公开(公告)号：US20240138056A1

公开(公告)日：2024-04-25

申请号：US18041767

申请日：2022-08-25

Applicant: Honor Device Co., Ltd.

Inventor： Junjie Yang ,  Erliang Li ,  Jian Bai ,  Xiaohang Li

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H05K9/00

CPC classification number: H05K1/0268 ,  H05K1/116 ,  H05K3/3485 ,  H05K9/0024 ,  H05K2201/035

Abstract: This application discloses a circuit board and a manufacturing method thereof, and a terminal device, and relates to the technical field of terminals, to resolve the problem of low reliability of connection between a radio frequency front-end circuit and a radio frequency back-end circuit in a circuit board of a terminal device in a related technology. The circuit board includes a substrate and a liquid metal body, where the substrate is provided with a radio frequency front-end circuit, a radio frequency back-end circuit, and a pad group, where the pad group includes a first pad electrically connected to the radio frequency front-end circuit and a second pad electrically connected to the radio frequency back-end circuit, and the second pad is spaced apart from the first pad; and the liquid metal body is arranged at a position of the pad group and connects the first pad to the second pad, so as to electrically connect the radio frequency front-end circuit to the radio frequency back-end circuit. This application may be applied to a terminal device such as a mobile phone.

公开(公告)号：US11877402B2

公开(公告)日：2024-01-16

申请号：US18086848

申请日：2022-12-22

Applicant: LUMET TECHNOLOGIES LTD.

Inventor： Benzion Landa ,  Naomi Elfassy ,  Stanislav Thygelbaum

IPC: H05K3/20 ,  H05K3/38 ,  B41M1/12 ,  H01L31/0224 ,  H05K3/34 ,  H05K1/03 ,  H05K1/09 ,  H01L31/0216 ,  H01L31/0392 ,  H01L31/20 ,  H05K1/16

CPC classification number: H05K3/207 ,  B41M1/12 ,  H01L31/02167 ,  H01L31/022425 ,  H01L31/022433 ,  H01L31/03926 ,  H01L31/206 ,  H05K1/0393 ,  H05K1/092 ,  H05K3/3485 ,  H05K3/386 ,  H05K1/165 ,  H05K2201/0195 ,  H05K2201/035 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/10098 ,  H05K2203/0139 ,  H05K2203/1105 ,  H05K2203/1131 ,  H05K2203/1476 ,  H05K2203/1545 ,  Y02E10/50

Abstract: A method is disclosed for applying an electrical conductor to a solar cell, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of a solar cell. A pressure is then applied between the solar cell and the membrane(s) so that the composition loaded to the grooves adheres to the solar cell. The membrane(s) and the solar cell are separated and the composition in the groove is left on the solar cell surface. The electrically conductive particles in the composition are then sintered or otherwise fused to form a pattern of electrical conductor on the solar cell, the pattern corresponding to the pattern formed in the membrane(s).

公开(公告)号：US20230207897A1

公开(公告)日：2023-06-29

申请号：US17945146

申请日：2022-09-15

Applicant: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED

Inventor： Xin LI ,  Zhaohang SHI

IPC: H01M10/42 ,  H05K1/11 ,  H05K1/09 ,  H05K1/18

CPC classification number: H01M10/425 ,  H05K1/111 ,  H05K1/09 ,  H05K1/181 ,  H01M2220/20 ,  H05K2201/035

Abstract: This application discloses a printed circuit board, a battery module, a battery pack, and an electrical device. The printed circuit board may include: a substrate, a pad, a solder paste layer, a component body, and a support assembly. The pad may be disposed above the substrate. The solder paste layer may be disposed above the pad. The component body may be disposed above the solder paste layer. The support assembly may be disposed between the pad and the component body to form a degassing space between the component body and the solder paste layer.

公开(公告)号：US20170318681A1

公开(公告)日：2017-11-02

申请号：US15523733

申请日：2014-11-07

Applicant: FUJI MACHINE MFG. CO., LTD.

Inventor： Yoshitaka HASHIMOTO ,  Masatoshi FUJITA ,  Kenji TSUKADA ,  Akihiro KAWAJIRI ,  Masato SUZUKI

IPC: H05K3/12 ,  C23C14/58

CPC classification number: H05K3/125 ,  C23C14/58 ,  H05K3/1283 ,  H05K3/1291 ,  H05K2201/035 ,  H05K2203/107

Abstract: To form wiring on circuit board and conductor body, metal ink containing metal particles is dispensed by inkjet head straddling the circuit board and the conductor body. Then, a laser is applied by laser emitting device to the dispensed metal ink. The metal ink to which the laser is applied is baked and wiring is formed. A laser corresponding to the laser emission amount per unit of area based on the material of the circuit board, which is resin, is applied to the metal ink on the circuit board, and a laser corresponding to the laser emission amount per unit of area based on the conductor body is applied to the metal ink on the conductor body. The metal ink on the circuit board and the metal ink on the conductor body is baked appropriately, and wiring is formed appropriately straddling the circuit board and the conductor body.

公开(公告)号：US20170018535A1

公开(公告)日：2017-01-19

申请号：US15262304

申请日：2016-09-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Guk Han ,  Seok-Joon Moon ,  Beom-jun Jin

IPC: H01L25/065 ,  G11C5/06 ,  H01L21/66 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01L25/0657 ,  G01R31/2808 ,  G01R31/2818 ,  G11C5/02 ,  G11C5/025 ,  G11C5/06 ,  G11C29/04 ,  G11C29/12 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L22/30 ,  H01L22/32 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/538 ,  H01L24/09 ,  H01L24/48 ,  H01L24/49 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0912 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/181 ,  H05K1/0268 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/002 ,  H05K3/245 ,  H05K3/28 ,  H05K3/288 ,  H05K3/323 ,  H05K2201/0187 ,  H05K2201/035 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/099 ,  H05K2201/10159 ,  H05K2203/162 ,  Y10T29/49117 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

Abstract translation: 提供具有印刷电路板的电子设备。 在一个实施例中，印刷电路板包括要与外部装置耦合的多个外部焊盘和用于测试电路的多个旁路焊盘。 外部焊盘被暴露，并且多个旁路焊盘中的至少一个不暴露于PCB的外表面。 还提供了使用电子设备的系统和测试电子设备的方法。

公开(公告)号：US09538647B2

公开(公告)日：2017-01-03

申请号：US14450297

申请日：2014-08-04

Applicant: Chao-Min Wang

Inventor： Chao-Min Wang

IPC: H01L21/84 ,  H05K1/03 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H01L23/498 ,  H01L21/48 ,  H05K3/00

CPC classification number: H05K1/0313 ,  H01L21/48 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49827 ,  H01L2221/68318 ,  H01L2924/15151 ,  H05K1/0298 ,  H05K1/114 ,  H05K1/115 ,  H05K3/007 ,  H05K3/46 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/035 ,  H05K2201/0355 ,  H05K2201/09063 ,  H05K2203/0214 ,  H05K2203/1178 ,  Y10T156/10

Abstract: A substrate structure is provided. The substrate structure includes a substrate and a carrier. The substrate includes a first through hole, a first surface and a second surface opposite to the first surface. The first through hole penetrates the substrate for connecting the first surface and the second surface. The carrier includes a second through hole, a release layer, an insulating paste layer and a metal layer. The insulating paste layer is disposed between the release layer and the metal layer. The carrier is attached to the second surface with the release layer thereof. The second through hole corresponds to the first through hole and penetrates the carrier for exposing the first through hole.

Abstract translation: 提供了基板结构。 衬底结构包括衬底和载体。 基板包括第一通孔，第一表面和与第一表面相对的第二表面。 第一通孔贯穿基板，用于连接第一表面和第二表面。 载体包括第二通孔，释放层，绝缘膏层和金属层。 绝缘膏层设置在剥离层和金属层之间。 载体用其释放层附着到第二表面。 第二通孔对应于第一通孔并穿透载体以暴露第一通孔。

公开(公告)号：US09526181B2

公开(公告)日：2016-12-20

申请号：US14519327

申请日：2014-10-21

Applicant: SEIKO INSTRUMENTS INC.

Inventor： Atsushi Kozuki ,  Hideshi Hamada ,  Yoshifumi Yoshida

IPC: H01R9/00 ,  H05K3/24 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K3/247 ,  H01L2224/16225 ,  H01L2924/16152 ,  H05K1/092 ,  H05K1/113 ,  H05K2201/035

Abstract: An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed, an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate, a lid which accommodates the electronic element and is bonded to the one surface of the base substrate, and an external electrode which covers a region from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in the vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, and a paste film which covers a surface of the conductive film and is formed of a conductive paste. The paste film is formed by a printing method and is formed of tin or a tin alloy.

Abstract translation: 本发明的电子设备包括：绝缘基底，其中形成有多个通孔，电连接到贯通电极并安装在基底基片的一个表面上的电子元件，容纳电子元件的盖子 并且结合到基底基板的一个表面，并且外部电极覆盖由基底基板的另一个表面暴露的通孔的端面的区域附近的另一个表面 端面。 外部电极包括覆盖从端面附近的端面到另一表面的区域的导电膜，以及覆盖导电膜的表面并由导电膏形成的糊状膜。 糊状膜通过印刷法形成，并由锡或锡合金形成。

公开(公告)号：US09466425B2

公开(公告)日：2016-10-11

申请号：US14032277

申请日：2013-09-20

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Sumiyo Wakaki ,  Takahiro Sumi ,  Machiko Motoya

IPC: H05K3/24 ,  H05K1/09 ,  H05K3/40 ,  H01G4/10 ,  H05K1/11 ,  H05K3/46

CPC classification number: H01G4/105 ,  H05K1/111 ,  H05K3/246 ,  H05K3/4007 ,  H05K3/4629 ,  H05K2201/035 ,  H05K2203/1476

Abstract: A first paste film containing a metal powder and non-vitreous inorganic oxide is formed on a glass ceramic green sheet, and a second paste film containing a metal powder is formed on the first paste film to cover at least the edge portion of the first paste film. Then the glass ceramic green sheet and the first and second paste films are fired. As a result, a surface electrode is obtained, and then a plating layer is formed on the surface electrode. The second paste film contains less non-vitreous inorganic oxide than the first paste film and the abundance ratio of the non-vitreous inorganic oxide in the surface electrode is lower in a region bordering the plating layer than in a region bordering the glass ceramic layer at least in an edge portion of the surface electrode.

Abstract translation: 在玻璃陶瓷生片上形成含有金属粉末和非玻璃质无机氧化物的第一糊剂膜，在第一糊剂膜上形成含有金属粉末的第二糊剂膜，以至少覆盖第一糊剂的边缘部分 电影。 然后烧制玻璃陶瓷生片和第一和第二糊状膜。 结果，获得表面电极，然后在表面电极上形成镀层。 第二糊剂膜比第一糊状物膜含有较少的无玻璃质无机氧化物，并且表面电极中的非玻璃质无机氧化物的丰度比在与镀层相邻的区域中低于在与玻璃陶瓷层接壤的区域 最少在表面电极的边缘部分。

公开(公告)号：US09358804B2

公开(公告)日：2016-06-07

申请号：US14610330

申请日：2015-01-30

Applicant: ROHM CO., LTD.

Inventor： Shinobu Obata ,  Koji Nishi ,  Takafumi Katsuno ,  Masumi Okumura ,  Nobuhito Kinoshita

IPC: B41J2/05 ,  B41J2/335 ,  B41J2/045 ,  H05K3/06 ,  H05K1/09 ,  H05K3/40 ,  H05K3/12 ,  H05K1/03

CPC classification number: B41J2/3352 ,  B41J2/04541 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/3353 ,  B41J2/3354 ,  B41J2/33545 ,  B41J2/3355 ,  B41J2/3357 ,  B41J2/3359 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/092 ,  H05K3/06 ,  H05K3/12 ,  H05K3/40 ,  H05K2201/017 ,  H05K2201/0338 ,  H05K2201/035

Abstract: According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.

Abstract translation: 根据本公开，公开了精细布线图案的制造方法。 该制造方法包括制备支撑构件，通过厚膜印刷在支撑构件上形成第一层，并通过厚膜印刷在第一层上形成包括Ag的第二层。 该方法还包括通过对第一层和第二层执行蚀刻处理来形成预定的精细布线图案。

公开(公告)号：US08982169B2

公开(公告)日：2015-03-17

申请号：US13747703

申请日：2013-01-23

Applicant: Rohm Co., Ltd.

Inventor： Shinobu Obata ,  Koji Nishi ,  Takafumi Katsuno ,  Masumi Okumura ,  Nobuhito Kinoshita

IPC: B41J2/335 ,  B41J2/045 ,  H05K3/06 ,  H05K1/09 ,  H05K3/12 ,  H05K1/03

CPC classification number: B41J2/3352 ,  B41J2/04541 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/3353 ,  B41J2/3354 ,  B41J2/33545 ,  B41J2/3355 ,  B41J2/3357 ,  B41J2/3359 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/092 ,  H05K3/06 ,  H05K3/12 ,  H05K3/40 ,  H05K2201/017 ,  H05K2201/0338 ,  H05K2201/035

Abstract: According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.

Abstract translation: 根据本公开，公开了精细布线图案的制造方法。 该制造方法包括制备支撑构件，通过厚膜印刷在支撑构件上形成第一层，并通过厚膜印刷在第一层上形成包括Ag的第二层。 该方法还包括通过对第一层和第二层执行蚀刻处理来形成预定的精细布线图案。