公开(公告)号：US20230380075A1

公开(公告)日：2023-11-23

申请号：US18229717

申请日：2023-08-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kenji MATSUDA

IPC: H05K3/46 ,  H05K3/30 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K3/4644 ,  H05K3/303 ,  H05K1/0242 ,  H05K1/181 ,  H05K2201/09336 ,  H05K2201/09354 ,  H05K2203/1572 ,  H05K2201/10098

Abstract: A multilayer body includes insulator layers including a first insulator layer laminated in a vertical direction. Electrodes include a signal electrode and are provided at an upper main surface of the first insulator layer and arranged in a transverse direction. At least a portion of each of the electrodes is exposed to outside from a circuit board. First and second interlayer connection conductors extend through the first insulator layer in the vertical direction and electrically connect the signal electrode and a signal conductor layer. Mounting portions are located at the portions of the electrodes that are exposed to the outside from the circuit board. The first and second interlayer connection conductors are electrically connected to the signal electrode so as not to overlap the mounting portion that is provided at the signal electrode.

公开(公告)号：US20230164910A1

公开(公告)日：2023-05-25

申请号：US17992161

申请日：2022-11-22

Applicant: Smith & Nephew PLC

Inventor： Ben Alan Askem ,  Fernando Bettani ,  Alberto Fasan ,  Allan Kenneth Frazer Grugeon Hunt ,  Felix Clarence Quintanar

IPC: H05K1/02 ,  H05K9/00 ,  A61M1/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0257 ,  H05K1/0259 ,  H05K9/0067 ,  A61M1/80 ,  A61M1/96 ,  A61M1/74 ,  A61M1/90 ,  A61M1/84 ,  H05K1/115 ,  H05K1/181 ,  A61M2209/088 ,  H05K2201/09354 ,  H05K2201/09618 ,  A61M1/962 ,  A61M1/982 ,  A61M1/985 ,  A61M1/78 ,  A61M2205/0233 ,  A61M2205/15 ,  A61M2205/18 ,  A61M2205/502 ,  A61M2205/8206 ,  H05K2201/093

Abstract: Embodiments of negative pressure wound therapy systems and methods are disclosed. In one embodiment, an apparatus includes a housing, negative pressure source, circuit board, and one or more controllers. The circuit board can be supported by the housing and include a conductive pathway extending around at least part of a perimeter of a first side of the circuit board. The conductive pathway can be electrically coupled to an electrical ground for the circuit board. The one or more controllers can be mounted on the circuit board and activate and deactivate the negative pressure source.

公开(公告)号：US20180228061A1

公开(公告)日：2018-08-09

申请号：US15943338

申请日：2018-04-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Sik PARK ,  Seung-Ki CHOI ,  Joon HEO ,  Hyun-Ju HONG

IPC: H05K9/00 ,  H05K5/00 ,  H05K1/02

CPC classification number: H05K9/002 ,  H01L2224/16225 ,  H05K1/0218 ,  H05K1/0259 ,  H05K5/0004 ,  H05K5/0017 ,  H05K9/0024 ,  H05K9/0039 ,  H05K2201/0919 ,  H05K2201/09354 ,  H05K2201/10371

Abstract: An electronic device is provided that includes a PCB including a first surface, a second surface, and a side surface; an electronic component arranged on the first surface, adjacent to a portion of the side surface; a shield structure including a cap that covers the electronic component and a sidewall extending from a periphery of the cap toward the first surface of the PCB, wherein the sidewall extends in a first direction that is non-parallel to the first surface of the PCB; a first conductive structure that is formed on a portion of the side surface of the PCB; and a second conductive structure that is formed on a portion of the first surface to be connected to the first conductive structure. The sidewall contacts with the first surface of the PCB and overlaps with the second conductive structure, when viewed from above the first surface of the PCB.

公开(公告)号：US20160313860A1

公开(公告)日：2016-10-27

申请号：US15090954

申请日：2016-04-05

Applicant: Mitsubishi Electric Corporation

Inventor： Takeshi ONO ,  Tatsuya NAKAMURA ,  Seiichiro MORI

IPC: G06F3/041 ,  G06F1/16 ,  H05K1/02 ,  G06F3/044

CPC classification number: G06F3/0418 ,  G06F1/16 ,  G06F3/044 ,  G06F2203/04107 ,  H05K1/0219 ,  H05K1/162 ,  H05K2201/0108 ,  H05K2201/09354 ,  H05K2201/10128

Abstract: A touch screen includes a first shield wiring surrounding a plurality of sensor wirings and a plurality of lead wirings, and capacitors. The distance between the first shield wiring and the outermost lead wiring which is the outermost wiring, out of the plurality of lead wirings, is larger than the intervals between the plurality of lead wirings. The capacitors are constituted by first and second electrodes including extending portions which extend in the extending direction.

Abstract translation: 触摸屏包括围绕多个传感器布线的第一屏蔽布线和多个引线布线以及电容器。 多个引线配线之中的第一屏蔽布线和作为最外面布线的最外面引线之间的距离大于多个引线布线之间的间隔。 电容器由包括沿延伸方向延伸的延伸部分的第一和第二电极构成。

公开(公告)号：US09231286B2

公开(公告)日：2016-01-05

申请号：US13901297

申请日：2013-05-23

Applicant: SK hynix Inc.

Inventor： Byung Jun Bang ,  Sang Joon Lim ,  Ju Il Eom ,  Bok Kyu Choi ,  Jin Hwan Song

IPC: H01P1/203 ,  H05K1/02 ,  H05K1/16

CPC classification number: H01P1/2039 ,  H01L2924/0002 ,  H01P1/203 ,  H05K1/0236 ,  H05K1/16 ,  H05K2201/09236 ,  H05K2201/09354 ,  H05K2201/09781 ,  H01L2924/00

Abstract: According to one embodiment, a semiconductor package includes a band stop filter, which includes: a transmission line pattern arranged on a package substrate; and a conductive stub pattern arranged along the transmission line pattern in a state of being separated from the transmission line pattern.

Abstract translation: 根据一个实施例，半导体封装包括带阻滤波器，其包括：布置在封装衬底上的传输线图案; 以及在与传输线图案分离的状态下沿着传输线图案布置的导电短截线图案。

公开(公告)号：US09204534B2

公开(公告)日：2015-12-01

申请号：US14133786

申请日：2013-12-19

Applicant: CANON KABUSHIKI KAISHA

Inventor： Shinnosuke Torii ,  Takayuki Wada

IPC: H05K1/11 ,  H05K7/06 ,  H05K1/00 ,  H05K1/02 ,  G06F3/00

CPC classification number: H05K1/0259 ,  G06F3/00 ,  G06F3/041 ,  G06F2203/04107 ,  H05K2201/09354

Abstract: A panel unit that reduces the influence of static electricity applied to a panel member forming a display surface without increasing the size of an electronic apparatus. The panel unit has a touch panel and an FPC including connection sections which are electrically connected to interconnection sections of the touch panel, and is provided with signal lines and a ground interconnection. The FPC includes conductor-exposed portions each provided between the connection sections connected to the interconnection sections and an outer part of the touch panel. The conductor-exposed portions are configured to be prevented from being electrically conducted to the signal lines, and be electrically conducted to the ground interconnection.

Abstract translation: 一种面板单元，其减小施加到形成显示表面的面板构件的静电的影响，而不增加电子设备的尺寸。 面板单元具有触摸面板和FPC，其包括电连接到触摸面板的互连部分的连接部分，并且设置有信号线和接地互连。 FPC包括各自设置在连接到互连部分的连接部分和触摸面板的外部之间的导体暴露部分。 导体暴露部分被配置为防止对信号线导电，并且被导电到地互连。

公开(公告)号：US20150131245A1

公开(公告)日：2015-05-14

申请号：US14466899

申请日：2014-08-22

Applicant: Apple Inc.

Inventor： Mahmoud R. Amini ,  Zheng Gao ,  Dennis R. Pyper

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/06 ,  H05K1/18 ,  H05K3/10

CPC classification number: H05K1/0296 ,  B23C3/12 ,  B23C5/04 ,  B23C5/12 ,  B23C2210/086 ,  B23C2210/088 ,  B23C2210/244 ,  B23C2220/16 ,  B23C2226/27 ,  H01R13/6473 ,  H01R13/6658 ,  H01R24/60 ,  H01R2201/06 ,  H05K1/0227 ,  H05K1/025 ,  H05K1/181 ,  H05K3/0044 ,  H05K3/06 ,  H05K3/10 ,  H05K3/108 ,  H05K3/243 ,  H05K3/244 ,  H05K2201/09027 ,  H05K2201/09081 ,  H05K2201/09154 ,  H05K2201/09354 ,  H05K2201/09445 ,  H05K2203/1469

Abstract: Connector inserts and other structures that have a high signal integrity and low insertion loss, are reliable, and are readily manufactured. One example may provide a connector insert formed primarily using a printed circuit board. Contacts on the connector insert may be akin to contacts on a printed circuit board and they may connect to traces having matched impedances on the printed circuit board in order to improve signal integrity and reduce insertion loss. The printed circuit board may be manufactured in a manner for increased reliability. Plating, solder block, and other manufacturing steps that are native to printed circuit board manufacturing may be employed to improve manufacturability. Specialized tools that may provide a chamfered edge on the connector inserts may be employed.

Abstract translation: 具有高信号完整性和低插入损耗的连接器插件和其他结构是可靠的，并且容易制造。 一个示例可以提供主要使用印刷电路板形成的连接器插件。 连接器插入件上的触点可以类似于印刷电路板上的触点，并且它们可以连接到在印刷电路板上具有匹配阻抗的迹线，以便改善信号完整性并减少插入损耗。 可以以增加可靠性的方式制造印刷电路板。 可以采用印刷电路板制造中的电镀，焊料块和其他制造步骤来提高可制造性。 可以使用可能在连接器插入件上提供倒角边缘的专用工具。

公开(公告)号：US20140174803A1

公开(公告)日：2014-06-26

申请号：US14234604

申请日：2012-12-25

Applicant: NGK SPARK PLUG CO., LTD

Inventor： Jyun Suzuki ,  Naoki Kito ,  Masami Hasegawa ,  Chizuo Nakashima

IPC: H05K1/03

CPC classification number: H05K1/0306 ,  H05K1/183 ,  H05K3/0052 ,  H05K3/403 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09354

Abstract: A wiring substrate includes a substrate body formed of a plate-like ceramic, having a front surface, a back surface, and a height of 0.8 mm or less; a cavity opening at the front surface and having a rectangular shape as viewed in plane; and side walls having a thickness of 0.3 mm or less between a side surface of the cavity and a side surface of the substrate body. The wiring substrate further includes an electrically conductive layer having the form of a frame and formed on the front surface to surround an opening of the cavity; a ceramic surface having the form of a frame and located adjacently to the electrically conductive layer and along the outer periphery of the front surface; and a via conductor formed in the substrate body along the side surface of the cavity between a bottom surface of the cavity and the front surface.

Abstract translation: 布线基板包括由板状陶瓷形成的基板主体，具有前表面，背面和0.8mm以下的高度; 在前表面开口的空腔，在平面上具有矩形形状; 以及在空腔的侧表面和基板主体的侧表面之间具有0.3mm或更小的厚度的侧壁。 布线基板还包括具有框架形式并形成在前表面上以包围空腔的开口的导电层; 陶瓷表面，其具有框架的形式并且与导电层相邻并且沿着前表面的外周定位; 以及形成在所述基板主体中的所述通孔导体，其沿​​着所述空腔的底表面和所述前表面之间的所述空腔的侧表面。

公开(公告)号：US20140160708A1

公开(公告)日：2014-06-12

申请号：US14103850

申请日：2013-12-12

Applicant: Kuan-Yu Chu ,  Chen-Fu Huang ,  Chiu-Mei Liu ,  Ming-Wu Chen ,  Chin-Pei Hwang ,  Chun-Cheng Huang ,  Yu-Ching Wang ,  Chung-Hsien Li ,  Kuo-Hsing Chen ,  Yu-Ting Chen ,  Chen-Hao Su

Inventor： Kuan-Yu Chu ,  Chen-Fu Huang ,  Chiu-Mei Liu ,  Ming-Wu Chen ,  Chin-Pei Hwang ,  Chun-Cheng Huang ,  Yu-Ching Wang ,  Chung-Hsien Li ,  Kuo-Hsing Chen ,  Yu-Ting Chen ,  Chen-Hao Su

IPC: H02H9/02

CPC classification number: H02H9/02 ,  G06F3/0416 ,  G06F3/044 ,  G06F2203/04107 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/0259 ,  H05K1/117 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/09354 ,  H05K2201/09727 ,  H01L2924/00

Abstract: A lead structure disposed on a substrate is provided. The substrate includes a display area disposed with a device and a peripheral area disposed with a lead structure including first pads, a second pad, first traces and a second trace. The first traces are connected to the device. Each first trace has a first linear portion and a first bonding portion connected together. Each first trace is electrically connected to one of the first pads through the first bonding portion. The second trace has a second linear portion and a second bonding portion connected together. The second trace is electrically connected to the second pad through the second bonding portion. A width of the first linear portion is smaller than a width of the first bonding portion, and a width of the second linear portion is smaller than a width of the second bonding portion.

Abstract translation: 设置在基板上的引线结构。 衬底包括布置有器件的显示区域和设置有包括第一焊盘，第二焊盘，第一迹线和第二迹线的引线结构的周边区域。 第一条迹线连接到设备。 每个第一迹线具有连接在一起的第一直线部分和第一接合部分。 每个第一迹线通过第一接合部分电连接到第一焊盘之一。 第二迹线具有连接在一起的第二直线部分和第二接合部分。 第二迹线通过第二接合部电连接到第二焊盘。 第一直线部分的宽度小于第一接合部分的宽度，并且第二直线部分的宽度小于第二接合部分的宽度。

公开(公告)号：US08395906B2

公开(公告)日：2013-03-12

申请号：US12801279

申请日：2010-06-01

Applicant: Masayuki Nikaido ,  Yoshiaki Ishigami ,  Kenichi Tamura ,  Takehiko Tokoro

Inventor： Masayuki Nikaido ,  Yoshiaki Ishigami ,  Kenichi Tamura ,  Takehiko Tokoro

IPC: H05K1/11

CPC classification number: H05K1/142 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/3011 ,  H05K1/0215 ,  H05K1/0219 ,  H05K1/025 ,  H05K3/0061 ,  H05K3/403 ,  H05K3/4053 ,  H05K2201/0919 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/09354 ,  H05K2201/09845 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A high-speed transmission circuit board connection structure includes a first high-speed transmission circuit board including a laminated substrate including a first signal transmission wiring formed on a surface thereof and a ground plane formed inside thereof, a second high-speed transmission circuit board including a circuit substrate and a second signal transmission wiring formed on a surface of the circuit substrate, a conductive board connecting member for fixing the first and second high-speed transmission circuit boards to a surface thereof, and a bonding wire for electrically connecting the first signal transmission wiring and the second signal transmission wiring. The ground plane is exposed on a side end face of the laminated substrate, and a conductive film is formed on the side end face such that the ground plane of the first high-speed transmission circuit board is electrically connected to the board connecting member with the conductive film.

Abstract translation: 高速传输电路板连接结构包括：第一高速传输电路板，包括：层叠基板，其包括形成在其表面上的第一信号传输布线和形成在其内部的接地平面;第二高速传输电路板，包括 电路基板和形成在电路基板的表面上的第二信号传输布线，用于将第一和第二高速传输电路板固定到其表面的导电板连接部件，以及用于将第一信号 传输线和第二信号传输线。 接地面暴露在层叠基板的侧端面上，在侧端面上形成导电膜，使得第一高速传输电路板的接地面与板连接部件电连接 导电膜。