John f
    81.
    发明授权
    John f 失效

    公开(公告)号:US541660A

    公开(公告)日:1895-06-25

    申请号:US541660D

    CPC classification number: B05B1/044 F28F25/04

    Sprinkler
    82.
    发明授权

    公开(公告)号:US486667A

    公开(公告)日:1892-11-22

    申请号:US486667D

    CPC classification number: B05B1/3026 B05B1/044

    LINEAR EVAPORATION SOURCE
    85.
    发明公开

    公开(公告)号:US20240226925A9

    公开(公告)日:2024-07-11

    申请号:US18340429

    申请日:2023-06-23

    CPC classification number: B05B1/24 B05B1/044

    Abstract: The present invention provides a linear evaporation source which receives heat from a crucible such that heat is uniformly distributed while a uniform heat distribution cover is seated on an accommodation case. The provided linear evaporation source includes an accommodation case forming an accommodation space with an open upper side, a crucible accommodated in the accommodation space and configured to discharge a deposition material, and a uniform heat distribution cover configured to cover the accommodation case to uniformly distribute a temperature by receiving heat from the crucible.

    Nozzle apparatus and apparatus for treating substrate

    公开(公告)号:US12017234B2

    公开(公告)日:2024-06-25

    申请号:US17225892

    申请日:2021-04-08

    Inventor: Min Jung Park

    CPC classification number: B05B1/044 B05B3/025 B05C5/0254

    Abstract: A nozzle apparatus may comprise a nozzle body having a nozzle tip with a discharge port for spraying a treatment fluid onto a substrate; a nozzle moving member for moving the nozzle body relative to the substrate; a rotating member for rotating the nozzle body or the nozzle tip so that a treatment fluid is sprayed onto the substrate during rotation; and a control unit configured to control an operation of the nozzle moving member and the rotating member.

    Nozzle and applicator system comprising the same

    公开(公告)号:US11724266B2

    公开(公告)日:2023-08-15

    申请号:US16608824

    申请日:2018-05-09

    Abstract: An applicator system for applying a material to a substrate is disclosed, the applicator system having a nozzle assembly (28) that includes a nozzle having a nozzle head (108). The nozzle assembly (28) also includes a baffle plate (101) including a cutout (144) that extends through the baffle plate (101), where the baffle plate (101) is received by the nozzle head (108) such that the nozzle head (108) and the baffle plate (101) define a cavity. The nozzle assembly (28) further includes a cover plate (102) attached to the nozzle head (108) such that the cover plate (102) secures the baffle plate (101) within the nozzle head (128), where an outlet passage is defined between the baffle plate (101) and the cover plate (102), the outlet passage being fluidly connected to the cavity through the cutout (144) of the baffle plate (101).

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