公开(公告)号：US5972811A

公开(公告)日：1999-10-26

申请号：US90789

申请日：1998-06-04

Applicant: Michael E. St. Lawrence ,  Doris I. Hand ,  Vincent R. Landi ,  Robert H. Walker ,  Samuel Gazit ,  Raymond R. Miskiavitch

Inventor： Michael E. St. Lawrence ,  Doris I. Hand ,  Vincent R. Landi ,  Robert H. Walker ,  Samuel Gazit ,  Raymond R. Miskiavitch

IPC: C08J5/08 ,  C08J5/10 ,  C08J5/24 ,  C08K3/00 ,  C08K3/10 ,  C08K3/22 ,  C08K3/24 ,  C08K3/34 ,  C08K3/38 ,  C08K3/40 ,  C08K5/00 ,  C08K5/02 ,  C08K5/06 ,  C08K5/3417 ,  C08K7/00 ,  C08K7/02 ,  C08K7/14 ,  C08K7/16 ,  C08K7/20 ,  C08L9/00 ,  C08L21/00 ,  C08L27/18 ,  C08L47/00 ,  C08L53/00 ,  C08L53/02 ,  C08L77/10 ,  H01B3/30 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  B32B7/00

CPC classification number: C08J5/24 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K7/14 ,  C08L9/00 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0373 ,  C08J2309/00 ,  C08L15/00 ,  C08L23/04 ,  C08L53/00 ,  C08L7/00 ,  C08L9/02 ,  C08L9/06 ,  H05K1/0203 ,  H05K1/162 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T442/2934 ,  Y10T442/2992 ,  Y10T442/3423 ,  Y10T442/3431 ,  Y10T442/3455

Abstract: An electrical substrate material is presented comprising a thermosetting matrix of polybutadiene or polyisoprene and a co-curable second resin distinct from the first resin. A peroxide cure initiator and/or crosslinking agent may optionally be added. The presence of a very high surface area particulate filler, preferably fumed silica, is also preferred, in that its presence results in a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. The composition of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated onto one or both opposed surfaces to a metal conductive foil such as copper.

Abstract translation: 提供了一种电气基材材料，其包含聚丁二烯或聚异戊二烯的热固性基质和不同于第一树脂的可共固化的第二树脂。 可以任选地加入过氧化物固化引发剂和/或交联剂。 存在非常高的表面积的颗粒填料，优选热解法二氧化硅也是优选的，因为其存在导致预浸料，其具有非常小的粘性，因此可以容易地由操作者处理。 这种低粘性特征允许使用一种或多种已知的辊式层压机来使用常规的自动铺层处理，包括箔包层。 虽然本发明的预浸料无粘性足以用手相对容易地处理，但是它也是粘性足以在室温下使用辊式层压机（例如夹辊）粘合到其自身上。 本发明的组合物特别适用于制造用于微波和数字电路的电路基板，通常将热固性组合物的形式层压在诸如铜的金属导电箔的一个或两个相对的表面上。

公开(公告)号：US5955184A

公开(公告)日：1999-09-21

申请号：US849179

申请日：1997-05-28

Applicant: Nobuyuki Honda ,  Tsuyoshi Sugiyama ,  Tetsuaki Suzuki

Inventor： Nobuyuki Honda ,  Tsuyoshi Sugiyama ,  Tetsuaki Suzuki

IPC: C08G14/06 ,  C08G59/38 ,  C08G59/40 ,  C08L61/14 ,  C08L61/26 ,  C08L61/34 ,  C08L63/00 ,  H01L23/14 ,  H01L23/29 ,  H05K1/03 ,  B32B7/00

CPC classification number: H05K1/0373 ,  C08G14/06 ,  C08G59/38 ,  C08G59/4071 ,  C08L61/14 ,  C08L61/26 ,  C08L61/34 ,  C08L63/00 ,  H01L23/145 ,  H01L23/293 ,  H01L2924/0002 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10S428/901 ,  Y10S428/921 ,  Y10T428/24994 ,  Y10T428/249946 ,  Y10T428/31518 ,  Y10T428/31522

Abstract: Disclosed in a halogen-free flame-retardant epoxy resin composition, comprising (A) a bisphenol A type epoxy resin, (B) a novolak type epoxy resin, (C) a phenolic resin type curing agent, (D) a curing accelerator, and (E) an inorganic filler. The phenolic resin type curing agent (C) is provided by a nitrogen-containing phenolic resin, preferably, by a co-condensation resin formed by the reaction among a phenolic compound, a guanamine compound, and an aldehyde compound. More desirably, a phenolic resin containing both phosphorus and nitrogen should be used as the curing agent (C). Further, a combination of the co-condensation resin noted above (C-1) and a reactive phosphoric acid ester can be used as a curing agent.

Abstract translation: PCT No.PCT / JP95 / 01988 Sec。 371日期1997年5月28日 102（e）日期1997年5月28日PCT提交1995年9月29日PCT公布。 出版物WO97 / 12925 日期：1997年04月10日公开了一种无卤阻燃环氧树脂组合物，其包含（A）双酚A型环氧树脂，（B）酚醛清漆型环氧树脂，（C）酚醛树脂型固化剂，（D ）固化促进剂，和（E）无机填料。 酚醛树脂型固化剂（C）由含氮酚醛树脂优选由通过酚类化合物，胍胺化合物和醛化合物之间的反应形成的共缩合树脂提供。 更优选使用含有磷和氮的酚醛树脂作为固化剂（C）。 此外，可以使用上述共缩合树脂（C-1）和反应性磷酸酯的组合作为固化剂。

公开(公告)号：US5885723A

公开(公告)日：1999-03-23

申请号：US994965

申请日：1997-12-19

Applicant: Atsushi Takahashi ,  Shinji Ogi ,  Koji Morita ,  Kazunori Yamamoto ,  Ken Nanaumi ,  Kiyoshi Hirosawa ,  Akinari Kida ,  Takao Hirayama ,  Toshihiko Ito ,  Hiroaki Hirakura

Inventor： Atsushi Takahashi ,  Shinji Ogi ,  Koji Morita ,  Kazunori Yamamoto ,  Ken Nanaumi ,  Kiyoshi Hirosawa ,  Akinari Kida ,  Takao Hirayama ,  Toshihiko Ito ,  Hiroaki Hirakura

IPC: C08F283/00 ,  C08F283/04 ,  C08L63/00 ,  H05K3/38 ,  H05K3/46 ,  B32B15/08

CPC classification number: H05K3/386 ,  C08F283/00 ,  C08F283/04 ,  C08L63/00 ,  H05K2201/012 ,  H05K3/4626 ,  Y10S428/901 ,  Y10T428/12569 ,  Y10T428/249921 ,  Y10T428/29 ,  Y10T428/31551 ,  Y10T428/31725

Abstract: Provided is bonding film for printed circuit boards which is resistant to cracking even when bent with a small radius of curvature, has a sufficient mechanical strength even in its semi-cured state so that the handling may be facilitated, is not undesirably brittle and therefore does not produce undesired debris when cut, and is flexible and flame retardant at the same time. The bonding film may consist of (i) high polymer epoxy resin; (ii) denatured polyamide obtained by reacting epoxy resin and polyamide; (iii) polyfunctional epoxy resin; and (iv) curing agent. Preferably, the denatured polyamide includes a polyalkylene-glycol residue or a polycarbonate-diol residue. Preferably, the high polymer epoxy resin is produced by the polymerization of bifunctional epoxy resin and bifunctional phenol resin, and has a weight averaged molecular weight equal to 50,000 or higher.

Abstract translation: 提供即使在弯曲曲率小的情况下即使弯曲也耐龟裂的印刷电路板用接合膜，即使在其半固化状态下也具有足够的机械强度，因此可以容易地进行处理，因此不是不希望的脆性，因此 切割时不产生不希望的碎屑，同时具有柔韧性和阻燃性。 接合膜可以由（i）高分子环氧树脂组成; （ii）使环氧树脂和聚酰胺反应得到的变性聚酰胺; （iii）多官能环氧树脂; 和（iv）固化剂。 优选地，变性聚酰胺包括聚亚烷基二醇残基或聚碳酸酯二醇残基。 优选地，高分子环氧树脂通过双官能环氧树脂和双官能酚醛树脂的聚合制备，并且具有等于50,000或更高的重均分子量。

公开(公告)号：US5571609A

公开(公告)日：1996-11-05

申请号：US322890

申请日：1994-10-13

Applicant: Michael E. St. Lawrence ,  Vincent R. Landi ,  Doris I. Hand ,  Robert H. Walker ,  Samuel Gazit ,  Raymond R. Miskiavitch

Inventor： Michael E. St. Lawrence ,  Vincent R. Landi ,  Doris I. Hand ,  Robert H. Walker ,  Samuel Gazit ,  Raymond R. Miskiavitch

IPC: C08J5/24 ,  C08K3/00 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/00 ,  C08K5/02 ,  C08K7/00 ,  C08K7/14 ,  C08L9/00 ,  C08L21/00 ,  C08L53/00 ,  C08L53/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  B32B7/00

CPC classification number: C08J5/24 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K7/14 ,  C08L9/00 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0373 ,  C08J2309/00 ,  C08L15/00 ,  C08L23/04 ,  C08L53/00 ,  C08L7/00 ,  C08L9/02 ,  C08L9/06 ,  H05K1/0203 ,  H05K1/162 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T442/3431 ,  Y10T442/3569

Abstract: An electrical substrate material is presented which comprises a thermosetting matrix which includes a polybutadiene or polyisoprene resin and an unsaturated butadiene or isoprene containing polymer in an amount of 25 to 50 vol. %; a woven glass fabric in an amount of 10 to 40 vol. %; a particulate, preferably ceramic filler in an amount of from 5 to 60 vol. %; a flame retardant and a peroxide cure initiator. A preferred composition has 18% woven glass, 41% particulate filler and 30% thermosetting matrix. The foregoing component ratios and particularly the relatively high range of particulate filler is an important feature of this invention in that this filled composite material leads to a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. In addition, another important feature of this invention is the low amount of glass fabric filler relative to the higher range of particulate filler which leads to improved (lower) CTE in the Z axis or thickness direction, improved electrical performance (e.g., dissipation factor), lower cost and the ability to tailor dielectric constant through appropriate selection of particulate fillers.

Abstract translation: 提供了一种电气基材材料，其包括热固性基质，其包含聚丁二烯或聚异戊二烯树脂和含量为25至50体积％的不饱和丁二烯或含异戊二烯的聚合物。 ％; 10〜40体积％的编织玻璃织物。 ％; 粒度为5至60体积％的陶瓷填料。 ％; 阻燃剂和过氧化物固化引发剂。 优选的组合物具有18％的玻璃织物，41％的颗粒填料和30％的热固性基质。 上述组分比，特别是颗粒填料的相对高范围是本发明的重要特征，因为该填充的复合材料导致具有非常小的粘性的预浸料，因此可以容易地由操作者处理。 这种低粘性特征允许使用一种或多种已知的辊式层压机来使用常规的自动铺层处理，包括箔包层。 虽然本发明的预浸料无粘性足以用手相对容易地处理，但是它也是粘性足以在室温下使用辊式层压机（例如夹辊）粘合到其自身上。 另外，本发明的另一个重要特征是玻璃织物填料相对于较高范围的颗粒填料的含量较低，这导致在Z轴或厚度方向上改进（降低）CTE，改善了电性能（例如耗散因子） 更低的成本和通过适当选择颗粒填料来调整介电常数的能力。

公开(公告)号：US5308565A

公开(公告)日：1994-05-03

申请号：US14028

申请日：1993-02-05

Applicant: Christian K. Weber ,  Michael G. Minnick

Inventor： Christian K. Weber ,  Michael G. Minnick

IPC: C08G59/40 ,  C08J5/24 ,  C08L63/00 ,  C08L71/12 ,  H05K1/03 ,  B29C67/12

CPC classification number: H05K1/0373 ,  C08J5/24 ,  C08L63/00 ,  C08L71/123 ,  C08L71/12 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251

Abstract: Broadly, the present invention comprises a solventless process wherein blends of thermoset polyphenylene oxide and triallylcyanurates can be processed into fiber reinforced laminates, and especially laminates prepared by the Wiggins Teape process. One aspect of the present inventive process comprises blending the polyphenylene powder with a liquid epoxy material, optionally with flame retardants and catalysts, preferably in a high shear mixer at elevated temperature, e.g. in the range of about 100.degree.-130.degree. C. The resultant upstaged or partially-cured blend is sufficiently solidified to be granulated into a powder for Wiggins Teape processing or, optionally, conventional press processing into a fiber reinforced laminates. Resin systems thus-prepared exhibit both improved solderability resistance and improved resistance to organic solvents when compared to thermoplastic systems.

Abstract translation: 概括地说，本发明包括一种无溶剂方法，其中热固性聚苯醚和三烯丙基氰脲酸酯的共混物可以加工成纤维增强层压材料，特别是通过Wiggins Teape方法制备的层压材料。 本发明方法的一个方面包括将聚亚苯基粉末与液体环氧材料共混，任选地使用阻燃剂和催化剂，优选在高剪切混合器中，例如高温下。 在约100-130℃的范围内。所得的上述或部分固化的共混物充分固化，以造粒成用于Wiggins Teape加工的粉末，或任选地，常规的压制加工成纤维增强层压材料。 如此制备的树脂体系与热塑性体系相比表现出改进的耐焊接性和改善的耐有机溶剂性。

公开(公告)号：US5055138A

公开(公告)日：1991-10-08

申请号：US376651

申请日：1989-07-07

Applicant: David S. L. Slinn

Inventor： David S. L. Slinn

IPC: B08B3/08 ,  B01D12/00 ,  C11D7/26 ,  C11D7/28 ,  C11D7/32 ,  C11D7/50 ,  C11D11/00 ,  C23G5/02 ,  C23G5/028 ,  C23G5/04 ,  F26B21/14 ,  H01L21/304 ,  H05K3/26

CPC classification number: C11D7/261 ,  C11D11/0047 ,  C11D7/5013 ,  C11D7/5018 ,  C23G5/02 ,  C23G5/04 ,  H05K3/26 ,  C11D7/28 ,  C11D7/3209 ,  H05K2201/012 ,  H05K2203/0783 ,  H05K2203/088 ,  H05K2203/1518 ,  Y10S134/902

Abstract: Components, especially of an electronic or electrical type, are cleaned by contact with a flammable liquid organic solvent (21), especially an alcohol. The surface of the solvent is covered with a non-flammable highly fluorinated compound vapor blanket (26), which vapor may also be used to transfer heat to the organic solvent. Both highly fluorinated compound and organic solvent are condensed and re-cycled.

公开(公告)号：US4853423A

公开(公告)日：1989-08-01

申请号：US219106

申请日：1988-07-14

Applicant: Erik W. Walles ,  John H. Lupinski ,  Mark Markovitz ,  Robert E. Colborn ,  James R. Presley ,  Michael J. Davis ,  Michael G. Minnick ,  Steven J. Kubisen, Jr. ,  John E. Hallgren ,  Donald A. Bolon ,  Victoria J. Eddy ,  Patricia C. Irwin

Inventor： Erik W. Walles ,  John H. Lupinski ,  Mark Markovitz ,  Robert E. Colborn ,  James R. Presley ,  Michael J. Davis ,  Michael G. Minnick ,  Steven J. Kubisen, Jr. ,  John E. Hallgren ,  Donald A. Bolon ,  Victoria J. Eddy ,  Patricia C. Irwin

IPC: C08K3/22 ,  C08G59/00 ,  C08G59/06 ,  C08G59/14 ,  C08G59/38 ,  C08G59/50 ,  C08G59/56 ,  C08G59/62 ,  C08G59/68 ,  C08L61/10 ,  C08L63/00 ,  C08L71/12 ,  H05K1/03

CPC classification number: H05K1/0373 ,  C08G59/063 ,  C08G59/38 ,  C08L63/00 ,  C08L71/123 ,  H05K2201/012 ,  H05K2203/121

Abstract: Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

公开(公告)号：US4477512A

公开(公告)日：1984-10-16

申请号：US490061

申请日：1983-04-29

Applicant: Wilbur R. Thomas ,  Fred E. Hickman, III ,  George J. Knight

Inventor： Wilbur R. Thomas ,  Fred E. Hickman, III ,  George J. Knight

IPC: C08L61/00 ,  B32B15/08 ,  B32B15/092 ,  B32B27/04 ,  C08G59/00 ,  C08G59/30 ,  C08G59/32 ,  C08G59/38 ,  C08G59/40 ,  C08G59/62 ,  C08J5/10 ,  C08J5/24 ,  C08L61/04 ,  C08L61/06 ,  C08L63/00 ,  H01B3/40 ,  H05K1/03 ,  B32B5/06

CPC classification number: C08G59/30 ,  B32B27/04 ,  C08G59/32 ,  C08G59/38 ,  C08G59/621 ,  H01B3/40 ,  H05K1/0326 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31989 ,  Y10T442/2992 ,  Y10T442/3439 ,  Y10T442/3813

Abstract: A prepreg useful as the core in flame resistant cooper clad, composite, printed circuit boards is made by impregnating a porous substrate with an impregnant containing: either a brominated epoxy or epoxy resin and reactive flame retarding additive containing bromine and phenolic hydroxyl groups (e.g., tetrabromobisphenol A), phenolic novolac oligomer as curing agent, unsaturated epoxidized oil, and optionally, a suitable catalyst; and then heating the impregnated substrate to the "B"-stage.

Abstract translation: 通过用含有溴化环氧树脂或环氧树脂的浸渍剂和含溴和酚羟基的反应性阻燃添加剂浸渍多孔基材来制备用作阻燃铜包层复合印刷电路板中的核心的预浸料坯（例如， 四溴双酚A），酚醛清漆低聚物作为固化剂，不饱和环氧化油和任选的合适的催化剂; 然后将浸渍的基材加热到“B”级。

公开(公告)号：US20240306355A1

公开(公告)日：2024-09-12

申请号：US18297840

申请日：2023-04-10

Applicant: CYBER POWER SYSTEMS, INC.

Inventor： HO-HSIEN LIN ,  SHU-YI LIAO ,  CHIH-HENG LIN

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K9/0067 ,  H05K1/0259 ,  H05K2201/012 ,  H05K2201/073

Abstract: A surge protection module comprises an upper cover, a lower cover, a printed circuit board assembly (PCBA) and a flame-retardant filler. The lower cover is configured for connecting with the upper cover, and for forming an accommodation space together with the upper cover. At least one through hole is formed at the junction of the lower cover and the upper cover. The PCBA has a plurality of copper traces, and is equipped with at least one surge protection device (SPD). The PCBA further has a plurality of welding structures, and the welding structures are electrically coupled to the SPDs through the copper traces. The PCBA is disposed in the accommodation space, and a part of the PCBA passes through the at least one through hole for exposing the welding structures. The flame-retardant filler is filled in the gap of the accommodation space.

公开(公告)号：US11879049B2

公开(公告)日：2024-01-23

申请号：US17293264

申请日：2018-11-15

Applicant: KYOCERA Corporation

Inventor： Satoshi Kajita ,  Yasuhide Tami

IPC: B32B3/10 ,  C08K13/02 ,  B32B15/08 ,  B32B27/20 ,  C08L45/00 ,  C09K21/08 ,  H01B3/00 ,  H01B3/30 ,  H05K1/03 ,  C08K3/36 ,  C08K5/03 ,  C08K5/14

CPC classification number: C08K13/02 ,  B32B15/08 ,  B32B27/20 ,  C08L45/00 ,  C09K21/08 ,  H01B3/002 ,  H01B3/307 ,  H05K1/0373 ,  B32B2307/3065 ,  B32B2457/08 ,  C08K3/36 ,  C08K5/03 ,  C08K5/14 ,  C08K2201/005 ,  C08L2201/02 ,  C08L2203/30 ,  C08L2205/025 ,  H05K2201/012 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0266

Abstract: A flame retardant is included in a resin phase, and the flame retardant has a maximum number frequency in a range of 1 μm or less when a particle size distribution is evaluated by dividing a particle size into 1 μm increments. The resin phase includes inorganic particles, and the inorganic particles have a maximum number frequency in a range of 0.5 μm or less when the particle size distribution is evaluated by dividing the particle size into 0.5 μm increments. The flame retardant has an average particle size larger than the average particle size of inorganic particles. The number frequency of the flame retardant and the inorganic particles, respectively, decreases with increasing the particle size.