公开(公告)号：US12101881B2

公开(公告)日：2024-09-24

申请号：US18455782

申请日：2023-08-25

Applicant: Unimicron Technology Corporation

Inventor： Ching-Ho Hsieh ,  Ming-Hsing Wu ,  Kuei-Sheng Wu

IPC: H05K1/14 ,  H01R12/79 ,  H05K1/02

CPC classification number: H05K1/144 ,  H01R12/79 ,  H05K1/028 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/2018

Abstract: A circuit board assembly is provided and includes a first circuit board, a second circuit board and a first connecting module. The first connecting module includes a first connecting wire, a first connector and a second connector. The first circuit board includes a first processor, and the second circuit board includes a second processor. One end of the first connector is connected to one end of the first connecting wire, and the other end of the first connector is connected to the first circuit board. One end of the second connector is connected to the other end of the first connecting wire, and the other end of the second connector is connected to the second circuit board. The first connector is adjacent to the first processor, and the second connector is adjacent to the second processor.

公开(公告)号：US20240237200A1

公开(公告)日：2024-07-11

申请号：US18557010

申请日：2022-01-26

Applicant: NITTO DENKO CORPORATION

Inventor： Makoto TSUNEKAWA

IPC: H05K1/02 ,  H05K3/24

CPC classification number: H05K1/0296 ,  H05K3/245 ,  H05K2201/2018 ,  H05K2203/0228

Abstract: An assembly sheet includes a plurality of wiring circuit boards, a frame, and a reinforcement portion. The wiring circuit board has a support layer, a base insulating layer disposed on a one-surface of the support layer in a thickness direction, and a conductive pattern disposed on a one-surface of the base insulating layer in the thickness direction. The frame supports the wiring circuit board. The reinforcement portion reinforces the frame. The reinforcement portion is disposed on an other-surface of the frame in the thickness direction.

公开(公告)号：US20240155759A1

公开(公告)日：2024-05-09

申请号：US18053167

申请日：2022-11-07

Applicant: International Business Machines Corporation

Inventor： Shawn Anthony Hall ,  Michael Justin Beckley ,  John Michael Cotte

IPC: H05K1/02 ,  H01L23/00 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/0271 ,  H01L24/16 ,  H05K1/181 ,  H05K7/20509 ,  H01L23/147 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10378 ,  H05K2201/10409 ,  H05K2201/2018

Abstract: One or more devices and/or methods provided herein relate to a method for fabricating a filtering electronic device having a co-integrated impedance modification element and signal transmission line. An electronic structure can comprise a circuit board, and a first plate and a second plate retaining the circuit board therebetween, wherein the first plate and the second plate each have a cryogenic thermal contraction rate that is lower than a cryogenic thermal contraction rate of the circuit board. In one or more embodiments, a silicon chip can be physically coupled to the circuit board by a plurality of solder bumps and disposed between the first plate and the second plate.

公开(公告)号：US20230389187A1

公开(公告)日：2023-11-30

申请号：US18320953

申请日：2023-05-19

Applicant: YAZAKI CORPORATION

Inventor： Hidehiko Shimizu

IPC: H05K1/18 ,  H01M50/519 ,  H01M50/505

CPC classification number: H05K1/189 ,  H01M50/519 ,  H01M50/505 ,  H05K2201/10022 ,  H05K2201/10151 ,  H05K2201/10181 ,  H05K2201/10272 ,  H05K2201/2018 ,  H05K2201/10636 ,  H05K2201/2009

Abstract: A conductive module includes: a flexible printed wiring board; an electronic component that is mounted on the flexible printed wiring board and connected to a circuit pattern of the flexible printed wiring board; a metal plate that includes a frame part surrounding the electronic component and being fixed to the flexible printed wiring board; and a potting agent that is filled in a region surrounded by the frame part to cover the electronic component.

公开(公告)号：US11696404B2

公开(公告)日：2023-07-04

申请号：US17139365

申请日：2020-12-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Manho Kim ,  Hwajoong Jung ,  Kihuk Lee ,  Yonghwan Choi

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/14 ,  H05K1/0215 ,  H05K1/0218 ,  H05K1/117 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10378 ,  H05K2201/2018

Abstract: An electronic device is provided. The electronic device includes a first substrate on which a first electrical element and a first conductive structure, which is configured to surround the first electrical element, are disposed, a second substrate on which a second electrical element and a second conductive structure, which is separably connected to the first conductive structure, are disposed, and a connector which is disposed between the first substrate and the second substrate and electrically connects the first electrical element to the second electrical element.

公开(公告)号：US20230156919A1

公开(公告)日：2023-05-18

申请号：US18155269

申请日：2023-01-17

Applicant: LG INNOTEK CO., LTD.

Inventor： Kwang Sung KIM ,  Ji Hwan PARK ,  Yong Tae PARK ,  Beom Seok YU

IPC: H05K1/14 ,  G02B7/02 ,  G03B17/08 ,  G03B17/56 ,  G03B11/04 ,  H04N23/51 ,  H04N23/54 ,  H04N23/55 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/144 ,  G02B7/02 ,  G03B17/08 ,  G03B17/56 ,  G03B11/04 ,  H04N23/51 ,  H04N23/54 ,  H04N23/55 ,  H05K1/0254 ,  H05K1/028 ,  H05K1/147 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/2018

Abstract: A device for fixing a camera module, includes
a base part; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side facing one side of each of the plurality of boards, wherein a plurality of first fixing parts extends in a first direction from the base part, and includes a plurality of protruding parts protruding in the direction perpendicular to the first direction in order to support one side of each of the plurality of boards, and a plurality of second fixing parts extends in the first direction from the base part, and includes a plurality of protruding parts for supporting the other side of each of the plurality of boards.

公开(公告)号：US20190245959A1

公开(公告)日：2019-08-08

申请号：US16344781

申请日：2017-10-24

Applicant: HUIZHOU TCL MOBILE COMMUNICATION CO., LTD

Inventor： Hongbin ZHAN

IPC: H04M1/02 ,  H04M1/23 ,  H04L9/32 ,  G06K9/00 ,  H05K1/02

CPC classification number: H04M1/0277 ,  G06F21/32 ,  G06K9/00013 ,  H04L9/3231 ,  H04M1/026 ,  H04M1/23 ,  H05K1/0283 ,  H05K2201/2018

Abstract: A fingerprint recognition key including a fingerprint recognition module and a flex-rigid printed circuit board is described. The fingerprint recognition module is arranged on one side surface of a first rigid circuit board area of the flex-rigid printed circuit board. A circuit of the fingerprint recognition module is connected to a flexible circuit area of the flex-rigid printed circuit board. A tact switch connected to the flexible circuit area is arranged at a position, corresponding to the position of the fingerprint recognition module, on the other side surface of the rigid circuit board area. A circuit of the flexible circuit area is connected to a circuit of a second rigid circuit board area of the flex-rigid printed circuit board. A mobile terminal and a mobile phone, both including said fingerprint recognition key, are also described.

公开(公告)号：US20180277970A1

公开(公告)日：2018-09-27

申请号：US15923490

申请日：2018-03-16

Applicant: Verily Life Sciences LLC

Inventor： Kedar Shah

IPC: H01R12/52 ,  H01R13/24 ,  H01R13/52 ,  H01R43/20 ,  H05K1/14 ,  H05K1/11 ,  H05K5/00 ,  H05K3/40 ,  H05K3/36 ,  A61B5/00 ,  A61B5/04 ,  A61B17/34 ,  A61N1/05

CPC classification number: H01R12/52 ,  A61B5/0031 ,  A61B5/04001 ,  A61B5/14503 ,  A61B5/14532 ,  A61B5/6846 ,  A61B5/686 ,  A61B17/3468 ,  A61B2560/063 ,  A61B2562/0209 ,  A61B2562/16 ,  A61B2562/227 ,  A61N1/0551 ,  A61N1/3605 ,  A61N1/3752 ,  A61N1/3754 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/2414 ,  H01R13/2421 ,  H01R13/521 ,  H01R13/5219 ,  H01R43/205 ,  H01R2201/12 ,  H05K1/02 ,  H05K1/112 ,  H05K1/144 ,  H05K3/368 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4038 ,  H05K5/0056 ,  H05K5/006 ,  H05K5/0095 ,  H05K2201/0133 ,  H05K2201/042 ,  H05K2201/09163 ,  H05K2201/09409 ,  H05K2201/10265 ,  H05K2201/10371 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/2018 ,  H05K2201/2036

Abstract: An implantable connector for connecting an electronics package and a neural interface is described. The connection between the electronics package and the neural interface is made by way of a set of compressible contacts (e.g., springs) that physical contact a set of corresponding exposed bond pads. The compressible contacts are held in compression with the exposed bond pads using a mechanical coupler. The compressible contacts are physically separated and electrically isolated from each other by way of a compressible gasket. The compressible gasket is also held in compression using the mechanical coupler.

公开(公告)号：US20180184550A1

公开(公告)日：2018-06-28

申请号：US15392934

申请日：2016-12-28

Applicant: Microsoft Technology Licensing, LLC

Inventor： Kurt Allen Jenkins ,  Gary Russell McClary ,  Lincoln Matthew Ghioni

IPC: H05K9/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/10

CPC classification number: H05K9/0032 ,  B29C64/10 ,  B33Y10/00 ,  B33Y80/00 ,  H01L23/552 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/81815 ,  H01L2224/83815 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/0218 ,  H05K1/111 ,  H05K1/115 ,  H05K1/16 ,  H05K1/181 ,  H05K3/10 ,  H05K9/0024 ,  H05K2201/10098 ,  H05K2201/10128 ,  H05K2201/10371 ,  H05K2201/2018 ,  H05K2203/107

Abstract: Printed circuit boards include conductive metallic paths, such as vias, traces, and pads on the printed circuit board. One or more metal additive structures are additively manufactured onto the printed circuit boards in a manner that forms a continuous weld with at least one of the conductive metallic paths. As a result, the metal additive structures are continuous with the printed circuit board and do not require separate attachment mechanisms (e.g., soldering or mechanical fastening). The metal additive structures may include shield cans, frames, antennas, or heat sinks for the printed circuit board, for example.

公开(公告)号：US09999121B2

公开(公告)日：2018-06-12

申请号：US15490012

申请日：2017-04-18

Applicant: Laird Technologies, Inc.

Inventor： Mohammadali Khorrami ,  Paul Francis Dixon ,  George William Rhyne

IPC: H01L23/552 ,  H05K1/02 ,  H05K9/00 ,  H01L23/31 ,  H01L23/64 ,  H01L23/00 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/0216 ,  H01L23/3114 ,  H01L23/552 ,  H01L23/64 ,  H01L23/642 ,  H01L23/645 ,  H01L24/48 ,  H01L24/85 ,  H01L2924/141 ,  H01L2924/1615 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/0233 ,  H05K1/18 ,  H05K3/30 ,  H05K9/0003 ,  H05K9/0028 ,  H05K2201/0707 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: According to various aspects, exemplary embodiments are disclosed of board level shields with virtual grounding capability. In an exemplary embodiment, a board level shield includes one or more resonators configured to be operable for virtually connecting the board level shield to a ground plane or a shielding surface. Also disclosed are exemplary embodiments of methods relating to making board level shields having virtual grounding capability. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate by using a board level shield having virtual grounding capability. Further exemplary embodiments are disclosed of methods relating to making system in package (SiP) or system on chip (SoC) shielded modules and methods relating to providing shielding for one or more components of SiP or SoC module.