Abstract:
Apparatus for feeding a strip of articles and severing the leading article from the strip comprises a cylindrical surface having a helical feeding thread thereon which is dimensioned to enter gaps in the strip of articles being fed. The strip is fed along a strip feed path to an operating zone adjacent to which one end of the cylindrical surface is located. The cylindrical surface has movable shearing blades thereon at the one end which are cooperable with fixed shearing blades to shear the leading article from the strip in the operating zone.
Abstract:
Strip feeding apparatus comprises a feed screw having a feeding thread on its surface. The thread is received in notches in one edge of the strip so that rotation of the screw advances the strip. Guides are provided for guiding the strip along the feed path and maintaining the strip in engagement with the thread. The thread may have a portion of each turn which causes no feeding during each revolution so that strip is fed intermittently. The feeding apparatus may be used under a wide variety of circumstances and is disclosed in conjunction with a stamping and forming or similar machine.
Abstract:
Zero insertion force connector for a substrate comprises housing having a surface against which the substrate is positioned. Terminals in the housing engage conductors on the substrate. A clamping bar is located beside the housing and is movable between first and second positions, the bar being relatively remote from the surface when in the second position and proximate to the surface when in the first position so that it clamps the substrate against the surface. The clamping bar is moved between its first and second positions by a force multiplying actuator.
Abstract:
A chip carrier having a plurality of leads thereon for external interconnection with preferably only one of the leads utilized to provide a source of power to the chip and preferably a single lead utilized as a ground connection. The power and ground leads are connected to an interdigitated lead array at the center of the chip carrier with the chip being secured to the chip carrier above the interdigitated pattern. The chip is bonded to a dielectric sliver which rests above a glass filler and bonding agent which fills the space between the interdigitated pattern and the sliver. The chip is hermetically sealed within the ceramic cap which is bonded to the chip carrier. Power and ground connections are made, from the chip directly to a pair of buses surrounding the interdigitated pattern rather than to leads extending outwardly to the edge of the chip carrier.
Abstract:
A ceramic chip carrier having a copper lead frame bonded directly to a ceramic substrate has a common rim connecting the tip portions of the leads. The rim is provided with extended portions which permit bending the rim away from the substrate without altering the relative positions of the tip portions. The rim is thus raised above the center region of the substrate and does not bond to the substrate and is thus readily removed after bonding the lead frame to the substrate.
Abstract:
Edge connector comprises a housing assembly having a board receiving trough which receives edge portions of a printed circuit board. The housing assembly comprises an insulating housing in which contact terminals are contained and a sheet metal frame of channel-shaped cross-section in which the insulating housing is nested. A camming means is mounted on the sheet metal frame for urging the circuit board against a board engaging surface portion of the insulating housing and an auxiliary spring is mounted on the frame to provide a high clamping force on the circuit board. The camming means is movable laterally towards and away from the board engaging surface so that the connector can receive circuit boards of widely varying thicknesses.
Abstract:
Multi-contact electrical connector for connecting a first plurality of conductors to a second plurality of conductors comprises an insulating housing having a plurality of side-by-side contact terminals therein, each terminal being a one-piece stamping having first and second contact portions for engagement with a first and second conductor respectively. The first and second contact portions also have first and second bypass contact surfaces thereon which are against each other. The spring means for maintaining contact force comprises a spring loop which extends circuitously from the first contact portion to the second contact portion. In use, the spring loop maintains the contact forces at all of the contact interfaces and the current flows from the first conductor through the first contact portion, through the bypass contact surfaces, through the second contact portion, and to the second conductor. The spring loop does not serve as a current path and self-inductance in the contact is thereby minimized.
Abstract:
An electrical connector comprises a plurality of conductive chicklets jointly defining at least a mounting surface adapted to face a motherboard, and a contacting surface adapted to face a daughterboard. Each chicklet defines at least a waveguide extending between the mounting and contacting surfaces. A plurality of differential pair terminals are dielectrically supported within the waveguides and having contacting ends extending beyond the mounting and contacting surfaces so as to electrically couple the motherboard and the daughterboard.
Abstract:
The invention relates to an improved, high density electrical connector, such as a backplane connector, which utilizes a flexible film having circuitry thereon for interconnecting plural planar electronic devices, such as a daughter board to a mother board. The improvement is derived through the use of a flexible film enhanced for local compliance, and to the inclusion of a force distribution member. The enhanced flexible film comprises a composite of a thin, flexible, dielectric film having upper and lower surfaces, a thin layer of metal disposed along the lower surface, and a plurality of discrete metallic pads or traces along the upper surface. Improved local compliance is accomplished by the thin metal layer having plural through slots, by mechanical punching or laser cutting, where each slot is aligned between a pair of adjacent metallic pads or traces. By this arrangement, the composite has improved local compliance between adjacent metallic pads or traces. To further improve the electrical connection of this enhanced flexible film, a force distribution member, underlying and in contact with the flexible film is provided. The force distribution member comprises an elastomeric member adjacent a first surface of the flexible film composite, and a thin metal force integrator along a surface of the elastomeric member remote from the composite. The force distribution member, in turn, is urged against the flexible film composite by a coil spring, for example, as known in the art.
Abstract:
This invention relates to a card edge or backplane type electrical connector, where typically two or more planar electronic devices, such as a mother board and one or more daughter boards, are electrically interconnected usually by arranging the daughter board(s) perpendicular to the mother board. The electrical connector of this invention comprises a pair of opposed housing members having a slot defined by opposing facing surfaces extending therebetween to receive a first of the planar electronic devices or daughter board, where housing member consists of first and second members floatably mounted to one another by spring means urging the first and second members away from one another. Force applying means, preferably in the form of a series of elongated canted coil spring is provided in the housing members along the facing surfaces. Further, a flexible circuit film member for each housing member, having spaced apart rows of contact pads on a surface thereof, is wrapped about a respective first and second member and force applying means, where the contact pads are exposed to the slot. By this arrangement, and by ensuring the separating force of the spring means is greater than the insertion or frictional force required to place the daughter board within the slot, localized and damaging flexing of the circuit film is avoided.