公开(公告)号：US08786933B2

公开(公告)日：2014-07-22

申请号：US13941851

申请日：2013-07-15

Applicant: Cavendish Kinetics Inc.

Inventor： Charles Gordon Smith ,  Richard L. Knipe

IPC: G02B26/00 ,  G02B26/08 ,  B81C1/00

CPC classification number: G02B26/0833 ,  B81B2201/042 ,  B81C1/00317 ,  B81C2203/0136 ,  B81C2203/0145 ,  G02B26/0841

Abstract: The current disclosure shows how to make a fast switching array of mirrors for projection displays. Because the mirror does not have a via in the middle connecting to the underlying spring support, there is an improved contrast ratio that results from not having light scatter off the legs or vias like existing technologies. Because there are no supporting contacts, the mirror can be made smaller making smaller pixels that can be used to make higher density displays. In addition, because there is not restoring force from any supporting spring support, the mirror stays in place facing one or other direction due to adhesion. This means there is no need to use a voltage to hold the mirror in position. This means that less power is required to run the display.

Abstract translation: 目前的公开内容显示了如何制造用于投影显示器的反射镜的快速切换阵列。 因为反射镜在连接到下面的弹簧支撑件的中间没有通孔，所以具有改善的对比度，这是由于不像现有技术那样从腿部或通孔没有光散射。 因为没有支撑触点，镜子可以做得更小，从而可以用较小的像素来制作更高密度的显示器。 另外，由于没有来自任何支撑弹簧支撑件的恢复力，因为粘附，反射镜保持在面向一个或另一个方向的位置。 这意味着不需要使用电压将镜子保持在适当的位置。 这意味着运行显示器需要较少的电力。

公开(公告)号：US20140197904A1

公开(公告)日：2014-07-17

申请号：US14194592

申请日：2014-02-28

Applicant: Microfabrica Inc.

Inventor： Elliott R. Brown ,  John D. Evans ,  Christopher A. Bang ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley ,  Morton Grosser

IPC: H01P1/202 ,  H01P11/00

CPC classification number: H01P1/202 ,  B33Y10/00 ,  B33Y70/00 ,  B81B2201/042 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H01P11/007 ,  H05K3/4647 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: Multi-layer, multi-material fabrication methods include depositing at least one structural material and at least one sacrificial material during the formation of each of a plurality of layers wherein deposited materials for each layer are planarized to set a boundary level for the respective layer and wherein during formation of at least one layer at least three materials are deposited with a planarization operation occurring before deposition of the last material to set a planarization level above the layer boundary level and wherein a planarization occurs after deposition of the last material level above the layer boundary level and wherein a planarization occurs after deposition of the last material whereby the boundary level for the layer is set. Some formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).

Abstract translation: 多层多材料制造方法包括在形成多个层期间沉积至少一种结构材料和至少一种牺牲材料，其中每层的沉积材料被平坦化以设定各层的边界水平， 其中在形成至少一个层期间，沉积至少三种材料，其中在沉积最终材料之前发生的平坦化操作，以将平坦化水平设置在层边界水平之上，并且其中在沉积层上方的最后材料层之后发生平坦化 并且其中在沉积最后的材料之后发生平坦化，由此设置该层的边界水平。 一些形成方法使用电化学制造技术（例如包括选择性沉积，体积沉积，蚀刻操作和平面化操作）和后沉积工艺（例如选择性蚀刻操作和/或反向填充操作）。

公开(公告)号：US08775107B2

公开(公告)日：2014-07-08

申请号：US13526192

申请日：2012-06-18

Applicant: Alok Govil ,  Kostadin Djordjev ,  Alan Lewis ,  Wilhelmus Johannes Robertus Van Lier

Inventor： Alok Govil ,  Kostadin Djordjev ,  Alan Lewis ,  Wilhelmus Johannes Robertus Van Lier

IPC: G06F19/00 ,  B81C99/00 ,  G09G3/00 ,  G09G3/34 ,  G09G5/00

CPC classification number: B81C99/0045 ,  B81B2201/042 ,  G01R19/0046 ,  G02B26/001 ,  G09G3/006 ,  G09G3/346 ,  G09G5/003 ,  G09G2310/061 ,  G09G2320/0693

Abstract: Methods and devices to measure voltage margins of electromechanical devices are disclosed. The voltage margins are determined based on responses to test voltages which cause the devices to change states. State changes of the devices are detected by monitoring integrated current or charge used to drive the devices with the test voltages.

Abstract translation: 公开了用于测量机电装置的电压裕度的方法和装置。 电压裕度是基于对导致器件改变状态的测试电压的响应来确定的。 通过监测用于用测试电压驱动设备的集成电流或电荷来检测器件的状态变化。

公开(公告)号：US08743449B2

公开(公告)日：2014-06-03

申请号：US13148019

申请日：2010-06-01

Applicant: Huikai Xie ,  Kemiao Jia

Inventor： Huikai Xie ,  Kemiao Jia

IPC: G02B26/00 ,  G02B26/08 ,  B29D11/00

CPC classification number: G02B26/0841 ,  B81B3/0062 ,  B81B2201/042 ,  G02B26/0866

Abstract: Embodiments of the subject invention relate to micromirror devices and methods of fabricating a micromirror/micromirror array. According to an embodiment, micromirrors can be fabricated from a semiconductor substrate where after forming actuators and bonding pads on a front side of the semiconductor substrate, the device is flipped over to have a portion of the back side of the substrate removed and formed to become the mirror plate surface. The subject micromirrors can allow further miniaturization of endoscopes and other optical applications without sacrificing the optical aperture through their surface mounting capabilities.

Abstract translation: 本发明的实施例涉及微镜器件和制造微镜/微镜阵列的方法。 根据实施例，微镜可以由半导体衬底制造，其中在半导体衬底的前侧形成致动器和接合焊盘之后，将器件翻转以使衬底背面的一部分移除并形成为 镜面表面。 本体微镜可以允许内窥镜和其他光学应用的进一步小型化，而不会通过其表面安装能力牺牲光学孔径。

公开(公告)号：US08741692B1

公开(公告)日：2014-06-03

申请号：US13233979

申请日：2011-09-15

Applicant: Yee-Chung Fu

Inventor： Yee-Chung Fu

IPC: H01L21/00

CPC classification number: B81C1/00301 ,  B81B2201/0271 ,  B81B2201/042 ,  B81B2203/0136 ,  B81B2207/096 ,  B81C2203/0118

Abstract: A method for forming semiconductor devices with wafer-level packaging (WLP) includes providing a silicon-on-insulator (SOI) substrate, forming a mask on a silicon layer of the SOI substrate, etching the silicon layer through openings in the mask to form elements initially bonded to but later released from an insulator layer of the SOI substrate, bonding a support substrate to the silicon layer, depositing metal over through holes in the support substrate to contact the silicon layer, and singulating the semiconductor devices from the bonded SOI substrate and the support substrate. The support substrate defines depressions opposite the elements so the elements are not bonded to the support substrate. Each semiconductor device includes a hermetically sealed package having a portion of the SOI substrate and a portion of the support substrate.

Abstract translation: 用于形成具有晶片级封装（WLP）的半导体器件的方法包括提供绝缘体上硅（SOI）衬底，在SOI衬底的硅层上形成掩模，通过掩模中的开口蚀刻硅层以形成 元件最初被结合到SOI衬底的绝缘体层上，然后从SOI衬底的绝缘体层释放，将支撑衬底粘合到硅层上，在支撑衬底中的通孔上沉积金属以接触硅层，以及从结合的SOI衬底分离半导体器件 和支撑基板。 支撑衬底限定与元件相对的凹陷，因此元件不与支撑衬底结合。 每个半导体器件包括具有SOI衬底的一部分和支撑衬底的一部分的气密密封封装。

公开(公告)号：US20140126031A1

公开(公告)日：2014-05-08

申请号：US14070732

申请日：2013-11-04

Applicant: ASIA PACIFIC MICROSYSTEMS, INC.

Inventor： Jer-Wei Hsieh ,  Han-Tang Su

IPC: B81C1/00 ,  G02B26/08

CPC classification number: B81C1/00603 ,  B81B2201/042 ,  B81B2203/0136 ,  B81C1/0015 ,  G02B26/0833

Abstract: In a method for fabricating a self-aligned vertical comb drive structure, a multi-layer structure is first formed. The multi-layer structure includes inter-digitated first and second comb structures formed via etching using a first mask layer as a mask. The first comb structure includes a plurality of first comb fingers, each having a first finger portion formed in a first device layer and a second finger portion formed in a second device layer and separated from the first finger portion by a self-aligned pattern on a stop layer. The second comb structure includes a plurality of second comb fingers formed solely in the second device layer. The second finger portions of the first comb fingers are subsequently removed.

Abstract translation: 在制造自对准垂直梳状驱动结构的方法中，首先形成多层结构。 多层结构包括使用第一掩模层作为掩模通过蚀刻形成的经数字化的第一和第二梳状结构。 第一梳结构包括多个第一梳指，每个第一梳指具有形成在第一器件层中的第一指部和形成在第二器件层中的第二指部，并且在第一器件层上分离自对准图案 停止层。 第二梳结构包括仅在第二器件层中形成的多个第二梳指。 随后去除第一梳齿的第二手指部分。

公开(公告)号：US08681407B2

公开(公告)日：2014-03-25

申请号：US13581837

申请日：2011-03-24

Applicant: Soichiro Hiraoka ,  Kazuki Komaki ,  Masaki Tada ,  Shigeo Furukawa ,  Kiyomi Furukawa ,  Shinsuke Nakazono ,  Yuta Yamamoto ,  Toshiaki Horie

Inventor： Soichiro Hiraoka ,  Kazuki Komaki ,  Masaki Tada ,  Shigeo Furukawa ,  Kiyomi Furukawa ,  Shinsuke Nakazono ,  Yuta Yamamoto ,  Toshiaki Horie

IPC: G02B26/08

CPC classification number: G02B26/0833 ,  B81B3/0051 ,  B81B2201/042

Abstract: An optical reflection element has a frame, a pair of meandering-shaped vibration elements, a mirror having a reflection surface, and a pair of protective beams. The vibration elements have their respective outer ends supported by confronting portions of an inside of the frame. The vibration elements support the mirror with respective inner ends thereof. The protective beams extend from the respective confronting portions of the inside of the frame toward the mirror with a predetermined space from the vibration elements and in parallel with a vibration axis of the vibration elements.

Abstract translation: 光反射元件具有框架，一对曲折形状的振动元件，具有反射面的反射镜和一对保护光束。 振动元件的各自的外端由框架内部的相对部分支撑。 振动元件支撑着镜子的相应内端。 保护梁从振动元件的预定空间与振动元件的振动轴线平行地从框架内部的相应的相对部分向镜子延伸。

公开(公告)号：US20140078568A1

公开(公告)日：2014-03-20

申请号：US14026468

申请日：2013-09-13

Applicant: Cornell University

Inventor： Amit Lal ,  Serhan M. Ardanuc

IPC: G02B7/182

CPC classification number: G02B7/1821 ,  B81B3/0054 ,  B81B2201/042 ,  B81B2203/058 ,  F24S23/80 ,  F24S30/452 ,  F24S2023/85 ,  G02B7/182 ,  G02B26/0841 ,  H01L31/0543 ,  H01L31/0547 ,  Y02E10/47 ,  Y02E10/52

Abstract: A system 120 for reflecting or redirecting incident light, microwave or sound energy includes a first substrate 144 configured to support an array of reflective elements 130 that can be angularly displaced through a range of substantially 90 degrees in response to a reflector angle control signal and a controller programmed to generate the reflector angle control signal to achieve desired incident energy beam or wavefront re-direction. The reflective elements 130 preferably comprise MEMS micro-reflector elements hingedly or movably attached to the first substrate 130 and define a reflective surface that is aimed at the source of incident light, microwave or sound energy.

Abstract translation: 用于反射或重定向入射光，微波或声能的系统120包括第一衬底144，第一衬底144被配置为支撑反射元件阵列130，反射元件阵列130可以响应于反射器角度控制信号角度地移位大致90度的范围， 控制器被编程以产生反射器角度控制信号，以实现期望的入射能量束或波前重新定向。 反射元件130优选地包括MEMS微反射器元件，其铰接地或可移动地附接到第一基板130并且限定针对入射光源，微波或声能源的反射表面。

公开(公告)号：US20130301102A1

公开(公告)日：2013-11-14

申请号：US13946072

申请日：2013-07-19

Applicant: OLYMPUS CORPORATION

Inventor： Yoshitaka KAMIYA ,  Yoshitaka SAKATA

IPC: G02B26/08

CPC classification number: G02B26/08 ,  B81B3/0048 ,  B81B2201/042 ,  B81B2203/0109 ,  B81B2203/0163 ,  B81B2203/058 ,  G02B26/0833

Abstract: An optical deflector includes a movable portion having a mirror plane, a fixed portion, a pair of combined torsion bars connecting the movable portion and the fixed portion to each other so that the movable portion can be rotationally displaced about a rotation axis with respect to the fixed portion, and a driver to drive the movable portion. Each combined torsion bar includes a plurality of torsion bars extending to be parallel to the rotation axis and a plurality of connecting bars, each of the connecting bars connecting one ends of each adjacent two of the torsion bars to each other. A torsion bar farther from the rotation axis has higher torsional rigidity than a torsion bar closer to the rotation axis.

Abstract translation: 光学偏转器包括具有镜面的可动部分，固定部分，将可动部分和固定部分彼此连接的一对组合扭杆，使得可动部分能够相对于旋转轴线旋转移位 固定部分和用于驱动可动部分的驱动器。 每个组合的扭杆包括延伸成平行于旋转轴线的多个扭杆和多个连接杆，每个连接杆将每个相邻的两个扭杆的一端彼此连接。 离旋转轴更远的扭杆具有比靠近旋转轴的扭力杆更高的扭转刚度。

公开(公告)号：US08570632B2

公开(公告)日：2013-10-29

申请号：US13085001

申请日：2011-04-12

Applicant: Soichi Owa ,  Junji Suzuki

Inventor： Soichi Owa ,  Junji Suzuki

IPC: G02B7/182 ,  G02B26/08

CPC classification number: G02B26/0841 ,  B81B3/0051 ,  B81B2201/042 ,  B81B2203/053 ,  B81B2203/058 ,  G02B26/001 ,  G03F7/70291 ,  G03F7/70825 ,  Y10S359/90

Abstract: A pair of support members each having a spring section in a part thereof support a mirror element, and a pair of drive mechanisms arranged respectively corresponding to a pair of the support members transform the spring sections of the corresponding support members, thereby changing a distance between each of support points at which the support members support the mirror element and a base. Accordingly, the mirror element can be translated by driving all of the drive mechanisms, or the mirror element can be inclined with respect to the base by driving some of the drive mechanisms.

Abstract translation: 在其一部分中具有弹簧部分的一对支撑构件支撑反射镜元件，并且分别对应于一对支撑构件设置的一对驱动机构使相应的支撑构件的弹簧部分变换，从而改变 每个支撑点支撑构件支撑镜子元件和基座。 因此，可以通过驱动所有的驱动机构来平移镜元件，或者通过驱动一些驱动机构，镜元件可以相对于基座倾斜。