056 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0281 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T428/24917 ,  Y10T428/249994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/31663 ,  H01L2924/00

Abstract: The present invention provides a wiring board giving good heat dissipation over a long period of use. The present invention also provides a method for producing a wiring board, including coating a surface of a metal substrate, which is made of an aluminum plate, with a composition containing a substance having a polysiloxane structure and inorganic particles having insulating and heat-dissipating properties, curing the composition, then bonding a copper foil to the cured composition, and partially removing the copper foil, thereby forming a wiring layer.

Abstract translation: 本发明提供一种在长时间使用时提供良好散热的接线板。 本发明还提供了一种制造布线板的方法，其包括用含有聚硅氧烷结构的物质和具有绝缘和散热性能的无机颗粒的由铝板制成的金属基材的表面涂覆的方法 固化组合物，然后将铜箔粘合到固化的组合物上，并部分地除去铜箔，从而形成布线层。