公开(公告)号：US20100028623A1

公开(公告)日：2010-02-04

申请号：US12458821

申请日：2009-07-23

Applicant: Toyonari Ito ,  Satoshi Okamato

Inventor： Toyonari Ito ,  Satoshi Okamato

IPC: B32B15/08 ,  B32B7/02 ,  B32B3/10 ,  B32B37/12

CPC classification number: H05K3/022 ,  H05K1/056 ,  H05K2201/0141 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10T428/24802 ,  Y10T428/24942 ,  Y10T428/24967

Abstract: The present invention provides a method for producing a laminated product, the method comprising the steps of: applying a solution containing a liquid-crystalline polymer and a solvent to a first metal layer, removing the solvent from the solution to form a liquid- crystalline polymer layer on the first metal layer, placing a second metal layer such that the liquid-crystalline polymer layer is placed between the first and second metal layers, and subjecting the liquid-crystalline polymer layer to compression from the direction of the first and second metal layers, wherein the thickness of the second metal layer is larger than that of the first metal layer. In the production method, the first metal layer preferably comprises a different metal from the second metal layer.

Abstract translation: 本发明提供层压产品的制造方法，该方法包括以下步骤：向第一金属层涂布含有液晶聚合物和溶剂的溶液，从溶液中除去溶剂以形成液晶聚合物 在第一金属层上放置第二金属层，使得液晶聚合物层置于第一和第二金属层之间，并使液晶聚合物层从第一和第二金属层的方向压缩 ，其中所述第二金属层的厚度大于所述第一金属层的厚度。 在制造方法中，第一金属层优选包含与第二金属层不同的金属。

公开(公告)号：US20090325105A1

公开(公告)日：2009-12-31

申请号：US12491406

申请日：2009-06-25

Applicant: Seok-Kyu Lee ,  Byoung-Youl Min ,  Chang-Hyun Nam ,  Hyun-Ju Jin ,  Jang-Kyu Kang

Inventor： Seok-Kyu Lee ,  Byoung-Youl Min ,  Chang-Hyun Nam ,  Hyun-Ju Jin ,  Jang-Kyu Kang

IPC: H05K3/46 ,  G03F7/00

CPC classification number: H05K1/162 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/09509 ,  H05K2203/1461

Abstract: Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the printed circuit board.

Abstract translation: 这里公开了一种其中具有嵌入式电容器的印刷电路板，其包括填充有由BaTiO 3和环氧树脂的复合材料组成的高介电聚合物电容器糊的内部通孔，以及用于制造印刷电路板的工艺。

公开(公告)号：US07563342B2

公开(公告)日：2009-07-21

申请号：US11407057

申请日：2006-04-20

Applicant: Masashi Gotoh ,  Hajime Kuwajima ,  Kenichi Kawabata

Inventor： Masashi Gotoh ,  Hajime Kuwajima ,  Kenichi Kawabata

IPC: B32B37/00

CPC classification number: H05K3/4611 ,  B32B37/0007 ,  B32B37/0046 ,  B32B2457/08 ,  H05K3/4652 ,  H05K2201/0358 ,  H05K2203/068

Abstract: In a press process, a buffer member is placed on an RCC with a stainless steel plate between in such a way that the long sides and the short sides of the buffer member are aligned with the long sides and the short sides of the RCC respectively. The length of the long sides and the length of the short sides of the buffer member are designed to be smaller than the lengths of the long sides and the length of the short sides of the RCC respectively. With this feature, it is possible to reduce convexity on the RCC that is created in the peripheral region upon pressing the RCC to a core member.

Abstract translation: 在压制过程中，将缓冲构件放置在具有不锈钢板的RCC上，使得缓冲构件的长边和短边分别与RCC的长边和短边对齐。 长边的长度和缓冲构件的短边的长度分别设计成小于长边的长度和短边的长度。 利用该特征，可以在将RCC按压到芯构件时减小在外围区域中产生的RCC上的凸度。

公开(公告)号：US20090110909A1

公开(公告)日：2009-04-30

申请号：US12256662

申请日：2008-10-23

Applicant: Jeffrey Glenn Innocenzo ,  Pui-Yan Lin ,  Richard C. Oliver ,  Govindasamy Paramasivam Rajendran ,  George Elias Zahr

Inventor： Jeffrey Glenn Innocenzo ,  Pui-Yan Lin ,  Richard C. Oliver ,  Govindasamy Paramasivam Rajendran ,  George Elias Zahr

IPC: B32B5/16 ,  B32B27/38

CPC classification number: H05K3/4673 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4661 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/0358 ,  H05K2201/068 ,  Y10T428/25 ,  Y10T428/31511

Abstract: Cross-linked polymeric films suitable for use as a dielectric build-up layer in multi-layer chip carriers are provided. The films are suitable for use in any application using films that are dimensionally stable to temperature changes.

Abstract translation: 提供了适合用作多层芯片载体中的电介质堆积层的交联聚合物膜。 这些薄膜适用于使用尺寸稳定于温度变化的薄膜的任何应用。

公开(公告)号：US20080107865A1

公开(公告)日：2008-05-08

申请号：US11662475

申请日：2005-09-09

Applicant: Tetsuhiro Matsunaga ,  Toshifumi Matsushima ,  Tetsuro Sato ,  Kensuke Nakamura ,  Hiroyuki Kon ,  Kenichiro Iwakiri

Inventor： Tetsuhiro Matsunaga ,  Toshifumi Matsushima ,  Tetsuro Sato ,  Kensuke Nakamura ,  Hiroyuki Kon ,  Kenichiro Iwakiri

IPC: B32B3/00 ,  C25D7/00

CPC classification number: C25D7/0614 ,  B32B7/06 ,  B32B15/01 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/08 ,  B32B27/26 ,  B32B27/285 ,  B32B27/286 ,  B32B27/38 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/24 ,  B32B2255/28 ,  B32B2270/00 ,  B32B2457/08 ,  C22C19/002 ,  C23C28/00 ,  C25D3/562 ,  H05K3/025 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0358 ,  H05K2203/0723 ,  Y10T428/12569 ,  Y10T428/24355

Abstract: Present invention provides an electrodeposited copper foil with carrier foil that assure high bonding strength between a surface of the bulk copper layer and a resin substrate layer even when surface roughness is low, and hardly occurs delamination even when pin holes and the like remain in a bulk copper layer or in the side wall of the through holes or via holes and the like after contact with a desmear solution and the like. To solve such a problem, electrodeposited copper foil with carrier foil with a primer resin layer comprising a bonding interface layer, a bulk copper layer, a plated Ni—Zn alloy layer and a primer resin layer which is formed in this order at least on one surface of the carrier foil is applied.

Abstract translation: 本发明提供了一种具有载体箔的电沉积铜箔，即使在表面粗糙度低的情况下也能保证体铜层的表面与树脂基材层之间的高结合强度，即使销孔等保持体积也难以发生分层 铜层或通孔的侧壁或与去污溶液等接触后的通孔等。 为了解决这个问题，具有载体箔的电沉积铜箔具有底层树脂层，该底层树脂层包括接合界面层，体铜层，镀Ni-Zn合金层和底漆树脂层，该层以该顺序至少一个地形成 涂布载体箔的表面。

公开(公告)号：US20080057627A1

公开(公告)日：2008-03-06

申请号：US11511462

申请日：2006-08-29

Applicant: Roger Chang

Inventor： Roger Chang

IPC: H01L21/00 ,  H05K3/36

CPC classification number: H05K1/187 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/186 ,  H05K3/28 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0358 ,  H05K2201/09536 ,  H05K2201/10674 ,  H05K2203/063 ,  H05K2203/068 ,  H05K2203/085 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method has acts of providing at least two multilayer circuit boards, combining the at least two multilayer circuit boards to form a combined multilayer circuit board, forming multiple outer conductive vias, circuits and contacts on the combined multilayer circuit board. Each multilayer circuit board is fabricated by steps of preparing a single-layer printed circuit board having multiple chip sections, attaching at least one chip to the corresponding chip section, attaching a frame having multiple enclosures to the single-layer printed circuit board, attaching a semi-fluid glue sheet to the frame, vacuum pressing a conductive layer on the semi-fluid glue sheet and forming multiple conductive inner vias through the multilayer circuit board. The at least two multilayer circuit boards are combined by steps of reversing one of the multilayer circuit boards and vacuum pressing other multilayer circuit boards on the reversed multilayer circuit board.

Abstract translation: 一种方法具有提供至少两个多层电路板的动作，组合至少两个多层电路板以形成组合的多层电路板，在组合的多层电路板上形成多个外部导电通孔，电路和触点。 每个多层电路板通过制备具有多个芯片部分的单层印刷电路板的步骤制造，将至少一个芯片附接到相应的芯片部分，将具有多个外壳的框架附接到单层印刷电路板， 半流体胶片到框架，真空挤压半流体胶片上的导电层，并通过多层电路板形成多个导电内通孔。 所述至少两个多层电路板通过反转多层电路板中的一个并在反向多层电路板上真空压制其它多层电路板的步骤组合。

公开(公告)号：US20080020231A1

公开(公告)日：2008-01-24

申请号：US11578313

申请日：2005-04-14

Applicant: Toshiaki Yamada ,  Taku Fujino ,  Shin Teraki ,  Masaki Yoshida ,  Kenichi Suzuki ,  Tadako Suzuki

Inventor： Toshiaki Yamada ,  Taku Fujino ,  Shin Teraki ,  Masaki Yoshida ,  Kenichi Suzuki ,  Tadako Suzuki

IPC: C08G59/62 ,  B32B15/092

CPC classification number: H05K1/0326 ,  C08G59/621 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K2201/0358 ,  Y10T428/12569 ,  H01L2924/00

Abstract: To provide an epoxy resin composition which can form a cured material having low dielectric constant and low dielectric loss tangent in a radio frequency region, and a film obtained by using the epoxy resin composition. An epoxy resin composition comprising: (A) at least one epoxy resin selected from the group consisting of a novolac epoxy resin having a phenolic skeleton and a biphenyl skeleton, and a bifunctional linear epoxy resin having a weight average molecular weight of 10,000 to 200,000 and having a hydroxyl group; and (B) a modified phenolic novolac having a phenolic hydroxyl group, at least part of which is esterified with a fatty acid.

Abstract translation: 提供能够形成在射频区域中具有低介电常数和低介电损耗角正切的固化材料的环氧树脂组合物和使用该环氧树脂组合物获得的膜。 一种环氧树脂组合物，其包含：（A）至少一种选自酚醛骨架的酚醛清漆环氧树脂和联苯骨架的环氧树脂和重均分子量为10,000至200,000的双官能线性环氧树脂和 具有羟基; 和（B）具有酚羟基的改性酚醛清漆，其至少一部分用脂肪酸酯化。

公开(公告)号：US20080017403A1

公开(公告)日：2008-01-24

申请号：US11882396

申请日：2007-08-01

Applicant: Toshihiro Nishii

Inventor： Toshihiro Nishii

IPC: H05K1/03

CPC classification number: H05K3/4069 ,  H05K3/382 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion and a hard portion adjacent to the pressure absorption portion. The pressure absorption portion has a thickness changing according to a pressure applied thereto. The circuit-forming board provided by this method provides a high-density circuit board of high quality having reliable electrical connection.

Abstract translation: 导电部分形成在材料片中形成的孔中。 将金属箔放置在材料片的表面上以提供层压片。 将层压片材加热并加压以提供电路形成板。 金属箔包括压力吸收部分和与压力吸收部分相邻的硬部分。 压力吸收部的厚度根据施加到其上的压力而变化。 通过该方法提供的电路形成板提供了具有可靠的电连接的高质量的高密度电路板。

公开(公告)号：US20070062640A1

公开(公告)日：2007-03-22

申请号：US11603201

申请日：2006-11-22

Applicant: Tetsuro Sato ,  Noriyuki Nagashima

Inventor： Tetsuro Sato ,  Noriyuki Nagashima

IPC: B32B37/00

CPC classification number: H05K3/4655 ,  H05K1/0366 ,  H05K3/384 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0358 ,  H05K2203/0307 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: To provide a method of manufacturing a material which can make a skeletal component as thin as possible to be contained in an insulating layer in a manufactured copper clad laminate and can securely prevent the direct contact between the nodular treatment surface of the attached copper foil and a skeletal component. In order to attain the object, here is adopted “a method of manufacturing a copper foil with an insulating layer 1 which method is a method of manufacturing a copper foil provided with a semi-cured insulating resin layer containing a skeletal component on one side surface of the copper foil, and is characterized in that: a first thermosetting resin layer 3 in an uncured or semi-cured state

Abstract translation: 为了提供一种能够使制造的覆铜层压板的绝缘层中含有尽可能薄的骨架成分的材料的制造方法，能够可靠地防止附着的铜箔的结节处理面与 骨骼成分。 为了达到此目的，这里采用“一种具有绝缘层1的铜箔的制造方法”，该方法是在一个侧面上设置有含有骨架成分的半固化绝缘树脂层的铜箔的制造方法 的铜箔，其特征在于：具有未固化或半固化状态的第一热固性树脂层3

公开(公告)号：US20060124228A1

公开(公告)日：2006-06-15

申请号：US11297831

申请日：2005-12-07

Applicant: Sang Lee ,  Joon Shin ,  Hyung Park ,  Geum Yun

Inventor： Sang Lee ,  Joon Shin ,  Hyung Park ,  Geum Yun

IPC: B29C65/02 ,  B32B27/00 ,  B29D31/00

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B37/0038 ,  B32B37/203 ,  B32B2037/243 ,  B32B2038/168 ,  B32B2250/02 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2274/00 ,  B32B2305/55 ,  B32B2307/31 ,  B32B2307/546 ,  B32B2307/5825 ,  B32B2309/02 ,  B32B2311/12 ,  B32B2457/08 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0141 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K2203/1545 ,  Y10T156/1007

Abstract: The present invention relates to an apparatus and method for manufacturing a copper clad laminate, which can achieve a substantial improvement in the peel strength between a thermoplastic liquid crystal polymer and a copper foil. The apparatus comprises: a coating means for thinly coating the surface of a copper foil with a thermoplastic liquid crystal polymer solution; a solvent removal means for drying the coated liquid crystal polymer solution to remove the solvent of the coated solution; and a thermal pressing means for laminating and thermally pressing a thermoplastic liquid crystal polymer film onto the copper foil using heating rolls so as to make a copper clad laminate.

Abstract translation: 本发明涉及一种用于制造覆铜层压板的装置和方法，其可以实现热塑性液晶聚合物和铜箔之间的剥离强度的显着提高。 该装置包括：用热塑性液晶聚合物溶液薄涂铜表面的涂层装置; 用于干燥涂覆的液晶聚合物溶液以除去涂布溶液的溶剂的溶剂去除装置; 以及热压装置，用于使用加热辊将热塑性液晶聚合物膜层压并热压到铜箔上，以制成覆铜层压板。