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    SOLDER PASTE
    81.
    发明申请
    SOLDER PASTE 有权
    焊膏

    公开(公告)号：US20020040624A1

    公开(公告)日：2002-04-11

    申请号：US09970036

    申请日：2001-10-04

    Inventor： Sinzo Nakamura ,  Ryoichi Kurata ,  Hiroshi Takahashi

    IPC: C22C013/02

    CPC classification number: H05K3/3484 ,  B22F2998/00 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3613 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3463 ,  H05K2201/0272 ,  C22C1/04

    Abstract: A solder paste comprises a lead-free solder alloy powder and a flux and is suitable for use in reflow soldering of electronic parts at a soldering temperature of 230null C. or below with minimized damage to the electronic parts to form soldered joints of good bond strength. The solder alloy powder is a mixture of from 10 to 30 vol % of a first powder of an SnnullBi alloy consisting essentially of 10-45 wt % of Bi and a balance of Sn and from 70 to 90 vol % of a second powder of an SnnullZn alloy consisting essentially of 9-15 wt % of Zn and a balance of Sn. The mixture gives an alloy having a composition upon melting which consists essentially of 7-11 wt % of Zn, 1-5 wt % of Bi, and a balance of Sn.

    Abstract translation: 焊膏包括无铅焊料合金粉末和焊剂，适用于在230℃或更低的焊接温度下回流焊接电子部件，同时对电子部件的损伤最小化，形成良好焊接的焊接接头 强度。 焊料合金粉末为10〜30体积％的Sn-Bi合金的第一粉末的混合物，其主要由Bi的10-45重量％和余量的Sn和70〜90体积％的第二粉末组成 的基本上由9-15重量％的Zn和余量的Sn组成的Sn-Zn合金。 混合物得到熔融组成的合金，其基本上由7-11重量％的Zn，1-5重量％的Bi和余量的Sn组成。

    Interconnection process for module assembly and rework
    82.
    发明申请
    Interconnection process for module assembly and rework 有权
    模块组装和返工的互连过程

    公开(公告)号：US20010005314A1

    公开(公告)日：2001-06-28

    申请号：US09785787

    申请日：2001-02-16

    Applicant: International Business Machines Corporation.

    Inventor： Shaji Farooq ,  Mario J. Interrante ,  Sudipta K. Ray ,  William E. Sablinski

    IPC: H05K001/14

    CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/19105 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0272 ,  H05K2201/094 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49126 ,  H01L2924/00

    Abstract: An interconnection structure and methods for making and detaching the same are presented for column and ball grid array (CGA and BGA) structures by using a transient solder paste on the electronic module side of the interconnection that includes fine metal powder additives to increase the melting point of the solder bond. The metal powder additives change the composition of the solder bond such that the transient melting solder composition does not completely melt at temperatures below null230null C. and detach from the electronic module during subsequent ref lows. A PbnullSn eutectic with a lower melting point is used on the opposite end of the interconnection structure. In the first method a transient melting solder paste is applied to the I/O pad of an electronic module by means of a screening mask. Interconnect structures are then bonded to the I/O pad. In a second method, solder preforms in a composition of the transient melting solder paste are wetted onto electronic module I/O pads and interconnect columns or balls are then bonded. Detachment of an electronic module from a circuit card can then be performed by heating the circuit card assembly to a temperature above the eutectic solder melting point, but below the transient solder joint melting point.

    Abstract translation: 通过使用包括细金属粉末添加剂的电子模块侧的瞬态焊膏来提供柱和球栅阵列（CGA和BGA）结构的互连结构及其分离方法，以增加熔点 的焊点。 金属粉末添加剂改变焊料接合的组成，使得瞬态熔融焊料组合物在低于+ 230℃的温度下不会完全熔化，并且在后续参考低温期间与电子模块分离。 在互连结构的另一端使用具有较低熔点的Pb-Sn共晶体。 在第一种方法中，通过屏蔽掩模将瞬时熔融焊膏施加到电子模块的I / O焊盘。 然后将互连结构结合到I / O焊盘。 在第二种方法中，将瞬态熔融焊膏的组合物中的焊料预成型件润湿到电子模块I / O焊盘上，然后将互连柱或球接合。 然后可以通过将电路卡组件加热到高于共熔焊料熔点但低于瞬态焊点熔点的温度来执行从电路卡分离电子模块。

    Electrical solder and method of manufacturing
    86.
    发明授权
    Electrical solder and method of manufacturing 失效
    电焊和制造方法

    公开(公告)号：US5928404A

    公开(公告)日：1999-07-27

    申请号：US827589

    申请日：1997-03-28

    Applicant: Mohan R. Paruchuri ,  Dongkai Shangguan

    Inventor： Mohan R. Paruchuri ,  Dongkai Shangguan

    IPC: B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  H05K3/34 ,  C22C13/00

    CPC classification number: H05K3/3484 ,  B23K35/025 ,  B23K35/262 ,  H05K2201/0215 ,  H05K2201/0272 ,  H05K3/3442 ,  H05K3/3463

    Abstract: A method of manufacturing an electrical solder paste having primary solder powder and an additive metal powder component that does not melt during the soldering process. Metal powders may be either elemental metal or a metal alloy. The primary powder is the same as is used in conventional solder paste. The additive powder has a melting point substantially higher than the melting point of the primary powder. The primary powder comprises between 60-99% Sn, 0-40% Pb and 0-10% Ag. The additive powder metal is selected from the metal group comprising Sn, Pb, Ni, Cu, Ag, and Bi and mixtures thereof.

    Abstract translation: 一种制造具有主焊料粉末和在焊接过程中不熔化的添加金属粉末成分的电焊膏的方法。 金属粉末可以是元素金属或金属合金。 初级粉末与常规焊膏中使用的粉末相同。 添加剂粉末的熔点显着高于初级粉末的熔点。 主要粉末包含60-99％的Sn，0-40％的Pb和0-10％的Ag。 添加剂粉末金属选自包括Sn，Pb，Ni，Cu，Ag和Bi的金属和它们的混合物。

    Assembly using electrically conductive cement
    90.
    发明授权
    Assembly using electrically conductive cement 失效
    使用导电水泥组装

    公开(公告)号：US5326636A

    公开(公告)日：1994-07-05

    申请号：US953609

    申请日：1992-09-29

    Applicant: David Durand ,  David P. Vieau ,  Ang-Ling Chu ,  Tai S. Wei

    Inventor： David Durand ,  David P. Vieau ,  Ang-Ling Chu ,  Tai S. Wei

    IPC: C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  B32B9/00

    CPC classification number: H05K3/321 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H05K1/181 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K3/0023 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25

    Abstract: An electrically conductive cement having substantially stable conductivity and resistance characteristics under high humidity conditions comprises a mixture of two epoxy resins with the proportion of each epoxy resin adjusted to provide a volumetric shrinkage in the mixture in the 4 to 16% and a conductive silver particular filler including agglomerates having size and surface characteristics that maintain stable electrical contact with an electrical component lead. The epoxy mixture is preferably a combination of a high-shrinkage epoxy resin and a lower-shrinkage epoxy resin in the appropriate amounts of each so as to produce the desired volumetric shrinkage characteristic. The conductive particle filler is preferably an admixture of silver flakes, silver powder, and an effective amount of silver agglomerates. The agglomerates are irregularly shaped particles having multiple surface indentations and recesses to produce many rough-edged salients or ridges and having a particle length, width, and thickness aspect ratio of about 1:1:1. An effective amount of such agglomerates appears to effect penetration of surface oxides when establishing the cemented connection as a result of the volumetric shringage of the polymeric carrier upon curing.

    Abstract translation: 在高湿度条件下具有基本上稳定的导电性和电阻特性的导电水泥包括两种环氧树脂的混合物，其中每种环氧树脂的比例被调节以提供4至16％的混合物的体积收缩率和导电的银特殊填料 包括具有与电气部件引线保持稳定的电接触的尺寸和表面特性的附聚物。 环氧混合物优选为高收缩率环氧树脂和较低收缩率的环氧树脂的组合，以适当的量，以产生所需的体积收缩特性。 导电颗粒填料优选为银薄片，银粉和有效量的银附聚物的混合物。 附聚物是具有多个表面凹陷和凹陷的不规则形状的颗粒，以产生许多粗边缘的凸起，并且具有约1:1:1的颗粒长度，宽度和厚度纵横比。 当固化时聚合物载体的体积性破裂的结果，当建立粘合连接时，有效量的这种附聚物似乎会影响表面氧化物的渗透。

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