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公开(公告)号:US10483387B2
公开(公告)日:2019-11-19
申请号:US15464609
申请日:2017-03-21
Applicant: Sensor Electronic Technology, Inc.
Inventor: Grigory Simin , Mikhail Gaevski , Michael Shur , Remigijus Gaska
IPC: H01L29/778 , H01L29/417 , H01L29/06 , H01L29/20 , H01L29/205
Abstract: A lateral/vertical device is provided. The device includes a device structure including a device channel having a lateral portion and a vertical portion. The lateral portion of the device channel can be located adjacent to a first surface of the device structure, and one or more contacts and/or a gate can be formed on the first surface. The device structure also includes a set of insulating layers located in the device structure between the lateral portion of the device channel and a second surface of the device structure opposite the first surface. An opening in the set of insulating layers defines a transition region between the lateral portion of the device channel and a vertical portion of the device channel. A contact to the vertical portion of the device channel can be located on the second surface.
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公开(公告)号:US10478515B2
公开(公告)日:2019-11-19
申请号:US15622004
申请日:2017-06-13
Applicant: Sensor Electronic Technology, Inc.
Inventor: Michael Shur , Maxim S. Shatalov , Timothy James Bettles , Yuri Bilenko , Saulius Smetona , Alexander Dobrinsky , Remigijus Gaska
Abstract: Ultraviolet radiation is directed within an area. The target wavelength ranges and/or target intensity ranges of the ultraviolet radiation sources can correspond to at least one of a plurality of selectable operating configurations including a virus destruction operating configuration and a bacteria disinfection operating configuration. Each configuration can include a unique combination of the target wavelength range and target intensity range.
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公开(公告)号:US20190336629A1
公开(公告)日:2019-11-07
申请号:US16460006
申请日:2019-07-02
Applicant: Sensor Electronic Technology, Inc.
Inventor: Alexander Dobrinsky , Michael Shur , Remigijus Gaska
Abstract: A solution for cleaning and/or sterilizing one or more surfaces in a bathroom is provided. The sterilization can be performed using ultraviolet sources, which can emit ultraviolet radiation directed onto the surface(s). The cleaning can be performed using a fluid, such as water, that is flowed over the surface(s). The surface(s) can include at least a seat of a toilet and/or other surfaces associated with the toilet.
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公开(公告)号:US10460952B2
公开(公告)日:2019-10-29
申请号:US16022939
申请日:2018-06-29
Applicant: Sensor Electronic Technology, Inc.
Inventor: Maxim S. Shatalov , Jinwei Yang , Wenhong Sun , Rakesh Jain , Michael Shur , Remigijus Gaska
IPC: H01L21/308 , H01L29/20 , H01L21/02 , H01L29/66 , H01L29/15 , H01L33/00 , H01L33/12 , H01L33/22 , H01L33/32
Abstract: A semiconductor structure, such as a group III nitride-based semiconductor structure is provided. The semiconductor structure includes a cavity containing semiconductor layer. The cavity containing semiconductor layer can have a thickness greater than two monolayers and a multiple cavities. The cavities can have a characteristic size of at least one nanometer and a characteristic separation of at least five nanometers.
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公开(公告)号:US10426852B2
公开(公告)日:2019-10-01
申请号:US15853068
申请日:2017-12-22
Applicant: Sensor Electronic Technology, Inc.
Inventor: Alexander Dobrinsky , Michael Shur , Remigijus Gaska , Timothy James Bettles
Abstract: A system capable of detecting and/or sterilizing surface(s) of an object using ultraviolet radiation is provided. The system can include a disinfection chamber and/or handheld ultraviolet unit, which includes ultraviolet sources for inducing fluorescence in a contaminant and/or sterilizing a surface of an object. The object can comprise a protective suit, which is worn by a user and also can include ultraviolet sources for disinfecting air prior to the air entering the protective suit. The system can be implemented as a multi-tiered system for protecting the user and others from exposure to the contaminant and sterilizing the protective suit after exposure to an environment including the contaminant.
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公开(公告)号:US10383964B2
公开(公告)日:2019-08-20
申请号:US15700533
申请日:2017-09-11
Applicant: Sensor Electronic Technology, Inc.
Inventor: Maxim S. Shatalov , Timothy James Bettles , Alexander Dobrinsky , Remigijus Gaska , Michael Shur
Abstract: Ultraviolet radiation is directed within an area. Items located within the area and/or one or more conditions of the area are monitored over a period of time. Based on the monitoring, ultraviolet radiation sources are controlled by adjusting a direction, an intensity, a pattern, and/or a spectral power of the ultraviolet radiation generated by the ultraviolet radiation source. Adjustments to the ultraviolet radiation source(s) can correspond to one of a plurality of selectable operating configurations including a storage life preservation operating configuration, a disinfection operating configuration, and an ethylene decomposition operating configuration.
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公开(公告)号:US10347793B2
公开(公告)日:2019-07-09
申请号:US15784905
申请日:2017-10-16
Applicant: Sensor Electronic Technology, Inc.
Inventor: Alexander Lunev , Maxim S. Shatalov , Alexander Dobrinsky , Michael Shur , Remigijus Gaska
IPC: H01L33/40 , H01L33/38 , H01L33/00 , H01L29/225 , H01L29/205 , H01L31/0336 , H01L29/267 , H01L31/00 , H01L33/14 , H01L31/0224 , H01L33/24 , H01L33/08
Abstract: A contact to a semiconductor layer in a light emitting structure is provided. The contact can include a plurality of contact areas formed of a metal and separated by a set of voids. The contact areas can be separated from one another by a characteristic distance selected based on a set of attributes of a semiconductor contact structure of the contact and a characteristic contact length scale of the contact. The voids can be configured to increase an overall reflectivity or transparency of the contact.
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公开(公告)号:US10314928B2
公开(公告)日:2019-06-11
申请号:US15633118
申请日:2017-06-26
Applicant: Sensor Electronic Technology, Inc.
Inventor: Alexander Dobrinsky , Michael Shur , Remigijus Gaska
Abstract: An ultraviolet (UV) footwear illuminator for footwear treatment is disclosed. In one embodiment, the UV footwear illuminator includes an insert adapted for placement in an article of footwear. At least one UV radiation source is located in the insert and is configured to emit UV radiation in the footwear through a transparent window region formed in the insert. A control unit is configured to control at least one predetermined UV radiation characteristics associated with the radiation emitted from each UV radiation source. A power supply is configured to power each UV radiation source and the control unit.
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公开(公告)号:US10224408B2
公开(公告)日:2019-03-05
申请号:US15601128
申请日:2017-05-22
Applicant: Sensor Electronic Technology, Inc.
Inventor: Mikhail Gaevski , Grigory Simin , Maxim S. Shatalov , Alexander Dobrinsky , Michael Shur , Remigijus Gaska
IPC: H01L33/38 , H01L29/45 , H01L29/20 , H01L21/285 , H01L29/417 , H01L29/778
Abstract: A perforating ohmic contact to a semiconductor layer in a semiconductor structure is provided. The perforating ohmic contact can include a set of perforating elements, which can include a set of metal protrusions laterally penetrating the semiconductor layer(s). The perforating elements can be separated from one another by a characteristic length scale selected based on a sheet resistance of the semiconductor layer and a contact resistance per unit length of a metal of the perforating ohmic contact contacting the semiconductor layer. The structure can be annealed using a set of conditions configured to ensure formation of the set of metal protrusions.
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90.
公开(公告)号:US10211048B2
公开(公告)日:2019-02-19
申请号:US13756806
申请日:2013-02-01
Applicant: Sensor Electronic Technology, Inc.
Inventor: Wenhong Sun , Rakesh Jain , Jinwei Yang , Maxim S. Shatalov , Alexander Dobrinsky , Remigijus Gaska , Michael Shur
Abstract: A solution for fabricating a semiconductor structure is provided. The semiconductor structure includes a plurality of semiconductor layers grown over a substrate using a set of epitaxial growth periods. During each epitaxial growth period, a first semiconductor layer having one of: a tensile stress or a compressive stress is grown followed by growth of a second semiconductor layer having the other of: the tensile stress or the compressive stress directly on the first semiconductor layer. One or more of a set of growth conditions, a thickness of one or both of the layers, and/or a lattice mismatch between the layers can be configured to create a target level of compressive and/or shear stress within a minimum percentage of the interface between the layers.
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