公开(公告)号：US20130297743A1

公开(公告)日：2013-11-07

申请号：US13763601

申请日：2013-02-08

Applicant: Amit Eschet ,  Adam Cohen ,  Assav Bar Yaccov ,  Nir Radian

Inventor： Amit Eschet ,  Adam Cohen ,  Assav Bar Yaccov ,  Nir Radian

IPC: H04L29/06

CPC classification number: H04L65/60 ,  H04L65/4084 ,  H04L65/80

Abstract: A computer readable medium and a method for bandwidth management, the method may include receiving or generating (a) video entity quality information for multiple sets of video entities, each set of video entities comprises video entities that belong to different versions of a same video stream, (b) user device screen size information for each user device out of multiple users devices, (c) user device profile information for each user out of multiple users, and (d) bandwidth constraints relating to bandwidth available for transmission of selected video entities to the user devices; wherein each user of the multiple users is associated with a user device of the multiple users devices; selecting for each user device a selected video entity based on at least (a) the video entity quality information, (b) the user device screen size information, (c) the requested video profile information, and (d) the bandwidth constraints; and, streaming to the multiple user devices from multiple selected video entities.

Abstract translation: 一种计算机可读介质和用于带宽管理的方法，所述方法可以包括接收或生成（a）多组视频实体的视频实体质量信息，每组视频实体包括属于相同视频流的不同版本的视频实体 ，（b）多个用户设备中的每个用户设备的用户设备屏幕尺寸信息，（c）多个用户中的每个用户的用户设备简档信息，以及（d）与可用于传输所选视频实体的带宽有关的带宽约束 到用户设备; 其中所述多个用户的每个用户与所述多个用户设备的用户设备相关联; 至少基于（a）视频实体质量信息，（b）用户设备屏幕尺寸信息，（c）所请求的视频配置文件信息和（d）带宽限制）为每个用户设备选择所选择的视频实体; 并且从多个选定的视频实体流向多个用户设备。

公开(公告)号：US20090177114A1

公开(公告)日：2009-07-09

申请号：US12316663

申请日：2008-12-15

Applicant: Yem Chin ,  Adam Cohen ,  Michal Weisman ,  Robert DeVries ,  Oscar Carrillo, JR.

Inventor： Yem Chin ,  Adam Cohen ,  Michal Weisman ,  Robert DeVries ,  Oscar Carrillo, JR.

IPC: A61B10/02

CPC classification number: A61B10/04 ,  A61B10/0283 ,  A61B2010/045 ,  A61B2017/3413 ,  A61B2090/3925

Abstract: An echogenic needle aspiration device. In one embodiment, the device includes an echogenic needle, the needle including a tubular sidewall having a non-circular transverse cross-section over at least a portion of its length. The non-circular cross-sectional shape of the needle may be provided, for example, by radially spacing one or more straight, longitudinally-extending fins, ribs or other projections about the periphery of the needle and/or by providing the needle with a polygonal cross-sectional shape.

Abstract translation: 回声针抽吸装置。 在一个实施例中，该装置包括回声针，该针包括在其长度的至少一部分上具有非圆形横截面的管状侧壁。 针的非圆形横截面形状可以例如通过沿着针的周边径向间隔一个或多个直的，纵向延伸的翅片，肋或其它突出部和/或通过向针提供一个 多边形横截面形状。

公开(公告)号：US20080105557A1

公开(公告)日：2008-05-08

申请号：US11927603

申请日：2007-10-29

Applicant: Adam Cohen ,  Gang Zhang

Inventor： Adam Cohen ,  Gang Zhang

IPC: C25D7/12

CPC classification number: B81C1/00246 ,  B81B2201/042 ,  B81C1/00126 ,  B81C2203/0735 ,  C23C4/01 ,  C23C18/1605 ,  C23C18/1651 ,  C23C28/00 ,  C23C28/048 ,  C23C28/322 ,  C23C28/34 ,  C23C28/345 ,  C23C28/36 ,  C25D1/003 ,  C25D5/022 ,  C25D7/123 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

Abstract: Enhanced Electrochemical fabrication processes are provided that can form three-dimensional multi-layer structures using semiconductor based circuitry as a substrate. Electrically functional portions of the structure are formed from structural material (e.g. nickel) that adheres to contact pads of the circuit. Aluminum contact pads and silicon structures are protected from copper diffusion damage by application of appropriate barrier layers. In some embodiments, nickel is applied to the aluminum contact pads via solder bump formation techniques using electroless nickel plating. In other embodiments, selective electroless copper plating or direct metallization is used to plate sacrificial material directly onto dielectric passivation layers. In still other embodiments, structural material deposition locations are shielded, then sacrificial material is deposited, the shielding is removed, and then structural material is deposited. In still other embodiments structural material is made to attach to non-contact pad regions.

Abstract translation: 提供了增强的电化学制造工艺，其可以使用基于半导体的电路作为衬底形成三维多层结构。 结构的电功能部分由粘附到电路的接触垫的结构材料（例如镍）形成。 铝接触焊盘和硅结构通过施加适当的阻挡层来保护铜扩散损坏。 在一些实施例中，通过使用无电镀镍的焊料凸块形成技术将镍施加到铝接触焊盘。 在其他实施例中，使用选择性无电镀铜或直接金属化将牺牲材料直接镀在电介质钝化层上。 在其他实施例中，屏蔽结构材料沉积位置，然后沉积牺牲材料，去除屏蔽，然后沉积结构材料。 在其它实施例中，使结构材料附着到非接触焊盘区域。

公开(公告)号：US20080099338A1

公开(公告)日：2008-05-01

申请号：US11927327

申请日：2007-10-29

Applicant: Adam Cohen

Inventor： Adam Cohen

IPC: C25D5/02

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

公开(公告)号：US20070238928A1

公开(公告)日：2007-10-11

申请号：US11400806

申请日：2006-04-07

Applicant: Luis Maseda ,  William Churchill ,  Kurt Geitz ,  Oscar Carrillo ,  Matthew Whitney ,  Adam Cohen ,  Roy Sullivan

Inventor： Luis Maseda ,  William Churchill ,  Kurt Geitz ,  Oscar Carrillo ,  Matthew Whitney ,  Adam Cohen ,  Roy Sullivan

IPC: A61B1/00

CPC classification number: A61B1/018 ,  A61B1/00137

Abstract: A medical device includes a handle and a shaft having a working channel. A biopsy port at the exterior of the handle provides a path for instruments leading to the working channel. A conduit that runs through the handle for supplying fluids is also provided a path to the working channel. As compared between the path from the biopsy port to the working channel and the path from the conduit to the working channel, the path from the biopsy port to the working channel is the more direct path of the two.

Abstract translation: 医疗装置包括手柄和具有工作通道的轴。 手柄外部的活检端口提供通向工作通道的仪器的路径。 穿过用于供应流体的手柄的导管还提供到工作通道的路径。 从活检端口到工作通道的路径和从管道到工作通道的路径相比，从活检端口到工作通道的路径是两条路径更直接的路径。

公开(公告)号：US20070202693A1

公开(公告)日：2007-08-30

申请号：US11668299

申请日：2007-01-29

Applicant: Adam Cohen ,  Gang Zhang

Inventor： Adam Cohen ,  Gang Zhang

IPC: H01L21/44 ,  C23C28/00

CPC classification number: B81C1/00246 ,  B81B2201/042 ,  B81C1/00126 ,  B81C2203/0735 ,  C23C4/01 ,  C23C18/1605 ,  C23C18/1651 ,  C23C28/00 ,  C23C28/048 ,  C23C28/322 ,  C23C28/34 ,  C23C28/345 ,  C23C28/36 ,  C25D1/003 ,  C25D5/022 ,  C25D7/123 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

Abstract: Enhanced Electrochemical fabrication processes are provided that can form three-dimensional multi-layer structures using semiconductor based circuitry as a substrate. Electrically functional portions of the structure are formed from structural material (e.g. nickel) that adheres to contact pads of the circuit. Aluminum contact pads and silicon structures are protected from copper diffusion damage by application of appropriate barrier layers. In some embodiments, nickel is applied to the aluminum contact pads via solder bump formation techniques using electroless nickel plating. In other embodiments, selective electroless copper plating or direct metallization is used to plate sacrificial material directly onto dielectric passivation layers. In still other embodiments, structural material deposition locations are shielded, then sacrificial material is deposited, the shielding is removed, and then structural material is deposited. In still other embodiments structural material is made to attach to non-contact pad regions.

Abstract translation: 提供了增强的电化学制造工艺，其可以使用基于半导体的电路作为衬底形成三维多层结构。 结构的电功能部分由粘附到电路的接触垫的结构材料（例如镍）形成。 铝接触焊盘和硅结构通过施加适当的阻挡层来保护铜扩散损坏。 在一些实施例中，通过使用无电镀镍的焊料凸块形成技术将镍施加到铝接触焊盘。 在其他实施例中，使用选择性无电镀铜或直接金属化将牺牲材料直接镀在电介质钝化层上。 在其他实施例中，屏蔽结构材料沉积位置，然后沉积牺牲材料，去除屏蔽，然后沉积结构材料。 在其它实施例中，使结构材料附着到非接触焊盘区域。

公开(公告)号：US20070199825A1

公开(公告)日：2007-08-30

申请号：US11668955

申请日：2007-01-30

Applicant: Adam Cohen ,  Michael Lockard ,  Dennis Smalley

Inventor： Adam Cohen ,  Michael Lockard ,  Dennis Smalley

IPC: C25D5/02

CPC classification number: C25D5/02 ,  B33Y10/00 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  H01P11/006

Abstract: Disclosed methods reduce the discontinuities that between individual layers of a structure that is formed at least in part using electrochemical fabrication techniques. Discontinuities may exist between layers of a structure as a result of up-facing or down-facing regions defined in data descriptive of the structure or they may exist as a result of building limitations, e.g., those that result in non-parallel orientation between a building axis and sidewall surfaces of layers. Methods for reducing discontinuities may be applied to all regions or only to selected regions of the structure. Methods may be tailored to improve the accuracy between an original design of the structure and the structure as fabricated or they may simply be used to smooth the discontinuities between layers. Methods may include deposition operations that selectively favor filling of the discontinuities and/or etching operations that selectively favor removal of material from protrusions that define discontinuities.

Abstract translation: 公开的方法减少了使用电化学制造技术至少部分形成的结构的各个层之间的不连续性。 结构的层之间可能存在不连续性，这是由于在描述结构的数据中定义的面向上或向下的区域的结果，或者它们可能由于构建限制而存在，例如导致在 建筑轴线和层的侧壁表面。 用于减少不连续性的方法可以应用于所有区域或仅应用于结构的选定区域。 可以调整方法以提高结构的原始设计和所制造的结构之间的精度，或者可以简单地用于平滑层之间的不连续性。 方法可以包括选择性地有利于填充不连续性和/或蚀刻操作的沉积操作，其选择性地有利于从限定不连续性的突起中去除材料。

公开(公告)号：US20070198038A1

公开(公告)日：2007-08-23

申请号：US11625807

申请日：2007-01-22

Applicant: Adam Cohen ,  Vacit Arat ,  Dennis Smalley

Inventor： Adam Cohen ,  Vacit Arat ,  Dennis Smalley

IPC: A61B17/04

CPC classification number: A61B17/0401 ,  A61B17/0469 ,  A61B17/0482 ,  A61B17/0487 ,  A61B2017/00345 ,  A61B2017/00526 ,  A61B2017/0462 ,  A61B2017/0488 ,  A61B2017/0496 ,  A61B2017/06052 ,  A61B2017/06176 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10

Abstract: Embodiments of invention are directed to micro-scale of mesoscale tissue approximation instruments that may be delivered to the body of a patient during minimally invasive or other surgical procedures. In one group of embodiments, the instrument has an elongated (longitudinal) configuration while with two sets of expandable wings that each have a toggle configuration that can be made to expand when located on opposite sides of a distal tissue region and a proximal tissue region and can then be made to move toward one another to bring the two tissue regions into more a proximal position. In some embodiments, multiple tissue approximation instruments are located within a delivery system for sequential delivery to a patient's body.

Abstract translation: 本发明的实施例涉及可在微创或其它外科手术过程中递送至患者体内的中尺度组织近似仪器的微尺度。 在一组实施例中，仪器具有细长（纵向）构造，同时具有两组可扩张翼，每组具有肘节配置，当位于远端组织区域和近端组织区域的相对侧时，可以使其膨胀， 然后可以使得彼此移动以使两个组织区域进入更靠近的位置。 在一些实施例中，多个组织近似仪器位于递送系统内，用于顺序递送给患者的身体。

公开(公告)号：US20070181431A1

公开(公告)日：2007-08-09

申请号：US11735393

申请日：2007-04-13

Applicant: Gang Zhang ,  Adam Cohen

Inventor： Gang Zhang ,  Adam Cohen

IPC: C25D5/02

CPC classification number: H01L21/2885 ,  B33Y10/00 ,  C25D1/003 ,  H01L21/4857 ,  H01L21/76879 ,  H05K3/241 ,  H05K3/243

Abstract: Electrochemical fabrication (e.g. EFAB) processes and apparatus are disclosed that provide monitoring of at least one electrical parameter (e.g. voltage) during selective deposition where the monitored parameter is used to help determine the quality of the deposition that was made. If the monitored parameter indicates that a problem occurred with the deposition, various remedial operations may be undertaken to allow successful formation of the structure to be completed.

Abstract translation: 公开了电化学制造（例如EFAB）方法和装置，其在选择性沉积期间提供至少一个电参数（例如电压）的监测，其中所使用的监测参数用于帮助确定所制备的沉积的质量。 如果所监测的参数表明沉积物发生问题，则可进行各种补救操作以允许成功地形成待完成的结构。

公开(公告)号：US20070158200A1

公开(公告)日：2007-07-12

申请号：US11478934

申请日：2006-06-29

Applicant: Adam Cohen ,  Michael Lockard ,  Gang Zhang

Inventor： Adam Cohen ,  Michael Lockard ,  Gang Zhang

IPC: C25D5/00 ,  B01J19/08

CPC classification number: C25D5/00 ,  B33Y10/00 ,  B81C99/0095 ,  B81C2201/0181 ,  C23C4/02 ,  C23C18/1605 ,  C23C18/1651 ,  C23C26/00 ,  C23C28/021 ,  C23C28/023 ,  C23C28/028 ,  C25D1/003

Abstract: Embodiments are directed to electrochemically fabricating multi-layer three dimensional structures where each layer comprises at least one structural and at least one sacrificial material and wherein at least some metals or alloys are electrodeposited during the formation of some layers and at least some metals are deposited during the formation of some layers that are either difficult to electrodeposit and/or are difficult to electrodeposit onto. In some embodiments, the hard to electrodeposit metals (e.g. Ti, NiTi, W, Ta, Mo, etc.) may be deposited via chemical or physical vacuum deposition techniques while other techniques are used in other embodiments. In some embodiments, prior to electrodepositing metals, the surface of the previously formed layer is made to undergo appropriate preparation for receiving an electrodeposited material. Various surface preparation techniques are possible, including, for example, anodic activation, cathodic activation, and vacuum deposition of a seed layer and possibly an adhesion layer.

Abstract translation: 实施例涉及电化学制造多层三维结构，其中每层包括至少一种结构和至少一种牺牲材料，并且其中至少一些金属或合金在形成一些层期间被电沉积，并且至少一些金属在 形成难以电沉积和/或难以电沉积的一些层。 在一些实施方案中，可以通过化学或物理真空沉积技术沉积难以电沉积的金属（例如Ti，NiTi，W，Ta，Mo等），而在其它实施方案中使用其它技术。 在一些实施方案中，在电沉积金属之前，使先前形成的层的表面经历适当的准备以接收电沉积材料。 各种表面处理技术是可能的，包括例如阳极活化，阴极活化和种子层以及可能的粘附层的真空沉积。