公开(公告)号：US20070242341A1

公开(公告)日：2007-10-18

申请号：US11734730

申请日：2007-04-12

Applicant: Bangalore Natarajan ,  Surya Ganti

Inventor： Bangalore Natarajan ,  Surya Ganti

IPC: G02B26/00

CPC classification number: G02B27/0006 ,  B81B2201/047 ,  B81C1/00285 ,  B81C2203/0145 ,  B81C2203/019 ,  B81C2203/032 ,  G02B26/001 ,  G02B26/0841

Abstract: A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to the transparent substrate with a seal. The interferometric modulator array may be exposed to the surrounding environment through an opening in either the backplate or the seal.

Abstract translation: 描述了用于MEMS器件的封装结构和封装方法。 示出了其上形成有干涉式调制器阵列的透明基板。 单层或双层背板通过密封接合到透明基板上。 干涉式调制器阵列可以通过背板或密封件中的开口暴露于周围环境。

公开(公告)号：US20070155051A1

公开(公告)日：2007-07-05

申请号：US11321134

申请日：2005-12-29

Applicant: Chun-Ming Wang ,  Jeffrey Lan ,  Teruo Sasagawa

Inventor： Chun-Ming Wang ,  Jeffrey Lan ,  Teruo Sasagawa

IPC: H01L21/00

CPC classification number: B81C1/00047 ,  B81B2201/047 ,  B81C2201/0108 ,  B81C2201/0111 ,  G02B26/001

Abstract: MEMS devices (such as interferometric modulators) may be fabricated using a sacrificial layer that contains a heat vaporizable polymer to form a gap between a moveable layer and a substrate. One embodiment provides a method of making a MEMS device that includes depositing a polymer layer over a substrate, forming an electrically conductive layer over the polymer layer, and vaporizing at least a portion of the polymer layer to form a cavity between the substrate and the electrically conductive layer. Another embodiment provides a method for making an interferometric modulator that includes providing a substrate, depositing a first electrically conductive material over at least a portion of the substrate, depositing a sacrificial material over at least a portion of the first electrically conductive material, depositing an insulator over the substrate and adjacent to the sacrificial material to form a support structure, and depositing a second electrically conductive material over at least a portion of the sacrificial material, the sacrificial material being removable by heat-vaporization to thereby form a cavity between the first electrically conductive layer and the second electrically conductive layer.

Abstract translation: 可以使用包含热可汽化聚合物以在可移动层和基底之间形成间隙的牺牲层来制造MEMS器件（例如干涉式调制器）。 一个实施例提供了一种制造MEMS器件的方法，该MEMS器件包括在衬底上沉积聚合物层，在聚合物层上形成导电层，并蒸发聚合物层的至少一部分以在衬底和电 导电层。 另一个实施例提供了制造干涉式调制器的方法，该方法包括提供衬底，在衬底的至少一部分上沉积第一导电材料，在第一导电材料的至少一部分上沉积牺牲材料，沉积绝缘体 在所述衬底上并且邻近所述牺牲材料以形成支撑结构，以及在所述牺牲材料的至少一部分上沉积第二导电材料，所述牺牲材料可通过热蒸发而被去除，从而在所述第一电 导电层和第二导电层。

公开(公告)号：US20070139655A1

公开(公告)日：2007-06-21

申请号：US11313436

申请日：2005-12-20

Applicant: Qi Luo

Inventor： Qi Luo

IPC: G01C19/72

CPC classification number: G02B26/001 ,  B81B3/007 ,  B81B2201/047 ,  B81C2203/0163

Abstract: Methods and apparatus for reducing back-glass deflection in an interferometric modulator display device are provided. In one embodiment, an interferometric modulator display is provided that includes a including a substrate, an optical stack formed on the substrate, a moveable reflective layer formed over the optical stack, and a backplate attached to the substrate. The moveable reflective layer includes one or more first posts extending therefrom, in which one or more of the first posts are operable to protect the moveable reflective layer by contacting at least a portion of the backplate if the backplate is deflected.

Abstract translation: 提供了用于减少干涉式调制器显示装置中的后玻璃偏转的方法和装置。 在一个实施例中，提供了一种干涉式调制器显示器，其包括衬底，形成在衬底上的光学叠层，在光学堆叠上形成的可移动反射层，以及附接到衬底的背板。 可移动反射层包括从其延伸的一个或多个第一柱，其中一个或多个第一柱可操作以通过接触背板的至少一部分而保护可移动反射层，如果背板偏转。

公开(公告)号：US20070137989A1

公开(公告)日：2007-06-21

申请号：US10583719

申请日：2004-12-23

Applicant: Claire Divoux ,  Marie-Helene Vaudaine ,  Thierry Enot

Inventor： Claire Divoux ,  Marie-Helene Vaudaine ,  Thierry Enot

IPC: H01H13/72

CPC classification number: G02B26/085 ,  B81B2201/038 ,  B81B2201/047 ,  B81B2203/0127 ,  B81B2203/0361 ,  B81C1/00626 ,  B81C2201/0136 ,  G02B26/0833 ,  G02B26/0841 ,  Y10S29/016 ,  Y10S438/924 ,  Y10T29/42

Abstract: The invention relates to a method for making an actuation system for an optical component comprising: etching of a first face of a component, to form pads on it, etching of a second face of the component, to expose a membrane made of the same material as the pads, production of the actuation means of the pads and the membrane.

Abstract translation: 本发明涉及一种用于制造光学部件的致动系统的方法，包括：蚀刻部件的第一面，在其上形成焊盘，蚀刻部件的第二面，暴露由相同材料制成的膜 作为垫，制造垫和膜的致动装置。

公开(公告)号：US20070053051A1

公开(公告)日：2007-03-08

申请号：US10539388

申请日：2003-11-20

Applicant: Dirk Broer ,  Grietje Mol ,  Christiane De Witz

Inventor： Dirk Broer ,  Grietje Mol ,  Christiane De Witz

IPC: G02F1/01

CPC classification number: B29C37/0053 ,  B29C33/42 ,  B29C43/021 ,  B29C2035/0827 ,  B29L2011/0016 ,  B29L2031/756 ,  B81B3/0035 ,  B81B2201/047 ,  B81C2201/034

Abstract: The invention relates to a micro-mechanical thermal structure for modulating a light beam and a method for manufacturing such a structure. The micro-mechanical structure comprises two layers of material with different thermal expansion coefficients in a first direction and a second direction respectively, in which the first direction is transverse to the second direction and the two layers comprise an oriented polymer and the director of the molecules of the oriented polymer of the first layer is transverse to the director of the molecules of the oriented polymer of the second layer. An array of such micro-mechanical structures may form a thermo-optical modulator for modulating light. The method comprises a step of providing a mold with an orientation-inducing layer to obtain a molecular orientation in a mono-meric state of liquid crystalline monomers and a step of fixing the molecular orientation by photo-polymerization.

Abstract translation: 本发明涉及用于调制光束的微机械热结构及其制造方法。 微机械结构包括在第一方向和第二方向上分别具有不同热膨胀系数的两层材料，其中第一方向横向于第二方向，并且两层包括取向聚合物和分子的导向体 的第一层的取向聚合物横向于第二层的取向聚合物的分子的导向体。 这种微机械结构的阵列可以形成用于调制光的热光调制器。 该方法包括提供具有取向诱导层以获得液晶单体的单体状态的分子取向的模具和通过光聚合固定分子取向的步骤的步骤。

公开(公告)号：US20070042524A1

公开(公告)日：2007-02-22

申请号：US11506600

申请日：2006-08-18

Applicant: Lior Kogut ,  Chengbin Qiu ,  Chun-Ming Wang ,  Stephen Zee ,  Fan Zhong

Inventor： Lior Kogut ,  Chengbin Qiu ,  Chun-Ming Wang ,  Stephen Zee ,  Fan Zhong

IPC: H01L21/00

CPC classification number: G02B26/0841 ,  B81B3/0072 ,  B81B2201/047 ,  B81B2203/0163 ,  B81B2203/019 ,  B81B2203/0307 ,  B81B2203/053 ,  B81C1/00142 ,  B81C1/00666 ,  B81C2201/0167 ,  G02B26/001 ,  Y10S359/90

Abstract: Embodiments of MEMS devices include support structures having substantially vertical sidewalls. Certain support structures are formed through deposition of self-planarizing materials or via a plating process. Other support structures are formed via a spacer etch. Other MEMS devices include support structures at least partially underlying a movable layer, where the portions of the support structures underlying the movable layer include a convex sidewall. In further embodiments, a portion of the support structure extends through an aperture in the movable layer and over at least a portion of the movable layer.

Abstract translation: MEMS器件的实施例包括具有基本垂直侧壁的支撑结构。 通过沉积自平面化材料或通过电镀工艺形成某些支撑结构。 通过间隔物蚀刻形成其它支撑结构。 其它MEMS器件包括至少部分在可移动层下方的支撑结构，其中可移动层下面的支撑结构的部分包括凸形侧壁。 在另外的实施例中，支撑结构的一部分延伸穿过可移动层中的孔并且在可移动层的至少一部分上方延伸。

公开(公告)号：US20070020948A1

公开(公告)日：2007-01-25

申请号：US11533495

申请日：2006-09-20

Applicant: Arthur Piehl ,  James Przybyla ,  Adam Ghozeil ,  Eric Martin

Inventor： Arthur Piehl ,  James Przybyla ,  Adam Ghozeil ,  Eric Martin

IPC: H01L21/31 ,  H01L21/469

CPC classification number: G09G3/3466 ,  B81B3/0008 ,  B81B2201/047 ,  G02B1/11 ,  G02B26/001 ,  G09G2300/06

Abstract: An electronic device of an embodiment of the invention is disclosed that at least partially displays a pixel of a display image. The device includes a first reflector and a second reflector defining an optical cavity therebetween that is selective of a visible wavelength at an intensity. The device includes a mechanism to allow optical properties of the cavity to be varied such that the visible wavelength and/or the intensity are variably selectable in correspondence with the pixel of the displayable image. The device also includes one or more transparent deposited films, one or more absorbing layers, an integral micro-lens, and/or one or more anti-stiction bumps. The deposited films are over one of the reflectors, for self-packaging of the device. The absorbing layers are over one of the reflectors, to reduce undesired reflections. The integral micro-lens is over one of the reflectors, and the anti-stiction bumps are between the reflectors.

Abstract translation: 公开了本发明的实施例的电子设备，其至少部分地显示显示图像的像素。 该装置包括第一反射器和第二反射器，其在其间限定光学腔，其具有在强度下的可见波长的选择性。 该装置包括允许空腔的光学特性变化的机构，使得可视波长和/或强度可变地与可显示图像的像素相对应地选择。 该装置还包括一个或多个透明沉积膜，一个或多个吸收层，整体微透镜和/或一个或多个抗静电凸块。 沉积的膜位于一个反射器上，用于器件的自包装。 吸收层在一个反射器上方，以减少不期望的反射。 整体微透镜超过一个反射器，并且抗静电凸块在反射器之间。

公开(公告)号：US20070019280A1

公开(公告)日：2007-01-25

申请号：US11490880

申请日：2006-07-21

Applicant: Teruo Sasagawa ,  SuryaPrakash Ganti ,  Mark Miles ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

Inventor： Teruo Sasagawa ,  SuryaPrakash Ganti ,  Mark Miles ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

IPC: G02F1/29 ,  G02B6/00

CPC classification number: G02B26/001 ,  B81B3/007 ,  B81B2201/047 ,  B81B2203/0307 ,  B81B2203/053

Abstract: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.

Abstract translation: MEMS器件的实施例包括通过间隙与导电固定层间隔开的导电可移动层，并且由导电可移动层中的上凹部的刚性支撑结构或铆钉支撑，或由导电可移动层中的凹陷下方的柱支撑。 在某些实施例中，铆钉结构的部分延伸穿过可移动层并接触下面的层。 在其他实施例中，用于形成刚性支撑结构的材料也可以用于钝化与MEMS装置电连接的其它暴露的电引线，保护电引线免受损坏或其他干扰。

公开(公告)号：US20060291129A1

公开(公告)日：2006-12-28

申请号：US11472377

申请日：2006-06-22

Applicant: Cedrick Chappaz ,  Claire Divoux

Inventor： Cedrick Chappaz ,  Claire Divoux

IPC: H01H57/00

CPC classification number: G02B26/0841 ,  B81B3/0062 ,  B81B2201/047 ,  B81B2203/04 ,  B81C2201/0109 ,  H02N1/006

Abstract: This invention mainly relates to: an electrostatic actuator, at least one fixed electrode (2) with respect to a substrate (4), at least one flexible electrode (6) arranged facing the substrate, at least one means forming the pivot of the flexible electrode, the said means being fixed to the flexible electrode on its face facing the fixed electrode (2) and made from a conducting material, at least one means of suspension (11) of the flexible electrode, holding the said flexible electrode at rest at a distance from the substrate (4). Another purpose of this invention is a method for making such an actuator.

Abstract translation: 本发明主要涉及：静电致动器，相对于衬底（4）的至少一个固定电极（2），至少一个面向衬底布置的柔性电极（6），形成柔性 电极，所述装置在其面向固定电极（2）的表面上固定到柔性电极，并由导电材料制成，柔性电极的至少一个悬挂装置（11），将所述柔性电极保持静止 距离基板（4）的距离。 本发明的另一个目的是制造这种致动器的方法。

公开(公告)号：US20060220045A1

公开(公告)日：2006-10-05

申请号：US11100104

申请日：2005-04-05

Applicant: Jonathan Doan ,  Terry Tarn

Inventor： Jonathan Doan ,  Terry Tarn

IPC: H01L33/00 ,  H01L23/48

CPC classification number: G02B26/0833 ,  B81B7/0048 ,  B81B2201/047 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A microstructure is packaged with a device substrate of the microstructure being attached to a package substrate. For dissipating possible deformation of the microstructure, which may result in device failure or quality degradation of the microstructure, an adhesive material comprising a compliant adhesive component is applied and positioned between the device substrate and package substrate.

Abstract translation: 微观结构与微结构的装置基板一起包装，所述装置基板附接到封装基板。 为了消散微结构的可能的变形，这可能导致器件故障或微结构的质量下降，包括柔性粘合剂组分的粘合剂材料被施加并定位在器件衬底和封装衬底之间。