Circuit Board and Manufacturing Method Thereof, and Terminal Device

    公开(公告)号:US20240138056A1

    公开(公告)日:2024-04-25

    申请号:US18041767

    申请日:2022-08-25

    Abstract: This application discloses a circuit board and a manufacturing method thereof, and a terminal device, and relates to the technical field of terminals, to resolve the problem of low reliability of connection between a radio frequency front-end circuit and a radio frequency back-end circuit in a circuit board of a terminal device in a related technology. The circuit board includes a substrate and a liquid metal body, where the substrate is provided with a radio frequency front-end circuit, a radio frequency back-end circuit, and a pad group, where the pad group includes a first pad electrically connected to the radio frequency front-end circuit and a second pad electrically connected to the radio frequency back-end circuit, and the second pad is spaced apart from the first pad; and the liquid metal body is arranged at a position of the pad group and connects the first pad to the second pad, so as to electrically connect the radio frequency front-end circuit to the radio frequency back-end circuit. This application may be applied to a terminal device such as a mobile phone.

    WIRING FORMING METHOD AND CIRCUIT BOARD
    4.
    发明申请

    公开(公告)号:US20170318681A1

    公开(公告)日:2017-11-02

    申请号:US15523733

    申请日:2014-11-07

    Abstract: To form wiring on circuit board and conductor body, metal ink containing metal particles is dispensed by inkjet head straddling the circuit board and the conductor body. Then, a laser is applied by laser emitting device to the dispensed metal ink. The metal ink to which the laser is applied is baked and wiring is formed. A laser corresponding to the laser emission amount per unit of area based on the material of the circuit board, which is resin, is applied to the metal ink on the circuit board, and a laser corresponding to the laser emission amount per unit of area based on the conductor body is applied to the metal ink on the conductor body. The metal ink on the circuit board and the metal ink on the conductor body is baked appropriately, and wiring is formed appropriately straddling the circuit board and the conductor body.

    Electronic device and method of manufacturing electronic device
    7.
    发明授权
    Electronic device and method of manufacturing electronic device 有权
    电子设备及其制造方法

    公开(公告)号:US09526181B2

    公开(公告)日:2016-12-20

    申请号:US14519327

    申请日:2014-10-21

    Abstract: An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed, an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate, a lid which accommodates the electronic element and is bonded to the one surface of the base substrate, and an external electrode which covers a region from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in the vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, and a paste film which covers a surface of the conductive film and is formed of a conductive paste. The paste film is formed by a printing method and is formed of tin or a tin alloy.

    Abstract translation: 本发明的电子设备包括:绝缘基底,其中形成有多个通孔,电连接到贯通电极并安装在基底基片的一个表面上的电子元件,容纳电子元件的盖子 并且结合到基底基板的一个表面,并且外部电极覆盖由基底基板的另一个表面暴露的通孔的端面的区域附近的另一个表面 端面。 外部电极包括覆盖从端面附近的端面到另一表面的区域的导电膜,以及覆盖导电膜的表面并由导电膏形成的糊状膜。 糊状膜通过印刷法形成,并由锡或锡合金形成。

    Glass ceramic substrate and method for producing the same
    8.
    发明授权
    Glass ceramic substrate and method for producing the same 有权
    玻璃陶瓷基板及其制造方法

    公开(公告)号:US09466425B2

    公开(公告)日:2016-10-11

    申请号:US14032277

    申请日:2013-09-20

    Abstract: A first paste film containing a metal powder and non-vitreous inorganic oxide is formed on a glass ceramic green sheet, and a second paste film containing a metal powder is formed on the first paste film to cover at least the edge portion of the first paste film. Then the glass ceramic green sheet and the first and second paste films are fired. As a result, a surface electrode is obtained, and then a plating layer is formed on the surface electrode. The second paste film contains less non-vitreous inorganic oxide than the first paste film and the abundance ratio of the non-vitreous inorganic oxide in the surface electrode is lower in a region bordering the plating layer than in a region bordering the glass ceramic layer at least in an edge portion of the surface electrode.

    Abstract translation: 在玻璃陶瓷生片上形成含有金属粉末和非玻璃质无机氧化物的第一糊剂膜,在第一糊剂膜上形成含有金属粉末的第二糊剂膜,以至少覆盖第一糊剂的边缘部分 电影。 然后烧制玻璃陶瓷生片和第一和第二糊状膜。 结果,获得表面电极,然后在表面电极上形成镀层。 第二糊剂膜比第一糊状物膜含有较少的无玻璃质无机氧化物,并且表面电极中的非玻璃质无机氧化物的丰度比在与镀层相邻的区域中低于在与玻璃陶瓷层接壤的区域 最少在表面电极的边缘部分。

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