公开(公告)号：US4004261A

公开(公告)日：1977-01-18

申请号：US567184

申请日：1975-04-11

Applicant: Alfred Simeon Klingenberg

Inventor： Alfred Simeon Klingenberg

IPC: H01H3/00 ,  H01R4/02 ,  H02B1/20 ,  H04Q1/14 ,  H05K3/36 ,  H05K3/40 ,  H01F3/00

CPC classification number: H01H3/00 ,  H01R4/027 ,  H02B1/207 ,  H04Q1/141 ,  H05K3/363 ,  H05K3/4046 ,  H05K2201/0215 ,  H05K2201/083 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2203/104

Abstract: A connection module has a plurality of connection devices, each including two conductors separated by an insulator having an aperture between the conductors and containing a plurality of magnetic balls. The balls and the conductors are coated with a material having a melting point above 85.degree. F. A magnetic force is used to align and hold the balls between two conductors while sufficient heat is applied to melt the material on the balls and the conductors. Upon cooling, the material on the balls and the conductors solidifies fusing the balls and the conductors together into a permanent connection.

Abstract translation: 连接模块具有多个连接装置，每个连接装置包括由绝缘体隔开的两个导体，绝缘体在导体之间具有孔，并包含多个磁珠。 球和导体用熔点高于85°F的材料涂覆。使用磁力将球对准和保持在两个导体之间，同时施加足够的热量以熔化球和导体上的材料。 在冷却时，球和导体上的材料固化将球和导体融合在一起成永久连接。

公开(公告)号：US3916513A

公开(公告)日：1975-11-04

申请号：US46654974

申请日：1974-05-03

Applicant: AMPEX

Inventor： BALLARD NATHAN THOMAS

IPC: H01R12/51 ,  H05K1/05 ,  H05K3/40 ,  H05K1/04

CPC classification number: H05K3/4046 ,  H05K1/05 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2201/10234 ,  H05K2201/10924 ,  Y10T29/49121 ,  Y10T29/49126

Abstract: Interplane connectors (vias) between circuit layers are fabricated by providing a metal base plate with the desired connectors thereon, forming the connectors at right angles to the base plate and embedding the connectors in a plastic matrix. The base plate is then removed, leaving the plastic with the connectors embedded therein at the desired locations.

Abstract translation: 通过在其上提供具有所需连接器的金属底板来制造电路层之间的平面间连接器（通路），形成与基板成直角的连接器并将连接器嵌入塑料基体中。 然后取下基板，留下塑料，将连接器嵌入其中所需的位置。

公开(公告)号：US3488840A

公开(公告)日：1970-01-13

申请号：US3488840D

申请日：1966-10-03

Applicant: IBM

Inventor： HYMES IRWIN M ,  SOPHER RAEMAN P ,  TOTTA PAUL A

IPC: H01B1/02 ,  H01L21/60 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01B1/02 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3436 ,  H05K2201/10234 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49144

公开(公告)号：US3193789A

公开(公告)日：1965-07-06

申请号：US21401262

申请日：1962-08-01

Applicant: SPERRY RAND CORP

Inventor： BROWN WILLIAM C

IPC: B23K31/00 ,  H01R12/50 ,  H01R12/52 ,  H01R24/00 ,  H05K1/02 ,  H05K3/06 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4617 ,  H01R12/52 ,  H05K3/06 ,  H05K3/28 ,  H05K3/4038 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/10234 ,  H05K2201/10333 ,  H05K2203/0369 ,  H05K2203/041 ,  Y10T29/49167

公开(公告)号：US20240235071A9

公开(公告)日：2024-07-11

申请号：US18475392

申请日：2023-09-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO

IPC: H01R12/52 ,  H05K1/18

CPC classification number: H01R12/52 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10522 ,  H05K2201/10545

Abstract: A circuit module includes an upper circuit board, a lower circuit board, a first conductor member, a second conductor member, and a first component. The upper circuit board has a first upper main surface and a first lower main surface. The lower circuit board has a second upper main surface and a second lower main surface, is disposed below the upper circuit board, and overlaps the upper circuit board as viewed in the downward direction. The first component is mounted on the first lower main surface or the second upper main surface. The first conductor member is a metal pin and is connected to the first lower main surface. The second conductor member is a metal pin and is connected to the second upper main surface. The second conductor member is electrically connected to the first conductor member.

公开(公告)号：US09903754B2

公开(公告)日：2018-02-27

申请号：US15240277

申请日：2016-08-18

Applicant: NANNING FUGUI PRECISION INDUSTRIAL CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Xiao-Hu Tang ,  Pei Liu

IPC: G01J1/18 ,  H05K1/02 ,  H05K1/18 ,  H05K1/14

CPC classification number: G01J1/18 ,  G01V8/20 ,  H05K1/0274 ,  H05K1/0275 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/08 ,  H05K2201/083 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10234

Abstract: A security device in an electronic device which protects against unauthorized disassembly includes light sources, a plurality of photosensitive elements, a detection unit, a storage unit, a processor, and light guiding devices. Light conducting channels are provided between the light sources and the induction elements. Barrier objects that block light are installed at certain first light guiding channels of the light guiding channels, and are removed from the first light conducting channels when the electronic device is disassembled, so that induction signals output by the photosensitive elements are changed from the model or original digitally-recorded signals.

公开(公告)号：US20170347463A1

公开(公告)日：2017-11-30

申请号：US15582807

申请日：2017-05-01

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： ARATA KISHI ,  HIROKI MARUO

IPC: H05K3/34 ,  B23K1/00 ,  H01L23/00 ,  B23K35/26 ,  C22C12/00 ,  C22C28/00 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K3/3468 ,  B23K1/0016 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  C22C12/00 ,  C22C28/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/1329 ,  H01L2224/13309 ,  H01L2224/13311 ,  H01L2224/13313 ,  H01L2224/13318 ,  H01L2224/13339 ,  H01L2224/1339 ,  H01L2224/16227 ,  H01L2224/81815 ,  H01L2924/014 ,  H01L2924/20104 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3478 ,  H05K2201/10234 ,  H05K2203/041

Abstract: There is provided a conductive particle including a core particle containing a resin material, and a surface layer that covers a surface of the core particle and contains a solder material, in which a melting point of the solder material is equal to or lower than a softening point of the resin material.

公开(公告)号：US09813046B2

公开(公告)日：2017-11-07

申请号：US15087250

申请日：2016-03-31

Applicant: Intel Corporation

Inventor： Sameer Shekhar ,  Amit K. Jain ,  Pooja Nukala

IPC: H03K3/011 ,  H01L23/00 ,  H01L23/498 ,  H05K1/18 ,  H01L25/065

CPC classification number: H01L25/0655 ,  H01L23/49838 ,  H01L24/17 ,  H01L2224/16225 ,  H01L2924/1304 ,  H01L2924/13091 ,  H01L2924/1432 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19043 ,  H01L2924/19101 ,  H03K19/0005 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10378

Abstract: Some embodiments include apparatus and methods using a package substrate and a die coupled to the package substrate. The package substrate includes conductive contacts, conductive paths coupled to the conductive contacts, and a resistor embedded in the package substrate. The die includes buffer circuits and a calibration module coupled to the buffer circuits and the resistor. The buffer circuits include output nodes coupled to the conductive contacts through the conductive paths. The calibration module is configured to perform a calibration operation to adjust resistances of the buffer circuits based on a value of a voltage at a terminal of the resistor during the calibration operation.

公开(公告)号：US09609792B2

公开(公告)日：2017-03-28

申请号：US14482674

申请日：2014-09-10

Applicant: Guangzhou Fang Bang Electronics Co., Ltd.

Inventor： Zhi Su

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K9/0084 ,  H05K1/0215 ,  H05K1/0216 ,  H05K2201/0382 ,  H05K2201/0715 ,  H05K2201/10234 ,  H05K2203/1189 ,  Y10T156/1054 ,  Y10T156/1057 ,  Y10T156/1082

Abstract: The present invention discloses an electromagnetic wave shielding film, comprising at least one electromagnetic shielding layer. A printed circuit board comprising the shielding film, is formed by tightly connecting the electromagnetic wave shielding film with the printed circuit board in the direction of thickness, wherein a ground layer is disposed on said printed circuit board. A method for producing the circuit board, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) piercing the adhesive film layer by a rough surface of the electromagnetic shielding layer, to achieve grounding. Or, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) piercing the shielding film by an electrically conductive substance, to achieve grounding. Or, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) forming through holes or blind holes in the circuit board; (3) metallizing the holes, to achieve grounding. The adhesive film layer of the shielding film of the present invention contains no conductive particle, so that the cost and the insertion loss are reduced, and the development demand of high-speed and high-frequency of the electronic products is met.

公开(公告)号：US20170047145A1

公开(公告)日：2017-02-16

申请号：US15306059

申请日：2016-02-12

Applicant: Little Device Corporation

Inventor： Akimichi TAKIZAWA

IPC: H01B5/14 ,  H01B3/28 ,  H05K1/18 ,  H01B1/02

CPC classification number: H01B5/14 ,  H01B1/02 ,  H01B3/28 ,  H01B5/00 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/181 ,  H05K3/32 ,  H05K2201/10234 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present invention provides a conductive ball, which can be used as a connector by intervening between electrodes to apply a current between the electrodes with relatively high conductivity, and which is prevented from decreasing the conductivity due to the following thermal history. The conductive ball of the present invention comprises a sphere formed of an elastic body; a thermal expansion-resistant resin shell applied so as to coat the surface of the sphere; and a conductive metal shell applied so as to coat the outer surface of the thermal expansion-resistant resin shell. For example, the sphere is formed of a silicone rubber, the thermal expansion-resistant resin shell is formed of a polyimide, and the conductive metal shell is formed of copper, gold, silver, or palladium, or an alloy containing it.

Abstract translation: 本发明提供一种导电球，其可以通过介于电极之间用作连接器，以在相对较高导电率的电极之间施加电流，并且防止由于以下热历史导致的导电性降低。 本发明的导电球包括由弹性体形成的球体; 施加以覆盖球体表面的耐热膨胀树脂壳; 和导电性金属外壳，以涂覆耐热膨胀树脂外壳的外表面。 例如，球体由硅橡胶形成，耐热树脂壳由聚酰亚胺构成，导电性金属壳由铜，金，银，钯或含有它的合金构成。