公开(公告)号：US20190041285A1

公开(公告)日：2019-02-07

申请号：US16145763

申请日：2018-09-28

Applicant: Kabushiki Kaisha Toshiba

Inventor： Yoshihiko FUJI ,  Michiko HARA ,  Kei MASUNISHI ,  Yoshihiro HIGASHI ,  Shiori KAJI ,  Akiko YUZAWA ,  Akio HORI ,  Tomohiko NAGATA ,  Kazuaki OKAMOTO ,  Kenji OTSU ,  Shotaro BABA

IPC: G01L9/00 ,  A61B5/00 ,  H04R1/46 ,  A61B5/021

CPC classification number: G01L9/0091 ,  A61B5/021 ,  A61B5/6898 ,  A61B2562/0247 ,  A61B2562/12 ,  H04R1/46 ,  H04R15/00 ,  H04R2201/003 ,  H04R2499/11

Abstract: According to one embodiment, a sensor includes a deformable film portion, a first sensing element and a second sensing element. The first sensing element is fixed to the film portion, and includes a first magnetic layer of a first material, a first opposing magnetic layer, and a first intermediate layer. The first intermediate layer is provided between the first magnetic layer and the first opposing magnetic layer. The second sensing element is fixed to the film portion, and includes a second magnetic layer of a second material, a second opposing magnetic layer, and a second intermediate layer. The second material is different from the first material. The second intermediate layer is provided between the second magnetic layer and the second opposing magnetic layer.

公开(公告)号：US20180364274A1

公开(公告)日：2018-12-20

申请号：US16103651

申请日：2018-08-14

Applicant: Sonion Nederland B.V.

Inventor： Eddy Dubbeldeman ,  Raymond Mögelin

IPC: G01P15/08 ,  G01H3/06

CPC classification number: G01P15/0802 ,  G01H3/06 ,  G01H11/00 ,  G01P2015/0882 ,  G10K11/002 ,  G10K11/16 ,  H04R7/04 ,  H04R7/26 ,  H04R17/02 ,  H04R17/10 ,  H04R19/005 ,  H04R19/016 ,  H04R2201/003

Abstract: A vibration sensor having a moveable mass being suspended in a suspension member and being adapted to move in response to vibrations or accelerations. The moveable mass and the suspension member are rigidly connected across one or more gaps formed by respective opposing surfaces of the moveable mass and the suspension member. The vibration sensor includes a damping arrangement having a damping substance. The moveable mass is arranged to interact directly or indirectly with the damping substance in order to reduce a mechanical resonance peak of the vibration sensor.

公开(公告)号：US20180352340A1

公开(公告)日：2018-12-06

申请号：US15987397

申请日：2018-05-23

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Tsjerk Hans HOEKSTRA

IPC: H04R19/04 ,  B81B3/00

CPC classification number: H04R19/005 ,  B81B3/0072 ,  H04R19/04 ,  H04R2201/003

Abstract: The application describes MEMS transducers having a patterned membrane electrode which incorporates a plurality of openings or voids. At least a portion of the peripheral edge of the opening is provided with a plurality of discontinuities e.g. projections and recesses which extend within the plane of the membrane electrode.

公开(公告)号：US20180332390A1

公开(公告)日：2018-11-15

申请号：US16030617

申请日：2018-07-09

Applicant: INVENSENSE, INC.

Inventor： Kieran Harney ,  Adrianus Maria Lafort ,  Brian Moss ,  Dion Ivo De Roo

IPC: H04R3/00 ,  B81B7/00 ,  H02M3/07 ,  H03F3/183 ,  H04R19/00 ,  H03F3/45 ,  H04R3/04 ,  H04R19/04

CPC classification number: H04R3/00 ,  B81B3/0013 ,  B81B7/008 ,  B81B2201/0257 ,  H02M3/07 ,  H03F3/183 ,  H03F3/45071 ,  H03F2200/03 ,  H04R3/04 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

Abstract: Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.

公开(公告)号：US20180332377A1

公开(公告)日：2018-11-15

申请号：US16045372

申请日：2018-07-25

Applicant: Infineon Technologies AG

Inventor： Francesco Polo ,  Richard Gaggl

IPC: H04R1/04 ,  H03F3/50 ,  H03F1/14 ,  H03F3/45

CPC classification number: H04R1/04 ,  H03F1/14 ,  H03F3/45179 ,  H03F3/505 ,  H03F2200/03 ,  H03F2200/151 ,  H03F2200/153 ,  H03F2203/45116 ,  H03F2203/5033 ,  H04R2201/003

Abstract: In accordance with an embodiment, a circuit includes an amplifier and a programmable capacitor coupled between an output of the first non-inverting and the input of the first amplifier.

公开(公告)号：US20180317017A1

公开(公告)日：2018-11-01

申请号：US15769798

申请日：2015-10-21

Applicant: Goertek Inc.

Inventor： Quanbo Zou ,  Zhe Wang ,  Jun Li

IPC: H04R17/00 ,  H04R1/02 ,  H01L41/29 ,  H04R31/00 ,  H01L41/083

CPC classification number: H04R17/00 ,  H04R31/00 ,  H04R2201/003 ,  H04R2201/401 ,  H04R2307/025 ,  H04R2499/11 ,  H04R2499/15

Abstract: A micro-speaker, the manufacturing method thereof, a speaker device and an electronic apparatus are described herein. The micro-speaker comprises a case, wherein the case has an opening; and a piezoelectric layer, wherein one or more electrodes are provided on the piezoelectric layer, and wherein the piezoelectric layer is pre-buckled in its rest position, wherein the piezoelectric layer covers the opening and is bonded onto the case, to form a speaker rear cavity together with the case. The micro-speaker of the present invention has a relatively low speaker profile.

公开(公告)号：US20180302727A1

公开(公告)日：2018-10-18

申请号：US15946590

申请日：2018-04-05

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： James Thomas DEAS

IPC: H04R19/04 ,  H04R19/00 ,  H04R1/04

CPC classification number: H04R19/04 ,  H04R1/04 ,  H04R19/005 ,  H04R2201/003 ,  H04R2410/05 ,  H04R2499/11

Abstract: MEMS devices are disclosed including a MEMS microphone device comprising a first transducer adjoining a sound port, a second transducer not adjoining a sound port, a housing defining a shared volume for the first and second transducers, and circuitry arranged to combine a first signal from the first transducer and a second signal from the second transducer to produce an output signal.

公开(公告)号：US10057690B2

公开(公告)日：2018-08-21

申请号：US14955341

申请日：2015-12-01

Applicant: Hyundai Motor Company

Inventor： Ilseon Yoo

IPC: H04R17/02 ,  H04R19/04 ,  H04R17/00 ,  H04R31/00 ,  H04R1/02

CPC classification number: H04R19/04 ,  B81B2201/0257 ,  H04R1/025 ,  H04R17/005 ,  H04R17/02 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/13

Abstract: A detachable microphone includes: a body part made of a flexible polymer; a capacitance part positioned in the body part and including a support interposed between a first capacitive electrode and a second capacitive electrode; and a piezoelectric part positioned on the capacitance part and positioned in the body part, and including a piezoelectric body interposed between a first piezoelectric electrode and a second piezoelectric electrode.

公开(公告)号：US10057689B2

公开(公告)日：2018-08-21

申请号：US15304058

申请日：2014-08-26

Applicant: GOERTEK INC.

Inventor： Quanbo Zou

IPC: H04R19/00 ,  B81C1/00 ,  B81B3/00 ,  H04R7/14 ,  H04R19/02

CPC classification number: H04R19/005 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00158 ,  H04R7/14 ,  H04R19/02 ,  H04R2201/003

Abstract: The present invention provides a silicon speaker comprising an MEMS acoustoelectric chip and a PCB substrate, wherein the MEMS acoustoelectric chip comprises a corrugated diaphragm on a silicon substrate; and one side surface of the MEMS acoustoelectric chip is metalized, and the metalized side surface of the MEMS acoustoelectric chip is connected with the PCB substrate. The corrugated diaphragm is electrically conductive and interconnected with metal paths on MEMS acoustoelectric chip, which is led out to a first PCB metal path as one electrode. A second PCB metal path below the MEMS chip forms another electrode of the electrostatic actuator. The silicon speaker provided by the present invention lowers manufacturing costs of the speaker, and allows the diaphragm to generate high and repeatable/reliable sound pressure upon large displacements so as to improve the sounding effects of the speaker.

公开(公告)号：US20180234774A1

公开(公告)日：2018-08-16

申请号：US15897946

申请日：2018-02-15

Applicant: Infineon Technologies AG

Inventor： Arnaud Walther ,  Alfons Dehe ,  Gerhard Metzger-Brueckl ,  Johann Strasser ,  Carsten Ahrens

IPC: H04R19/04 ,  B81B3/00 ,  B81C1/00 ,  H04R19/00 ,  H04R31/00

CPC classification number: H04R19/04 ,  B81B3/001 ,  B81B3/0021 ,  B81B3/0072 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0163 ,  B81B2203/04 ,  B81C1/00182 ,  H04R19/005 ,  H04R31/003 ,  H04R2201/003

Abstract: A microelectromechanical microphone includes a reference electrode, a first membrane arranged on a first side of the reference electrode and displaceable by sound to be detected, and a second membrane arranged on a second side of the reference electrode, said second side being situated opposite the first side of the reference electrode, and displaceable by sound to be detected. A region of one from the first and second membranes that is displaceable by sound relative to the reference electrode, independently of said region's position relative to the reference electrode, can comprise a planar section and also an undulatory section adjoining the planar section and arranged in a region of overlap one of the first membrane or the second membrane with the other one of the first membrane and or the second membrane.