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    LIGHT EMITTING DEVICE
    83.
    发明申请
    LIGHT EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20150084073A1

    公开(公告)日：2015-03-26

    申请号：US14565045

    申请日：2014-12-09

    Applicant: NICHIA CORPORATION

    Inventor： Motokazu YAMADA ,  Tadaaki MIYATA ,  Naoki MORI

    IPC: H01L33/48 ,  H01L33/62 ,  H01L33/60 ,  H01L27/15

    CPC classification number: H01L33/56 ,  F21S4/22 ,  F21Y2101/00 ,  F21Y2103/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/32 ,  H01L33/483 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/09363 ,  H05K2201/10106

    Abstract: A light emitting device includes a light emitting element and a substrate including a flexible base, a plurality of wiring portions, a groove portion, and a reflective layer. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate. The wiring portions are arranged on the flexible base. The groove portion is formed between the wiring portions spaced apart from each other. The groove portion includes a first groove portion extending in a second direction intersecting the first direction. The reflective layer is arranged on the plurality of wiring portions. The light emitting element is disposed near the reflective layer and electrically connected to the plurality of wiring portions. The light emitting element is spaced apart from the first groove portion.

    Abstract translation: 发光器件包括发光元件和包括柔性基底，多个布线部分，凹槽部分和反射层的基底。 柔性基部沿对应于基板纵向的第一方向延伸。 布线部分布置在柔性基座上。 沟槽部分形成在彼此间隔开的布线部分之间。 槽部包括沿与第一方向交叉的第二方向延伸的第一槽部。 反射层设置在多个布线部分上。 发光元件设置在反射层附近并电连接到多个布线部分。 发光元件与第一槽部间隔开。

    MOTHERBOARD WITH ELECTROSTATIC DISCHARGE PROTECTION FUNCTION
    85.
    发明申请
    MOTHERBOARD WITH ELECTROSTATIC DISCHARGE PROTECTION FUNCTION 有权
    带静电放电保护功能的主板

    公开(公告)号：US20140240876A1

    公开(公告)日：2014-08-28

    申请号：US14056611

    申请日：2013-10-17

    Applicant: Wistron Corp.

    Inventor： Lung-Fai TUEN ,  Wen-Hsien WANG ,  Chiu-Hsien CHANG

    IPC: H02H9/04

    CPC classification number: H05K1/0259 ,  H02H9/045 ,  H05K2201/09354 ,  H05K2201/09363

    Abstract: A motherboard with an electrostatic discharge protection (ESD) function including a first electrode, a second electrode, an isolation region and an energy storage unit is disclosed. The first electrode receives a grounding level. The second electrode includes at least one solder pad to fix an input/output port thereon. The isolation region is disposed between the first and the second electrodes. The energy storage unit is coupled between the first and the second electrodes and disposed across the isolation region.

    Abstract translation: 公开了一种具有包括第一电极，第二电极，隔离区域和能量存储单元的静电放电保护（ESD）功能的主板。 第一个电极接收接地电平。 第二电极包括至少一个用于固定其上的输入/输出端口的焊盘。 隔离区设置在第一和第二电极之间。 能量存储单元耦合在第一和第二电极之间并且跨越隔离区域设置。

    LIGHT EMITTING DEVICE
    86.
    发明申请
    LIGHT EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20140008694A1

    公开(公告)日：2014-01-09

    申请号：US13936399

    申请日：2013-07-08

    Applicant: NICHIA CORPORATION

    Inventor： Motokazu YAMADA ,  Tadaaki MIYATA ,  Naoki MORI

    IPC: H01L33/48

    CPC classification number: H01L33/56 ,  F21S4/22 ,  F21Y2101/00 ,  F21Y2103/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/32 ,  H01L33/483 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/09363 ,  H05K2201/10106

    Abstract: A light emitting device that includes a substrate, a light emitting element and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions and a groove portion between the plurality of wiring portions. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate and the plurality of wiring portions are arranged on the base. The light emitting element is disposed on the substrate and electrically connected to the plurality of wiring portions. The sealing resin member seals the light emitting element and a part of the substrate. The sealing resin member is spaced apart from a first groove portion of the groove portion, the first groove portion extending in a second direction intersecting the first direction.

    Abstract translation: 一种发光器件，包括衬底，发光元件和密封树脂构件。 基板包括柔性基座，多个布线部分和多个布线部分之间的槽部分。 柔性基部沿着与基板的纵向方向对应的第一方向延伸，并且多个布线部分布置在基部上。 发光元件设置在基板上并电连接到多个布线部分。 密封树脂构件密封发光元件和基板的一部分。 密封树脂部件与槽部的第一槽部分隔开，第一槽部沿与第一方向交叉的第二方向延伸。

    Variable width conductive lines having substantially constant impedance
    87.
    发明授权
    Variable width conductive lines having substantially constant impedance 失效
    具有基本恒定阻抗的可变宽度导线

    公开(公告)号：US07875826B2

    公开(公告)日：2011-01-25

    申请号：US11748257

    申请日：2007-05-14

    Applicant: William A. Miller ,  Morgan Johnson

    Inventor： William A. Miller ,  Morgan Johnson

    IPC: B23K26/00

    CPC classification number: H05K3/027 ,  H05K1/0245 ,  H05K1/025 ,  H05K2201/09363 ,  H05K2201/09727 ,  H05K2203/1476

    Abstract: A method of fabricating a conductive line provides a substrate having a blanket layer of conductive material disposed thereon, a removing of a first portion of the blanket layer of conductive material to form one or more gaps that define a first line, the gaps adjacent to the first line, the first line having at least a first segment of a first width and a second segment of a second width, the first and second widths being different, a first increasing of the width of a first gap of the one or more gaps, the first gap adjacent to the first segment, by a first amount, and a second increasing of the width of a second gap of the one or more gaps, the second gap adjacent to the second segment, by a second amount wherein the first and second increasing depend upon a desired electrical characteristic. The first amount and the second amount may be different from each other.

    Abstract translation: 一种制造导电线的方法提供了一种具有布置在其上的导电材料的覆盖层的衬底，去除导电材料的覆盖层的第一部分以形成限定第一线的一个或多个间隙， 第一行，第一行具有至少第一宽度的第一段和第二宽度的第二段，第一和第二宽度不同，第一间隙的宽度的第一增加， 与第一段相邻的第一间隙，第一数量，以及与第二段相邻的一个或多个间隙的第二间隙的第二间隙的宽度的第二增加第二数量，其中第一和第二间隙 增加取决于所需的电特性。 第一量和第二量可以彼此不同。

    Large area circuitry using appliqués
    89.
    发明授权
    Large area circuitry using appliqués 有权
    使用贴花的大面积电路

    公开(公告)号：US07678997B2

    公开(公告)日：2010-03-16

    申请号：US11612576

    申请日：2006-12-19

    Applicant: Diane C. Rawlings

    Inventor： Diane C. Rawlings

    IPC: H01B7/08

    CPC classification number: H02G13/00 ,  B64D45/02 ,  H02G13/80 ,  H05K1/0265 ,  H05K1/0393 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09363 ,  Y10T29/49126

    Abstract: An appliqué for forming a surface coating to a substrate is disclosed. The appliqué contains a sectioned metal foil that provides a large area electrical circuit for connecting electrical devices. The appliqué may provide additional functions including lightning strike protection. The substrate may be an aircraft surface.

    Abstract translation: 公开了一种用于将表面涂层形成基底的贴布。 贴布包含一个分段金属箔，其提供用于连接电气设备的大面积电路。 贴布可以提供额外的功能，包括防雷。 基板可以是飞行器表面。

    Printed wiring board reliably achieving electric connection with electronic component
    90.
    发明申请
    Printed wiring board reliably achieving electric connection with electronic component 有权
    印刷电路板可靠地实现与电子部件的电连接

    公开(公告)号：US20080080153A1

    公开(公告)日：2008-04-03

    申请号：US11905317

    申请日：2007-09-28

    Applicant: Naoki Nakamura ,  Shigeru Sugino ,  Ryo Kanai

    Inventor： Naoki Nakamura ,  Shigeru Sugino ,  Ryo Kanai

    IPC: H05K7/14 ,  H05K1/02 ,  H05K1/18 ,  H05K3/10 ,  H05K3/28 ,  H05K3/30 ,  H05K7/06

    CPC classification number: H05K1/0271 ,  H05K3/28 ,  H05K3/3415 ,  H05K3/3452 ,  H05K2201/068 ,  H05K2201/09136 ,  H05K2201/09363 ,  H05K2201/09781 ,  H05K2203/0588 ,  H05K2203/1572 ,  Y10T29/4913 ,  Y10T29/49147

    Abstract: Terminal pads are arranged on a first surface of the substrate for an electronic component to receive terminals of the electronic component. An electrically-conductive film is formed on a second surface defined on the back of the first surface over the back of a mounting area for the electronic component. The mounting area is contoured along the outer periphery of the arrangement of the terminal pads. The ratio of the area of the electrically-conductive material to the area of the surface of the substrate over the back of the mounting area is set appropriate to the ratio of the area of the electrically-conductive material to the area of the surface of the substrate over the mounting area for each electronic component. This results in suppression of flexure of the printed wiring board during reflow.

    Abstract translation: 端子焊盘被布置在用于电子部件的基板的第一表面上以接收电子部件的端子。 在电子部件的安装区域的背面上的第一表面的背面上的第二表面上形成导电膜。 安装区域沿着端子焊盘的布置的外周形成轮廓。 导电材料的面积与安装区域背面的基板表面的面积的比率被设定为适合于导电材料的面积与表面的面积之比 基板在每个电子部件的安装区域上。 这导致在回流期间抑制印刷线路板的挠曲。

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