公开(公告)号：US20060050497A1

公开(公告)日：2006-03-09

申请号：US11007551

申请日：2004-12-08

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H05K1/14

CPC classification number: G11C5/04 ,  H01L23/34 ,  H01L23/36 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2224/0401

Abstract: Multiple fully buffered DIMM circuits or instantiations are presented in a single module. In a preferred embodiment, memory integrated circuits (preferably CSPs) and accompanying AMBs are arranged in two ranks in two fields on each side of a flexible circuit. The flexible circuit has expansion contacts disposed along one side. The flexible circuit is disposed about a supporting substrate or board to place one complete FB-DIMM circuit or instantiation on each side of the constructed module. In alternative but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers. Other embodiments may stagger or offset the ICs or include greater numbers of ICs.

公开(公告)号：US20060049512A1

公开(公告)日：2006-03-09

申请号：US11173450

申请日：2005-07-01

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H01L23/34

CPC classification number: G11C5/04 ,  H01L23/34 ,  H01L23/36 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2224/0401

Abstract: A flex circuit populated with integrated circuits on one or both sides and in one or more fields along the flex circuitry is wrapped about an edge of a supporting substrate. One side of the flex circuitry has a connective facility implemented in a preferred embodiment with edge connector contacts such as those that would allow the resulting module to be connected to an expansion socket. In a preferred embodiment, integrated circuits (preferably memory CSPs) and any accompanying circuitry or buffers are arranged on one or both sides of a flexible circuit. In some embodiments, one or more thermal sensors or other indicators are thermally coupled to the module substrate. In some embodiments that employ a metallic material substrate with extensions, the ICs of the module have exhibited reduced temperature variations when compared to like capacity DIMMs devised according to the well known planar strategy.

Abstract translation: 在柔性电路的一侧或两侧以及一个或多个场中填充有集成电路的柔性电路围绕支撑衬底的边缘缠绕。 柔性电路的一侧具有在优选实施例中实现的连接设备，其具有边缘连接器触点，例如将允许所得到的模块连接到扩展插座的连接器触点。 在优选实施例中，集成电路（优选存储器CSP）和任何伴随的电路或缓冲器布置在柔性电路的一侧或两侧。 在一些实施例中，一个或多个热传感器或其它指示器热耦合到模块基板。 在采用具有延伸部分的金属材料基板的一些实施例中，与根据众所周知的平面策略设计的类似容量的DIMM相比，模块的IC具有降低的温度变化。

公开(公告)号：US20060049500A1

公开(公告)日：2006-03-09

申请号：US11058979

申请日：2005-02-16

Applicant: Paul Goodwin

Inventor： Paul Goodwin

IPC: H01L23/02

CPC classification number: G11C5/04 ,  H01L2224/16225 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572

Abstract: Modules with larger areas for device mounting but minimized profiles are provided. In preferred embodiments, modules that employ one or more flex circuits have sculpted supportive substrates to selectively accommodate larger or taller profile devices. In several preferred embodiments, higher profile circuits such as AMBs, for example, are disposed in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. In other preferred embodiments, both the substrate and the flexible circuitry have openings into which a device of greater profile such as, for example, an AMB or a logic device with or without a resident heat sink are provided with a volume to occupy without adding the full profile of the taller device to the profile of the module itself.

Abstract translation: 提供了更大面积的模块，用于器件安装，但最小化配置文件。 在优选实施例中，采用一个或多个柔性电路的模块具有雕刻的支撑衬底以选择性地容纳更大或更高的轮廓设备。 在几个优选实施例中，例如，诸如AMB的更高轮廓的电路被布置在优选实施例中，衬底中的窗口，凹部或切口区域是什么。 在其它优选实施例中，基板和柔性电路都具有开口，其中具有较大轮廓的装置（例如AMB或具有或不具有驻留散热器的逻辑装置）具有容积以便占据而不增加 更高的设备的完整配置文件到模块本身的配置文件。

公开(公告)号：US20060048385A1

公开(公告)日：2006-03-09

申请号：US11242962

申请日：2005-10-04

Applicant: James Cady ,  James Wehrly ,  Paul Goodwin

Inventor： James Cady ,  James Wehrly ,  Paul Goodwin

IPC: H01R43/02

CPC classification number: G11C5/143 ,  G11C5/04 ,  H01L23/5387 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/50 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  Y10T29/4913 ,  Y10T29/49179 ,  H01L2924/00

Abstract: Flexible circuitry is populated on one or both sides with integrated circuits (ICs) each of which ICs has an IC profile (height). A substantially flat, windowed fixture with a fixture profile less than the IC profiles of the ICs is applied over an IC-populated side of the flexible circuitry causing at least a part of the ICs to emerge from respective fixture windows. Material is removed simultaneously from that portion of the ICs that emerge from the windows to result in lower-profile ICs which, in a preferred embodiment exhibit profiles substantially coincident with the fixture profile established by the upper surface of the fixture. The method is used to advantage in devising circuit modules by disposing the flexible circuitry about a rigid substrate to form the circuit module with a low profile. Some embodiments use substrates that are windowed or have inset areas into which the lower profile CSPs may be set to reach profile requirements.

Abstract translation: 灵活的电路在一侧或两侧安装集成电路（IC），每个IC都具有IC配置文件（高度）。 具有小于IC的IC轮廓的夹具轮廓的基本平坦的窗口固定件被施加在柔性电路的IC填充侧上，导致至少一部分IC从相应的固定窗口出来。 从窗口出现的IC的那部分同时移除材料以产生较小轮廓的IC，其在优选实施例中表现出与由固定装置的上表面确定的夹具轮廓基本一致的轮廓。 该方法用于通过将柔性电路围绕刚性衬底设置以形成具有低轮廓的电路模块来设计电路模块。 一些实施例使用被窗口化或具有插入区域的衬底，下部轮廓CSP可设置到其中以达到轮廓要求。