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公开(公告)号：US20150340120A1
公开(公告)日：2015-11-26
申请号：US14758220
申请日：2014-01-16
Applicant: SEKISUI CHEMICAL CO., LTD.
Inventor： Hideaki Ishizawa , Takashi Kubota
Abstract: Provided is a curable composition for an electronic component that can be quickly cured and furthermore can have increased storage stability. The curable composition for an electronic component according to the present invention contains an epoxy compound, an anionic curing agent, a flux, and a basic compound excluding the anionic curing agent.
Abstract translation: 本发明提供一种可快速固化的电子部件用固化性组合物，能够提高储存稳定性。 本发明的电子部件用固化性组合物含有除阴离子性固化剂以外的环氧化合物，阴离子性固化剂，助熔剂和碱性化合物。
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2.发明授权公开(公告)号：US07528487B2
公开(公告)日：2009-05-05
申请号：US11000516
申请日：2004-11-30
Applicant: Hideo Imai
Inventor： Hideo Imai
IPC: H01L23/52 , H01L23/48 , H01L23/40 , H01L23/485 , H01L23/498
CPC classification number: H01L24/12 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L24/28 , H01L24/83 , H01L2224/05567 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/2919 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/83205 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/15787 , H05K3/323 , H05K2201/023 , H05K2201/10674 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
Abstract: A semiconductor device including: a semiconductor chip including a substrate, an outer-connection electrode, and a bump, wherein the bump has a first conductive layer and a second conductive layer provided on the first conductive layer, and the second conductive layer is made of copper; a wiring board having a land; and an insulating material dispersed with conductive particles, wherein the conductive particles connect between the bump and the land, wherein an electrical connection is established by the conductive particles having penetrated to both the second conductive layer and the land.
Abstract translation: 一种半导体器件，包括：包括衬底，外部连接电极和凸块的半导体芯片，其中所述凸块具有设置在所述第一导电层上的第一导电层和第二导电层，并且所述第二导电层由 铜; 具有焊盘的布线板; 以及分散有导电颗粒的绝缘材料，其中所述导电颗粒连接在所述凸块和所述焊盘之间，其中通过已经穿过所述第二导电层和所述焊盘两者的所述导电颗粒建立电连接。
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公开(公告)号：US06969264B2
公开(公告)日：2005-11-29
申请号：US10850262
申请日：2004-05-20
Applicant: Shoji Fujii , Toshiharu Fukui , Tetsuo Murakami
Inventor： Shoji Fujii , Toshiharu Fukui , Tetsuo Murakami
IPC: G06F3/045 , G06F3/033 , G06F3/041 , H01H13/712 , H05K3/24 , H05K3/32 , H05K3/36 , H01R12/00 , H05K1/00
CPC classification number: G06F3/041 , H05K3/245 , H05K3/323 , H05K3/361 , H05K2201/023 , H05K2201/035
Abstract: A transparent touch panel is structured by forming connecting layers that contain conductive metal powder dispersed in a resin, on ends of wiring patterns on a wiring board to which upper electrodes and lower electrodes are to be bonded. This structure can provide a transparent touch panel that ensures bonding of upper and lower substrates and the wiring board and stable electrical connection.
Abstract translation: 通过在上部电极和下部电极要被接合的布线基板上的布线图案的端部上形成包含分散在树脂中的导电金属粉末的连接层来构成透明触摸面板。 该结构可以提供透明的触摸面板，确保上下基板和布线板的接合以及稳定的电连接。
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4.发明授权Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors 失效用于在两组导体之间提供各向异性导电路径和结合的组合物和方法
公开(公告)号：US5769996A
公开(公告)日：1998-06-23
申请号：US464733
申请日：1995-06-29
Applicant: Ciaran Bernard McArdle , Joseph Burke
Inventor： Ciaran Bernard McArdle , Joseph Burke
IPC: H05K1/09 , C09J5/06 , C09J9/02 , C09J11/04 , C09J201/00 , H01B1/00 , H01B1/20 , H01B5/00 , H01B5/16 , H01F1/44 , H01F41/16 , H01L21/60 , H01R4/04 , H05K3/32 , B32B31/20
CPC classification number: H05K3/323 , H01F1/44 , H01F41/16 , H01R4/04 , H01L2224/293 , H01L2924/01019 , H01L2924/01079 , H01L2924/07811 , H01R12/57 , H05K2201/0221 , H05K2201/023 , H05K2201/0233 , H05K2201/083 , H05K2203/104 , Y10T428/12069 , Y10T428/12347
Abstract: The invention provides a composition comprising: (i) a ferrofluid comprising a colloidal suspension of ferromagnetic particles in a non-magnetic carrier liquid, and (ii) a plurality of electrically-conductive particles having substantially uniform sizes and shapes, dispersed in the ferrofluid. Various types of substantially non-magnetic electrically-conductive particles are described. Application of a substantially uniform magnetic field by magnet means to the composition causes the electrically-conductive particles to form a regular pattern. The composition is used for providing anisotropic conductive pathways between two sets of conductors in the electronics industry. The composition may be a curable adhesive composition which bonds the conductors. Alternatively or in addition the electrically-conductive particles may have a latent adhesive property e.g. the particles may be solder particles. The ferrofluid may be a colloidal suspension of ferromagnetic particles in a liquid monomer.
Abstract translation: PCT No.PCT / IE95 / 00009 Sec。 371日期：1995年6月29日 102（e）1995年6月29日PCT PCT 1995年1月26日PCT公布。 公开号WO95 / 20820 PCT 日期1995年8月3日本发明提供一种组合物，其包含：（i）包含非磁性载体液体中的铁磁颗粒的胶态悬浮液的铁磁流体，和（ii）具有基本均匀尺寸和形状的多个导电颗粒， 分散在铁磁流体中。 描述了各种类型的基本上非磁性的导电颗粒。 通过磁体将施加大致均匀的磁场的组合物导致导电颗粒形成规则图案。 该组合物用于在电子工业中的两组导体之间提供各向异性导电通路。 组合物可以是结合导体的可固化粘合剂组合物。 或者或另外，导电颗粒可以具有潜在的粘合性，例如 颗粒可以是焊料颗粒。 铁磁流体可以是液体单体中的铁磁颗粒的胶态悬浮液。
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5.发明授权
公开(公告)号：US5679928A
公开(公告)日：1997-10-21
申请号：US403779
申请日：1995-03-24
Applicant: Akihiko Okano , Terutaka Okano
Inventor： Akihiko Okano , Terutaka Okano
CPC classification number: H01R4/04 , H05K3/323 , G02F1/13452 , H05K2201/0221 , H05K2201/023 , H05K2201/0233 , H05K2203/0425 , H05K3/361 , Y10T29/4913 , Y10T29/49144
Abstract: A connection terminal portion of a substrate and a terminal portion of an external circuit substrate or a terminal portion of a part are electrically connected together using an anisotropic electrically conducting film. A structure in which a first substrate having a connection terminal portion and a second substrate having a connection terminal portion or a connection terminal portion of a part are connected together with an anisotropic electrically conducting adhesive containing electrically conducting particles, wherein the thickness of the electrically conducting film provided for the connection terminal of the first substrate, the second substrate or the part is smaller than the diameter of the electrically conducting particles. The invention is further concerned with a method of accomplishing the electrical connection.
Abstract translation: PCT No.PCT / JP94 / 01240 Sec。 371日期：1995年3月24日 102（e）1995年3月24日PCT PCT 1994年7月27日PCT公布。 公开号WO95 / 04387 日期1995年2月9日使用各向异性导电膜将基板的连接端子部分和外部电路基板的端子部分或部分的端子部分电连接在一起。 一种结构，其中具有连接端子部分的第一基板和具有连接端子部分或部分的连接端子部分的第二基板与包含导电颗粒的各向异性导电粘合剂连接在一起，其中导电 提供给第一基板，第二基板或部分的连接端子的薄膜小于导电颗粒的直径。 本发明还涉及一种完成电连接的方法。
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Patent Agency Ranking6.发明授权
公开(公告)号：US5328087A
公开(公告)日：1994-07-12
申请号：US38420
申请日：1993-03-29
Applicant: Richard D. Nelson , Thomas P. Dolbear , Robert W. Froehlich
Inventor： Richard D. Nelson , Thomas P. Dolbear , Robert W. Froehlich
CPC classification number: H01L24/29 , C09J9/02 , H01B1/22 , H01L24/32 , H01R4/04 , H05K3/323 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29305 , H01L2224/29311 , H01L2224/29499 , H01L2224/83951 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H05K2201/0209 , H05K2201/023 , H05K2201/10719 , H05K2203/0425 , Y10T29/49126
Abstract: The present invention discloses a thermally and electrically conductive adhesive material comprising a hardened adhesive, and a non-solidified filler containing a liquid metal dispersed in separate spaced regions of the adhesive. The hardened adhesive provides a mechanical bond whereas the filler provides continuous thermal and electrical metal bridges, each bridge extending through the adhesive and contacting the bonded surfaces. The method includes (a) dispersing a filler containing a liquid metal into an unhardened adhesive, (b) contacting the unhardened adhesive and the filler in non-solidified state to the surfaces resulting in separate spaced regions of the non-solidified filler contacting both surfaces, and (c) hardening the adhesive.
Abstract translation: 本发明公开了一种导热粘合剂材料，其包括硬化粘合剂，以及含有液体金属的非固化填料，其分散在粘合剂的分开间隔的区域中。 硬化的粘合剂提供机械结合，而填料提供连续的热和电金属桥，每个桥延伸通过粘合剂并接触粘结表面。 该方法包括（a）将含有液态金属的填料分散在未硬化的粘合剂中，（b）将未硬化的粘合剂和非固化状态的填料接触到表面，从而形成与两个表面接触的非固化填料的分开的间隔区域 ，和（c）硬化粘合剂。
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公开(公告)号：US5326636A
公开(公告)日：1994-07-05
申请号：US953609
申请日：1992-09-29
Applicant: David Durand , David P. Vieau , Ang-Ling Chu , Tai S. Wei
Inventor： David Durand , David P. Vieau , Ang-Ling Chu , Tai S. Wei
CPC classification number: H05K3/321 , C09J163/00 , H01B1/22 , H01R4/04 , H05K1/181 , H05K2201/0125 , H05K2201/0218 , H05K2201/023 , H05K2201/0245 , H05K2201/0272 , H05K2203/0307 , H05K2203/0568 , H05K2203/1105 , H05K2203/1453 , H05K3/0023 , Y10S428/901 , Y10T428/24917 , Y10T428/25
Abstract: An electrically conductive cement having substantially stable conductivity and resistance characteristics under high humidity conditions comprises a mixture of two epoxy resins with the proportion of each epoxy resin adjusted to provide a volumetric shrinkage in the mixture in the 4 to 16% and a conductive silver particular filler including agglomerates having size and surface characteristics that maintain stable electrical contact with an electrical component lead. The epoxy mixture is preferably a combination of a high-shrinkage epoxy resin and a lower-shrinkage epoxy resin in the appropriate amounts of each so as to produce the desired volumetric shrinkage characteristic. The conductive particle filler is preferably an admixture of silver flakes, silver powder, and an effective amount of silver agglomerates. The agglomerates are irregularly shaped particles having multiple surface indentations and recesses to produce many rough-edged salients or ridges and having a particle length, width, and thickness aspect ratio of about 1:1:1. An effective amount of such agglomerates appears to effect penetration of surface oxides when establishing the cemented connection as a result of the volumetric shringage of the polymeric carrier upon curing.
Abstract translation: 在高湿度条件下具有基本上稳定的导电性和电阻特性的导电水泥包括两种环氧树脂的混合物，其中每种环氧树脂的比例被调节以提供4至16％的混合物的体积收缩率和导电的银特殊填料 包括具有与电气部件引线保持稳定的电接触的尺寸和表面特性的附聚物。 环氧混合物优选为高收缩率环氧树脂和较低收缩率的环氧树脂的组合，以适当的量，以产生所需的体积收缩特性。 导电颗粒填料优选为银薄片，银粉和有效量的银附聚物的混合物。 附聚物是具有多个表面凹陷和凹陷的不规则形状的颗粒，以产生许多粗边缘的凸起，并且具有约1:1:1的颗粒长度，宽度和厚度纵横比。 当固化时聚合物载体的体积性破裂的结果，当建立粘合连接时，有效量的这种附聚物似乎会影响表面氧化物的渗透。
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公开(公告)号：US20140254117A1
公开(公告)日：2014-09-11
申请号：US13935358
申请日：2013-07-03
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Moon-Seok Roh , Sang-Urn Lim
CPC classification number: H05K3/323 , H05K2201/0221 , H05K2201/023
Abstract: An anisotropic conductive film includes an insulating adhesive resin layer, and a plurality of conductive particles located at the insulating adhesive resin layer and comprising acutely angled edges.
Abstract translation: 各向异性导电膜包括绝缘粘合树脂层和位于绝缘粘合树脂层处并包括锐角边缘的多个导电颗粒。
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9.发明申请Semiconductor device, semiconductor chip, method for manufacturing semiconductor device, and electronic apparatus 失效半导体装置，半导体芯片，半导体装置的制造方法以及电子装置公开(公告)号：US20050127504A1
公开(公告)日：2005-06-16
申请号：US11000516
申请日：2004-11-30
Applicant: Hideo Imai
Inventor： Hideo Imai
IPC: H01L21/00 , H01L21/28 , H01L21/60 , H01L23/02 , H01L23/12 , H01L23/48 , H01L23/498 , H01L29/40 , H01R11/01 , H05K3/32
CPC classification number: H01L24/12 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L24/28 , H01L24/83 , H01L2224/05567 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/2919 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/83205 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/15787 , H05K3/323 , H05K2201/023 , H05K2201/10674 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
Abstract: A semiconductor device including: a semiconductor chip including a substrate, an outer-connection electrode, and a bump, wherein the bump has a first conductive layer and a second conductive layer provided on the first conductive layer, and the second conductive layer is made of copper; a wiring board having a land; and an insulating material dispersed with conductive particles, wherein the conductive particles connect between the bump and the land, wherein an electrical connection is established by the conductive particles having penetrated to both the second conductive layer and the land.
Abstract translation: 一种半导体器件，包括：包括衬底，外部连接电极和凸块的半导体芯片，其中所述凸块具有设置在所述第一导电层上的第一导电层和第二导电层，并且所述第二导电层由 铜; 具有焊盘的布线板; 以及分散有导电颗粒的绝缘材料，其中所述导电颗粒连接在所述凸块和所述焊盘之间，其中通过已经穿过所述第二导电层和所述焊盘两者的所述导电颗粒建立电连接。
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公开(公告)号：US06559541B2
公开(公告)日：2003-05-06
申请号：US09862503
申请日：2001-05-23
Applicant: Masamitsu Itagaki , Hiroyuki Fujihira
Inventor： Masamitsu Itagaki , Hiroyuki Fujihira
IPC: H01L2940
CPC classification number: H05K3/361 , G02F1/13452 , H01L2924/0002 , H05K1/0306 , H05K3/323 , H05K3/386 , H05K2201/023 , H05K2201/0382 , H05K2201/091 , H01L2924/00
Abstract: A connection structure is configured such that electrodes formed on an overcoat layer on a substrate are connected to other electrode terminals using an anisotropically electroconductive adhesive 30 comprising electroconductive particles dispersed in an insulating adhesive, wherein the angle of encroachment A of the electroconductive particles 32 into the overcoat layer 4 is made to be at least 135°.
Abstract translation: 连接结构被配置为使得使用包括分散在绝缘粘合剂中的导电颗粒的各向异性导电粘合剂30将形成在基板上的外涂层上的电极连接到其它电极端子，其中导电颗粒32的侵入角度A进入 外涂层4制成至少135°。
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