公开(公告)号：US20150136466A1

公开(公告)日：2015-05-21

申请号：US14275707

申请日：2014-05-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Youn PANG

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/03 ,  G03F7/30 ,  H05K1/11

CPC classification number: G03F7/30 ,  H05K3/0032 ,  H05K3/3452 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2203/041

Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer having a connection pad; and a resist layer formed on the insulating layer and provided with an opening so that the connection pad is exposed, wherein a wall surface of an opening of the resist layer may have at least one protrusion.

Abstract translation: 这里公开了一种印刷电路板及其制造方法。 根据本发明的优选实施例，印刷电路板包括：具有连接垫的绝缘层; 以及形成在所述绝缘层上并具有开口以使得所述连接焊盘露出的抗蚀剂层，其中所述抗蚀剂层的开口的壁表面可以具有至少一个突起。

公开(公告)号：US20150114694A1

公开(公告)日：2015-04-30

申请号：US14231411

申请日：2014-03-31

Applicant: Wistron Corporation

Inventor： Yu-Ju Liu ,  Che-Wen Liu

IPC: H05K1/14

CPC classification number: H05K1/147 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/09063 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/10356 ,  H05K2201/2027 ,  Y10T29/49181

Abstract: An assembly includes a circuit board and a flexible flat cable. The circuit board includes a board body having top, bottom and side faces, and a connection module. The board body is formed with a positioning slot that is formed through the top and bottom faces and that has a first length, and an opening that extends from the side face and that is in spatial communication with the positioning slot. The opening is formed through the top and bottom faces and has a second length shorter than the first length. The flexible flat cable includes a connection unit and a cable main body that has a width greater than the second length. The cable main body is able to pass through the opening, and extends through and is positioned in the positioning slot.

Abstract translation: 组件包括电路板和柔性扁平电缆。 电路板包括具有顶部，底部和侧面以及连接模块的板体。 板本体形成有通过顶面和底面形成并具有第一长度的定位槽，以及从侧面延伸并与定位槽空间连通的开口。 开口通过顶面和底面形成，并且具有比第一长度短的第二长度。 柔性扁平电缆包括具有大于第二长度的宽度的连接单元和电缆主体。 电缆主体能够穿过开口，并且延伸穿过并定位在定位槽中。

公开(公告)号：US20150102510A1

公开(公告)日：2015-04-16

申请号：US14512754

申请日：2014-10-13

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Wataru Kaneda ,  Noriyoshi Shimizu ,  Akio Rokugawa ,  Kaori Yokota

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H01L23/00

CPC classification number: H05K1/18 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16054 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/01029 ,  H01L2924/12042 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/0052 ,  H05K3/043 ,  H05K3/4007 ,  H05K3/429 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/0209 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/0959 ,  H05K2201/2072 ,  H05K2203/025 ,  H05K2203/0773 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A wiring board includes a first insulating layer containing a thermosetting resin, a first wiring layer stacked on an upper surface of the first insulating layer, a second insulating layer stacked on the upper surface of the first insulating layer, a second wiring layer stacked on an upper surface of the second insulating layer, and a third insulating layer stacked on the upper surface of the second insulating layer. The second and third insulating layers contain a first photosensitive resin. An outer side surface of the second insulating layer is flush with an outer side surface of the first insulating layer. An outer side surface of the third insulating layer is located inside the outer side surface of the second insulating layer in a plan view. The upper surface of the second insulating layer connecting to the outer side surface thereof is exposed from the third insulating layer.

Abstract translation: 布线基板包括含有热固性树脂的第一绝缘层，堆叠在第一绝缘层的上表面上的第一布线层，堆叠在第一绝缘层的上表面上的第二绝缘层，堆叠在第一绝缘层上的第二布线层 第二绝缘层的上表面和堆叠在第二绝缘层的上表面上的第三绝缘层。 第二和第三绝缘层包含第一感光树脂。 第二绝缘层的外侧表面与第一绝缘层的外侧表面齐平。 第三绝缘层的外侧表面在平面图中位于第二绝缘层的外侧表面内。 连接到其外侧表面的第二绝缘层的上表面从第三绝缘层露出。

公开(公告)号：US08995139B2

公开(公告)日：2015-03-31

申请号：US13331784

申请日：2011-12-20

Applicant: Hideyuki Sakamoto

Inventor： Hideyuki Sakamoto

IPC: H05K5/00 ,  H01L23/31 ,  H05K3/28 ,  H01L21/56 ,  H05K3/00

CPC classification number: H01L23/3107 ,  B29C45/14008 ,  B29C45/14819 ,  B29L2031/3425 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/284 ,  H05K2201/09154 ,  H05K2203/1316 ,  H05K2203/1545 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided is a circuit device in which encapsulating resin to encapsulate a circuit board is optimized in shape, and a method of manufacturing the circuit device. A hybrid integrated circuit device, which is a circuit device according to the present invention includes a circuit board, a circuit element mounted on a top surface of the circuit board, and encapsulating resin encapsulating the circuit element, and coating the top surface, side surfaces, and a bottom surface of the circuit board. In addition, the encapsulating resin is partly recessed and thereby provided with recessed areas at two sides of the circuit board. The providing of the recessed areas reduces the amount of resin to be used, and prevents the hybrid integrated circuit device from being deformed by the cure shrinkage of the encapsulating resin.

Abstract translation: 提供一种电路装置，其中密封电路板的封装树脂的形状优化，以及制造电路装置的方法。 作为根据本发明的电路装置的混合集成电路装置包括电路板，安装在电路板的顶表面上的电路元件和封装电路元件的封装树脂，并且将顶表面，侧表面 ，以及电路板的底面。 此外，封装树脂部分凹陷，从而在电路板的两侧设置有凹陷区域。 凹陷区域的设置减少了使用的树脂的量，并且防止混合集成电路器件由于封装树脂的固化收缩而变形。

公开(公告)号：US08759687B2

公开(公告)日：2014-06-24

申请号：US12948882

申请日：2010-11-18

Applicant: Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/03

CPC classification number: H05K3/4691 ,  H05K2201/0715 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/09845

Abstract: A flex-rigid wiring board includes an insulative substrate, a flexible wiring board positioned beside the insulative substrate, and an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing at least a portion of the flexible wiring board. The flexible wiring board has a tapered portion which is made thinner toward the insulative substrate at an end portion of the flexible wiring board positioned beside the insulative substrate.

Abstract translation: 柔性刚性布线板包括绝缘基板，位于绝缘基板旁边的柔性布线板以及位于绝缘基板和柔性布线板上方的绝缘层，并露出柔性布线板的至少一部分。 柔性布线板具有在位于绝缘基板旁边的柔性布线板的端部处朝向绝缘基板制成的锥形部分。

公开(公告)号：US20140144686A1

公开(公告)日：2014-05-29

申请号：US14093099

申请日：2013-11-29

Applicant: IBIDEN CO., LTD.

Inventor： Keisuke SHIMIZU

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/09536 ,  H05K2203/167 ,  Y10T29/49139 ,  H01L2924/00

Abstract: A wiring board for a built-in electronic component includes a substrate having a cavity portion, an electronic component accommodated in the cavity portion of the substrate, a filling resin material filling a space formed between the electronic component and an inner wall of the substrate forming the cavity portion, an insulation layer formed on the substrate and the electronic component accommodated in the cavity portion of the substrate, and a via conductor formed in the insulation layer such that the via conductor is connected to a connection terminal of the electronic component. The substrate has projection portions formed on the inner wall of the substrate such that the projection portions project toward the electronic component accommodated in the cavity portion of the substrate.

Abstract translation: 一种用于内置电子元件的布线板，包括：具有空腔部分的基板;容纳在基板的空腔部分中的电子元件;填充树脂材料，填充电子元件与基板形成的内壁之间形成的空间 空腔部分，形成在基板上的绝缘层和容纳在基板的空腔部分中的电子部件以及形成在绝缘层中的通孔导体，使得通孔导体连接到电子部件的连接端子。 基板具有形成在基板的内壁上的突起部分，使得突出部分朝向容纳在基板的空腔部分中的电子部件突出。

公开(公告)号：US20140043810A1

公开(公告)日：2014-02-13

申请号：US13964368

申请日：2013-08-12

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Sok Hyun JO ,  Sang Ho YOON ,  Wook Pyo LEE ,  Hyung Jin KIM

IPC: F21V29/02 ,  F21V5/04 ,  F21V15/01 ,  F21V29/00 ,  F21V13/04

CPC classification number: F21V13/04 ,  F21S8/026 ,  F21V3/061 ,  F21V3/062 ,  F21V5/007 ,  F21V5/04 ,  F21V29/506 ,  F21V29/507 ,  F21V29/677 ,  F21V29/74 ,  F21V29/83 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2924/181 ,  H05B37/0272 ,  H05K1/053 ,  H05K1/056 ,  H05K3/107 ,  H05K2201/09154 ,  H05K2201/09845 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A lighting apparatus including a base with a coupling rim and a supporting plate and a housing coupled to the coupling rim such that the supporting plate is covered. The housing includes a channel part to guide air in and an air introduction hole to introduce the guided air into an inner space of the housing. A cooling fan is included and is disposed on an upper surface of the supporting plate covered by the housing, wherein the cooling fan draws air introduced through the air introduction hole into the inner space of the housing, and discharges the in-drawn air outside through an air discharging hole in the base. A light source module is included and mounted on a lower surface of the supporting plate, wherein the channel part provides a region depressed in a stepped manner along an outer surface of the housing.

Abstract translation: 一种照明装置，包括具有联接边缘和支撑板的基座和联接到联接边缘的壳体，使得支撑板被覆盖。 壳体包括用于引导空气的通道部分和空气引入孔，以将引导的空气引入壳体的内部空间。 包括冷却风扇，并且设置在由壳体覆盖的支撑板的上表面上，其中，冷却风扇将通过空气引入孔引入的空气吸入壳体的内部空间，并将被抽吸的空气排出到外部 基座中的排气孔。 光源模块被包括并安装在支撑板的下表面上，其中通道部分沿着壳体的外表面提供以阶梯状凹陷的区域。

公开(公告)号：US20130337689A1

公开(公告)日：2013-12-19

申请号：US13919794

申请日：2013-06-17

Applicant: HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： JERRY WU ,  CHIEN-CHIUNG WANG ,  JUN CHEN ,  FAN-BO MENG

IPC: H01R13/66

CPC classification number: H01R13/6658 ,  H05K1/0259 ,  H05K1/117 ,  H05K2201/09154 ,  H05K2201/09481 ,  H05K2201/09618

Abstract: An electrical connector comprises a metallic housing; and a printed circuit board receiving in the metallic housing and defining a mating portion formed on a front end thereof. The mating portion defines a plurality of conductive pads formed on a top surface thereof, the plurality of conductive pads comprises a plurality of first grounding contacts, a plurality of pairs of differential signal contacts and a plurality of second grounding contacts, each of pair of differential signal contacts are intervened between two adjacent grounding contacts, each of second grounding contact is located in front of the pair of differential signal contacts and electrically and mechanically connected with two front ends of two first grounding contacts.

Abstract translation: 电连接器包括金属外壳; 以及印刷电路板，容纳在所述金属壳体中并限定形成在其前端上的配合部分。 配合部分限定了形成在其顶表面上的多个导电焊盘，多个导电焊盘包括多个第一接地触点，多对差动信号触点和多个第二接地触点，每对差动 信号触点介于两个相邻的接地触点之间，每个第二接地触点位于该对差动信号触点的前面，并与两个第一接地触点的两个前端电连接和机械连接。

公开(公告)号：US08546696B2

公开(公告)日：2013-10-01

申请号：US12820605

申请日：2010-06-22

Applicant: Hirohito Watanabe

Inventor： Hirohito Watanabe

IPC: H05K1/00 ,  H05K3/00 ,  H01R9/00

CPC classification number: H05K1/117 ,  H05K1/118 ,  H05K3/0058 ,  H05K3/386 ,  H05K2201/0191 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/2009 ,  Y10T29/49147 ,  Y10T156/10

Abstract: A printed circuit board having a connection terminal which includes: an insulating substrate including first and second surfaces, and an end surface along an outline normal to an insertion direction of the connection terminal; at least one lead wiring layer formed on the first surface of the insulating substrate; an insulating protection film covering the lead wiring layer; at least one lead terminal layer constituting an end portion of the lead wiring layer, the lead terminal layer being formed into a strip, and having an end surface along the outline; a reinforcement body adhered on the second surface of the insulating substrate at a backside position of the lead terminal layer; wherein a distance between an outer surface of the lead terminal layer and an outer surface of the reinforcement body on the outline side is smaller than a distance therebetween on the lead wiring layer side.

Abstract translation: 一种具有连接端子的印刷电路板，包括：绝缘基板，包括第一表面和第二表面;以及沿着垂直于连接端子的插入方向的轮廓的端面; 形成在绝缘基板的第一表面上的至少一个引线布线层; 覆盖引线布线层的绝缘保护膜; 构成所述引线配线层的端部的至少一个引线端子层，所述引线端子层形成为带状，并且具有沿着所述轮廓的端面; 加强体，其在所述引线端子层的背面位置粘附在所述绝缘基板的所述第二表面上; 其中，引线端子层的外表面与轮廓侧的加强体的外表面之间的距离小于引线布线层侧的距离。

公开(公告)号：US20110176285A1

公开(公告)日：2011-07-21

申请号：US12805628

申请日：2010-08-10

Applicant: Seung Wook Park ,  Young Do Kweon ,  Seung Wan Shin ,  Mi Jin Park ,  Kyung Seob Oh

Inventor： Seung Wook Park ,  Young Do Kweon ,  Seung Wan Shin ,  Mi Jin Park ,  Kyung Seob Oh

IPC: H05K1/18 ,  H05K1/11 ,  H01B13/00

CPC classification number: H05K3/32 ,  H01L23/13 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00

Abstract: There is provided an interconnection structure. An interconnection structure according to an aspect of the invention may include: a plurality of side portions provided on one surface of a substrate part and a plurality of cavities located between the side portions and located further inward than the side portions; and electrode pattern portions provided on surfaces of the side portions and the cavities.

Abstract translation: 提供互连结构。 根据本发明的一个方面的互连结构可以包括：设置在基板部分的一个表面上的多个侧部和位于侧部之间并且位于比侧部更靠内侧的多个空腔; 以及设置在侧部和空腔的表面上的电极图案部分。