公开(公告)号：US20080108221A1

公开(公告)日：2008-05-08

申请号：US11931308

申请日：2007-10-31

Applicant: Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

Inventor： Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

IPC: H01L21/44

CPC classification number: C25D1/00 ,  C25D1/003 ,  C25D7/123

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.

Abstract translation: 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。

公开(公告)号：US20060286829A1

公开(公告)日：2006-12-21

申请号：US11028962

申请日：2005-01-03

Applicant: Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard

Inventor： Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard

IPC: H01R12/00

CPC classification number: G01R3/00 ,  G01R1/06744 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.

Abstract translation: 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在暴露在光致抗蚀剂中的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。

公开(公告)号：US20060112550A1

公开(公告)日：2006-06-01

申请号：US11178145

申请日：2005-07-07

Applicant: Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

Inventor： Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

IPC: H01R43/00

CPC classification number: C25D1/003 ,  G01R3/00 ,  Y10T29/49222

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.

公开(公告)号：US20060108678A1

公开(公告)日：2006-05-25

申请号：US11173241

申请日：2005-06-30

Applicant: Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

Inventor： Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

IPC: H01L23/48

CPC classification number: B23K35/0222 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  C25D1/12 ,  G01R1/06744 ,  G01R1/07307 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/10126 ,  H01L2224/1147 ,  H01L2224/11831 ,  H01L2224/1184 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/81001 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/8121 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3651 ,  H01L2924/3841 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

Abstract translation: 本发明的实施例涉及在临时衬底上形成微探针（即柔性电气或电子接触元件），切割单独的探针阵列，然后将阵列转移到空间变压器或其它永久衬底。 在将探针从其上形成探针的临时基底分离出来之前，本发明的一些实施方案将探针转移到永久性基底上，而其他实施方案相反。 一些实施例，在转移之前去除牺牲材料，而其它实施例在转移后去除牺牲材料。 一些实施例涉及使用一个或多个具有增强的纵横比（即，高度与宽度比）的焊料凸块来将第一和第二电气部件接合在一起，这是由于至少部分地由保持材料的环围绕凸块而得到的。 保留材料可以用作焊接掩模材料。

公开(公告)号：US20060051948A1

公开(公告)日：2006-03-09

申请号：US11177771

申请日：2005-07-07

Applicant: Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

Inventor： Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

IPC: H01L21/44

CPC classification number: G01R1/0483 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07314 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2886 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  Y10T156/10 ,  H01L2924/00

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.

公开(公告)号：US20050223543A1

公开(公告)日：2005-10-13

申请号：US11028945

申请日：2005-01-03

Applicant: Adam Cohen ,  Vacit Arat ,  Michael Lockard ,  Christopher Bang ,  Pavel Lembrikov

Inventor： Adam Cohen ,  Vacit Arat ,  Michael Lockard ,  Christopher Bang ,  Pavel Lembrikov

IPC: H02M7/00

CPC classification number: G01R3/00 ,  B33Y10/00 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01R1/06716 ,  G01R1/07378 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49078 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: Embodiments of the invention provide electrochemical fabrication processes that may be used for the fabrication of space transformers or the co-fabrication of microprobe arrays along with one or more space transformers.

Abstract translation: 本发明的实施例提供了可用于制造空间变压器或与一个或多个空间变压器一起共同制造微探针阵列的电化学制造工艺。

公开(公告)号：US20050221644A1

公开(公告)日：2005-10-06

申请号：US11029217

申请日：2005-01-03

Applicant: Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard

Inventor： Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard

IPC: G01R31/02 ,  H01R12/00 ,  H01R13/187 ,  H01R24/58

CPC classification number: G01R1/0483 ,  G01R1/06716 ,  G01R1/07357 ,  G01R31/2886 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T29/49213

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.

Abstract translation: 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 可能会发生探针针尖图案化以各种不同的方式，包括，例如，通过在图案化的孔成型已各向同性或各向异性蚀刻的硅，通过模制在形成于上曝光的光刻胶的空隙，通过成型在空隙中的牺牲材料，其 由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。

公开(公告)号：US20050181316A1

公开(公告)日：2005-08-18

申请号：US11028944

申请日：2005-01-03

Applicant: Uri Frodis ,  Adam Cohen ,  Michael Lockard

Inventor： Uri Frodis ,  Adam Cohen ,  Michael Lockard

IPC: B05D1/38 ,  C08K3/00 ,  C25D3/30 ,  C25D3/38 ,  C25D3/48 ,  C25D5/02 ,  C25D5/10 ,  C25D21/12 ,  H01L21/288 ,  H01L21/301 ,  H01L21/302 ,  H01L21/4763 ,  H01L21/768

CPC classification number: C25D5/48 ,  B33Y10/00 ,  B81C1/00492 ,  B81C99/0065 ,  B81C2201/0104 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76885 ,  Y10T156/1052

Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

公开(公告)号：US20050072681A1

公开(公告)日：2005-04-07

申请号：US10841347

申请日：2004-05-07

Applicant: Adam Cohen ,  Michael Lockard ,  Dale McPherson

Inventor： Adam Cohen ,  Michael Lockard ,  Dale McPherson

IPC: B81B3/00 ,  G01P15/08 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/18 ,  H01P11/00 ,  H05K3/46 ,  C25D5/10

CPC classification number: H01P11/007 ,  B81B2201/042 ,  B81C1/00126 ,  B81C2201/0109 ,  B81C2201/0197 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

Abstract: Multi-layer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surrounds the desired structure. After structure formation, the sacrificial material is removed by a multi-stage etching operation. In some embodiments sacrificial material to be removed may be located within passages or the like on a substrate or within an add-on component. The multi-stage etching operations may be separated by intermediate post processing activities, they may be separated by cleaning operations, or barrier material removal operations, or the like. Barriers may be fixed in position by contact with structural material or with a substrate or they may be solely fixed in position by sacrificial material and are thus free to be removed after all retaining sacrificial material is etched.

Abstract translation: 多层结构由至少一种结构材料（例如镍）进行电化学制造，其被构造成限定期望的结构并且可以附着到基底上，并且由至少一种围绕期望的材料的牺牲材料（例如铜） 结构体。 在结构形成之后，通过多级蚀刻操作去除牺牲材料。 在一些实施例中，待移除的牺牲材料可以位于基底上或附加部件内的通道等内。 多级蚀刻操作可以通过中间后处理活动来分离，它们可以通过清洁操作或阻隔材料去除操作等分开。 障碍物可以通过与结构材料或基底接触而固定在适当的位置，或者它们可以通过牺牲材料单独固定在适当位置，并且因此在所有保留牺牲材料被蚀刻之后被自由地去除。

公开(公告)号：US20080105647A1

公开(公告)日：2008-05-08

申请号：US11928206

申请日：2007-10-30

Applicant: Michael Lockard ,  Dannis Smalley ,  Willa Larsen ,  Richard Chen

Inventor： Michael Lockard ,  Dannis Smalley ,  Willa Larsen ,  Richard Chen

IPC: B05D5/12 ,  B44C1/22

CPC classification number: C25D1/003 ,  B33Y10/00 ,  C23C18/1605 ,  C23C18/1657 ,  C25D5/022 ,  C25D5/10 ,  H01L21/7682 ,  H01L21/76838

Abstract: Embodiments of the present invention provide mesoscale or microscale three-dimensional structures (e.g. components, device, and the like). Embodiments relate to one or more of (1) the formation of such structures which incorporate sheets of dielectric material and/or wherein seed layer material used to allow electrodeposition over dielectric material is removed via planarization operations; (2) the formation of such structures wherein masks used for at least some selective patterning operations are obtained through transfer plating of masking material to a surface of a substrate or previously formed layer, and/or (3) the formation of such structures wherein masks used for forming at least portions of some layers are patterned on the build surface directly from data representing the mask configuration, e.g. in some embodiments mask patterning is achieved by selectively dispensing material via a computer controlled inkjet nozzle or array or via a computer controlled extrusion device.