公开(公告)号：US06861282B2

公开(公告)日：2005-03-01

申请号：US10119315

申请日：2002-04-10

Applicant: Kenichi Shirasaka

Inventor： Kenichi Shirasaka

IPC: H05K13/04 ,  H01L23/00 ,  H01L23/12 ,  H01L23/544 ,  H05K1/02 ,  H05K3/30 ,  H01L21/44

CPC classification number: H05K3/303 ,  H01L23/544 ,  H01L2223/54406 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2924/1815 ,  H05K1/0269 ,  H05K2201/09936 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2203/168 ,  Y02P70/613 ,  Y10S438/975

Abstract: To provide a semiconductor package mounting method, with excellent work efficiency, wherein the direction of a semiconductor package can be verified by a simple method before mounting. One corner of a square shaped display section provided on the surface of a semiconductor package body is chamfered such that the chamfer dimensions are different from those of the other corners. If image recognition by a camera determines that this chamfered part is located correctly, the orientation of a semiconductor package is determined to be correct. On the other hand, if image recognition determines that it is not located correctly, the orientation of the semiconductor package is adjusted until it is correct.

Abstract translation: 为了提供具有优异的工作效率的半导体封装安装方法，其中可以通过在安装之前的简单方法来验证半导体封装的方向。 设置在半导体封装体的表面上的方形显示部分的一个角部被倒角，使得倒角尺寸与其他角部的尺寸不同。 如果照相机的图像识别确定该倒角部分正确定位，则确定半导体封装的取向是正确的。 另一方面，如果图像识别确定其不正确定位，则调整半导体封装的取向直到其正确。

公开(公告)号：US20040079783A1

公开(公告)日：2004-04-29

申请号：US10685427

申请日：2003-10-16

Inventor： Chih-Ming Chen

IPC: B23K037/06

CPC classification number: H05K3/3452 ,  H05K1/0266 ,  H05K3/1216 ,  H05K3/3436 ,  H05K2201/09909 ,  H05K2201/09936

Abstract: A solder bump fabrication method and apparatus. First, a printed circuit board, having a plurality of devices, is provided. A material is formed on the printed circuit board, and it is disposed between pins of the devices to prevent the devices from short-circuiting due to the solder bumps. Then, the solder bumps are formed on the pins of the devices so that the devices are fixed on the printed circuit board. The printed circuit board is passed through an infrared oven to melt the solder bumps. The material separates the solder bumps attached to the pins of the devices so that the devices are prevented from short-circuiting.

Abstract translation: 焊料凸块制造方法和装置。 首先，提供具有多个装置的印刷电路板。 在印刷电路板上形成材料，并且将其设置在器件的引脚之间，以防止器件由于焊料凸块而短路。 然后，在器件的引脚上形成焊料凸块，使得器件固定在印刷电路板上。 印刷电路板通过红外线烘箱熔化焊料凸块。 该材料将附着在器件引脚上的焊料凸块分开，以防止器件短路。

公开(公告)号：US20040026767A1

公开(公告)日：2004-02-12

申请号：US10637552

申请日：2003-08-11

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Yukio Sato ,  Akihiro Oku ,  Masayoshi Aoki

IPC: H01L023/02

CPC classification number: H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2223/54473 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15173 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0266 ,  H05K3/0052 ,  H05K3/242 ,  H05K2201/09227 ,  H05K2201/09936 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/01004

Abstract: A wiring board for a semiconductor package comprises a base substrate having first and second surfaces; a wiring layer consisting of necessary wiring patterns formed on at least one of the first and second surfaces; a plurality of semiconductor element mounting areas formed on the surface of the base substrate on which the wiring layer is formed; and individual patterns as position information provided for the respective semiconductor element mounting areas, the individual patterns having a particular shape for the respective semiconductor element mounting area. The individual patterns as position information are formed on peripheral regions of the respective semiconductor element mounting areas.

Abstract translation: 一种用于半导体封装的布线板包括具有第一和第二表面的基底基板; 由形成在所述第一表面和所述第二表面中的至少一个上的必要布线图形构成的布线层; 多个半导体元件安装区域，形成在其上形成有布线层的基底基板的表面上; 以及作为为各个半导体元件安装区域提供的位置信息的各个图案，各个图案具有用于各个半导体元件安装区域的特定形状。 作为位置信息的各个图案形成在各个半导体元件安装区域的周边区域上。

公开(公告)号：US20030074193A1

公开(公告)日：2003-04-17

申请号：US10304122

申请日：2002-11-25

Applicant: Koninklijke Philips Electronics N.V.

Inventor： Renatus J. Van Der Vleuten ,  Alphons A.M.L. Bruekers ,  Arnoldus W.J. Oomen

IPC: G10L019/10

CPC classification number: G11B20/10 ,  G11B20/00007 ,  G11B20/10037 ,  G11B20/10527 ,  G11B2020/00065 ,  H03M7/3002 ,  H05K1/0266 ,  H05K3/381 ,  H05K2201/09936 ,  H05K2203/161

Abstract: A data processing apparatus is disclosed for data processing an audio signal. The data processing apparatus comprises an input terminal (1) for receiving the audio signal, a 1-bit A/D converter (4) for A/D converting the audio signal so as to obtain a bitstream signal, a prediction unit (10) for carrying out a prediction step on the bitstream signal so as to obtain a predicted bitstream signal, a signal combination unit (42) for combining the bitstream signal and the predicted bitstream signal so as to obtain a residue bitstream signal, and an output terminal (14) for supplying the residual bitstream signal (FIG. 1). Further, a recording apparatus (FIG. 4) and a transmitter apparatus (FIG. 5) comprising the data processing apparatus are disclosed. Other data processing apparatuses can be found in the FIGS. 18, 19 and 20. In addition, another data processing apparatus (FIG. 7) for converting the residue bitstream signal into an audio signal is disclosed, as well as a reproducing apparatus (FIG. 9) and a receiver apparatus (FIG. 10) comprising the other data processing apparatus.

Abstract translation: 公开了一种用于数据处理音频信号的数据处理装置。 数据处理装置包括用于接收音频信号的输入端（1），用于对音频信号进行A / D转换以获得位流信号的1位A / D转换器（4），预测单元（10） 对所述比特流信号进行预测步骤以获得预测比特流信号;组合所述比特流信号和所述预测比特流信号以获得残留比特流信号的信号组合单元（42），以及输出终端（ 14），用于提供残留比特流信号（图1）。 此外，公开了包括数据处理装置的记录装置（图4）和发送装置（图5）。 其他数据处理装置可以在图1和图2中找到。 此外，公开了用于将残留比特流信号转换成音频信号的另一数据处理装置（图7），以及再现装置（图9）和接收装置（图10 ）包括其他数据处理装置。

公开(公告)号：US20030071112A1

公开(公告)日：2003-04-17

申请号：US10201935

申请日：2002-07-25

Inventor： Chih-Ming Chen

IPC: B23K031/02

CPC classification number: H05K3/3452 ,  H05K1/0266 ,  H05K3/1216 ,  H05K3/3436 ,  H05K2201/09909 ,  H05K2201/09936

Abstract: A solder bump fabrication method and apparatus. The method comprises following steps. First, a printed circuit board, having a plurality of devices, is provided. A material is formed on the printed circuit board, and it is disposed between pins of the devices so that the material prevents the devices from short-circuiting due to the solder bumps. Then, the solder bumps are formed on the pins of the devices so that the devices are fixed on the printed circuit board. The printed circuit board is passed through an infrared oven to melt the solder bumps. Finally, extra solder bumps other than those attached to the device pins are removed, and the material separates the solder bumps attached to the pins of the devices so that the devices are prevented from short circuiting. In addition, the apparatus is provided with a plurality of through holes corresponding to gaps between the pins on the printed circuit board. Thus, isolated portions are formed between the pins on the printed circuit while the characters are printed on the printed circuit board.

Abstract translation: 焊料凸块制造方法和装置。 该方法包括以下步骤。 首先，提供具有多个装置的印刷电路板。 在印刷电路板上形成材料，并且将其设置在器件的引脚之间，使得材料防止器件由于焊料凸块而短路。 然后，在器件的引脚上形成焊料凸块，使得器件固定在印刷电路板上。 印刷电路板通过红外线烘箱熔化焊料凸块。 最后，除了附着在器件引脚上的附加焊料凸块之外，材料将附着在器件引脚上的焊料凸块分开，防止器件短路。 此外，该装置设置有与印刷电路板上的引脚之间的间隙对应的多个通孔。 因此，在印刷电路板上的引脚之间形成隔离部分，同时将字符印刷在印刷电路板上。

公开(公告)号：US20020051915A1

公开(公告)日：2002-05-02

申请号：US09989892

申请日：2001-11-20

Applicant: KEM-TEC JAPAN CO., LTD.

Inventor： Hamataro Karamatsu

IPC: G03B027/00 ,  G03F009/00 ,  G03C005/00

CPC classification number: G03F7/70541 ,  G03F1/42 ,  G03F7/2014 ,  G03F7/2022 ,  G03F7/70066 ,  G03F7/7035 ,  G03F7/70425 ,  H05K1/0266 ,  H05K3/0002 ,  H05K3/0008 ,  H05K3/0082 ,  H05K2201/09936 ,  H05K2201/09972 ,  H05K2203/056

Abstract: The object is to provide a printed board manufacturing apparatus, printed board manufacturing method and a printed board produced thereby, in which stepwise exposures of an original photomask can be performed with an improved production yield by taking into account identification markings. In a stepwise exposure apparatus nullAnull for performing the exposure step for a printed board substrate (2) in which an original mask (3) having an wiring pattern area (3a) and identification marking areas (3c1) to (3c3) around the wiring pattern area (3a) is exposed stepwise a plurality of times to the printed board substrate (2) while shifting successively the site to be exposed, original mask (3) is arranged to face the printed board substrate (2) surface to be exposed; an opaque masking element (4) is disposed on one side of the original mask (3) on the other side of which disposed is the printed board substrate (2); and the opaque masking element (4) selectively masks identification marking areas (3c1) to (3c3) of the original mask (3).

Abstract translation: 本发明的目的是提供一种印刷电路板制造装置，印刷电路板制造方法和由此制造的印刷电路板，其中可以通过考虑识别标记以提高的生产率进行原始光掩模的逐步曝光。 在对具有布线图案区域（3a）的原始掩模（3）和识别标记区域（3c1）至（3c3））的印刷基板（2）进行曝光步骤的逐步曝光装置“A” 布线图案区域3a逐渐暴露于印刷基板（2），同时连续移动要曝光的部位，将原稿掩模（3）布置成面向要暴露的印刷板基板（2）表面 ;不透明掩模元件（4）设置在原始掩模（3）的一侧上，其另一侧设置为印刷基板（2）;并且不透明掩模元件（4）有选择地掩蔽识别标记区域 3c1）至（3c3）。

公开(公告)号：US5644102A

公开(公告)日：1997-07-01

申请号：US203919

申请日：1994-03-01

Applicant: Michael D. Rostoker

Inventor： Michael D. Rostoker

IPC: H01L23/544 ,  H01L23/552 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K5/00

CPC classification number: H01L23/552 ,  H01L23/544 ,  H05K1/0266 ,  H01L2223/54406 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2924/15162 ,  H01L2924/15312 ,  H05K1/181 ,  H05K2201/09936 ,  H05K2201/10689 ,  H05K2203/161 ,  H05K3/303

Abstract: A technique is described for providing body coloration and colored indicia for indicating one or more characteristics of an integrated circuit device. Package body coloration is one source of information about device characteristics. Other indications relate to colored indicia. The colored indicia are relatively large and easily viewable from distances too great for printed text on the package body to be read comfortably. The indicia is (are) colored other than black or white. Among the visible indicia characteristics which can be used to convey information are: indicia color (or colors on multi-colored indicia), shape, size, orientation, and/or location. Among the various integrated circuit device characteristics which can be conveyed by the indicia characteristics are: device function, device speed, level of testing, degree of rad-hardness, location of reference pin, side, corner or surface, location and function of groups of pins carrying related signals, etc. In order to facilitate assembly, colored indicia matching those on the integrated circuit devices can be printed on a printed circuit board substrate at locations and in orientations on the printed circuit corresponding to the correct assembled positions of the integrated circuit devices. Colored areas can also be incorporated into semiconductor packages to control (alter, modify) the thermal characteristics of the package, particularly in order that thermal stresses on a die operating within the package can be reduced and equalized.

Abstract translation: 描述了一种用于提供身体着色和彩色标记以指示集成电路器件的一个或多个特性的技术。 包装体颜色是有关设备特性的信息的一个来源。 其他迹象涉及彩色标记。 彩色标记相对较大，从包装体上的打印文本的距离太大可以容易地看到，以便舒适地阅读。 标记是（黑色或白色）以外的颜色。 可用于传达信息的可见标记特征是：标记颜色（或多色标记上的颜色），形状，大小，方向和/或位置。 可以通过标记特性传达的各种集成电路器件特性包括：器件功能，器件速度，测试级别，拉德硬度程度，参考引脚，侧面，拐角或表面的位置，组的位置和功能 带有相关信号的引脚等。为了便于组装，可以将与集成电路器件上的那些相匹配的彩色标记印刷在印刷电路板上的位置和方向上，对应于集成电路的正确组装位置 设备。 彩色区域也可以并入到半导体封装中以控制（改变，修改）封装的热特性，特别是为了减少和均衡在封装内工作的裸片上的热应力。

公开(公告)号：US5512712A

公开(公告)日：1996-04-30

申请号：US322872

申请日：1994-10-12

Applicant: Yutaka Iwata ,  Ryo Enomoto ,  Akihito Nakamura ,  Akihiro Demura

Inventor： Yutaka Iwata ,  Ryo Enomoto ,  Akihito Nakamura ,  Akihiro Demura

IPC: H05K1/02 ,  H05K3/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K1/0266 ,  H05K1/0268 ,  H05K2201/0989 ,  H05K2201/09918 ,  H05K2201/09936 ,  H05K2203/161 ,  H05K3/184 ,  H05K3/28 ,  H05K3/303 ,  H05K3/3452

Abstract: Improved printed wiring boards are disclosed, in which indications showing the types of electronic devices to be mounted on the printed wiring boards and other information are provided within the insulation cover coating and are protected from getting accidentally scraped off. Alignment marks are also well protected so that users can always rely on the alignment marks. The surfaces of the printed wiring boards are smooth and flat, which prevents stagnation trouble in a feeding operation of the printed wiring boards as well as helps provide a securer mounting of electronic devices. An improved wiring freedom is also provided.

Abstract translation: 公开了改进的印刷电路板，其中在绝缘盖涂层内设置了表示要安装在印刷电路板上的电子装置的类型和其它信息的指示并防止意外刮掉。 对齐标记也得到很好的保护，以便用户始终可以依靠对准标记。 印刷电路板的表面光滑平坦，防止印刷电路板的馈电操作中的停滞故障，并且有助于提供电子设备的牢固安装。 还提供了改进的布线自由度。

公开(公告)号：US5260168A

公开(公告)日：1993-11-09

申请号：US902418

申请日：1992-06-19

Applicant: Robert D. Vernon

Inventor： Robert D. Vernon

IPC: H01L21/60 ,  H01L23/495 ,  H01L23/544 ,  H05K1/02 ,  H05K3/00 ,  H05K3/06 ,  G03C5/00

CPC classification number: H01L24/86 ,  H01L23/49572 ,  H01L23/544 ,  H05K3/0082 ,  H01L2223/54473 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3025 ,  H05K1/0266 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2203/0195 ,  H05K2203/0505 ,  H05K2203/0551 ,  H05K2203/107 ,  H05K2203/1545 ,  H05K3/064 ,  Y10T29/49121 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T428/14 ,  Y10T428/1486 ,  Y10T428/24322

Abstract: A method for patterning a tape to which an integrated circuit may be bonded including providing a tape having a top layer of unexposed film which, when exposed in an interconnection pattern and developed, acts as a mask for processing a photoprocessable layer of the tape to provide conductive portions in an interconnection pattern on the tape.

Abstract translation: 一种用于图案化可以结合集成电路的带的方法，包括提供具有未曝光膜顶层的带，当以互连图案曝光并显影时，其作为用于处理带的可光处理层的掩模，以提供 磁带上的互连图案中的导电部分。

公开(公告)号：US5240737A

公开(公告)日：1993-08-31

申请号：US734254

申请日：1991-07-22

Applicant: Shin Kawakami ,  Hirotaka Okonogi ,  Junichi Ichikawa

Inventor： Shin Kawakami ,  Hirotaka Okonogi ,  Junichi Ichikawa

IPC: H05K3/28 ,  H05K1/02 ,  H05K3/00 ,  H05K3/34

CPC classification number: H05K3/3452 ,  H05K1/0266 ,  H05K2201/0108 ,  H05K2201/09936 ,  H05K2203/122 ,  H05K2203/161 ,  H05K3/3447 ,  H05K3/3489

Abstract: In a method of manufacturing printed circuit boards by coating a flux preventive film for preventing a flux from rising on a component surface of an insulation board, the method of manufacturing printed circuit boards according to the present invention is characterized in that said method comprises the steps of printing white blank marks, white blank symbols and white blank letters corresponding to symbol marks, other symbols and letters on the component side surface of said insulation board before coating said flux preventive film, and then coating said flux preventive film of a transparent or translucent material on the printed surface.

Abstract translation: 在通过涂布用于防止焊剂在绝缘板的部件表面上升的助熔剂的制造印刷电路板的方法中，根据本发明的印刷电路板的制造方法的特征在于所述方法包括以下步骤 在涂布所述防磁膜之前，在所述绝缘板的组件侧表面上印刷白色空白符号，白色空白符号和对应于符号标记，其他符号和字母的白色空白字母，然后涂覆透明或半透明的防磁膜 印刷表面上的材料。