公开(公告)号：US09955055B2

公开(公告)日：2018-04-24

申请号：US15460207

申请日：2017-03-15

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu Wang ,  Bojie Zhao ,  Zhenyu Chen ,  Takehiko Tanaka ,  Nan Guo ,  Zhen Huang ,  Duanliang Cheng ,  Liang Ding ,  Feifan Chen ,  Heng Jiang

IPC: H04N5/225 ,  H05K1/18 ,  H05K1/02 ,  G02B3/00 ,  G02B7/00

CPC classification number: H04N5/2257 ,  G02B3/0075 ,  G02B7/006 ,  G02B7/021 ,  G02B13/001 ,  G02B13/004 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2258 ,  H04N5/247 ,  H05K1/0274 ,  H05K1/18 ,  H05K3/284 ,  H05K2201/10121 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

公开(公告)号：US20180012923A1

公开(公告)日：2018-01-11

申请号：US15705225

申请日：2017-09-14

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: H01L27/146

CPC classification number: G02B7/021 ,  B29C45/14639 ,  B29L2031/3481 ,  G02B3/0075 ,  G02B5/201 ,  G02B7/006 ,  G02B13/001 ,  G02B13/004 ,  H01L21/565 ,  H01L25/0655 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H04M1/0264 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/2258 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/183 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0175 ,  H05K2201/09036 ,  H05K2201/10121

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.