公开(公告)号：US20240047393A1

公开(公告)日：2024-02-08

申请号：US18489871

申请日：2023-10-19

Applicant: Innolux Corporation

Inventor： Chueh Yuan Nien ,  Chao-Chin Sung ,  Chia-Hung Hsieh ,  Mei Cheng Liu

IPC: H01L23/00 ,  H01L25/16 ,  H05K1/11 ,  H01L23/31 ,  H05K1/18

CPC classification number: H01L24/05 ,  H01L25/162 ,  H05K1/111 ,  H01L23/3192 ,  H05K1/181 ,  H01L25/167 ,  H01L2924/35121 ,  H01L24/32 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/05073 ,  H01L2224/0502 ,  H01L2224/05573 ,  H01L2224/05564 ,  H01L2224/05553 ,  H01L2224/05013 ,  H01L2924/12041 ,  H01L2924/1426 ,  H05K2201/10522 ,  H05K2201/0989 ,  H05K2201/10106

Abstract: An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a conductive electrode, and a first layer. The conductive electrode and the first layer are disposed on the base, the first layer surrounds the conductive electrode and overlaps an edge portion of the conductive electrode. In a cross-sectional view, the first layer is divided into a first part and a second part, the conductive electrode is located between the first part and the second part, and a width of the first part is different from a width of the second part.

公开(公告)号：US11818844B2

公开(公告)日：2023-11-14

申请号：US17826013

申请日：2022-05-26

Applicant: CANON KABUSHIKI KAISHA

Inventor： Yuya Karakawa ,  Mitsutoshi Hasegawa ,  Takashi Aoki ,  Noritake Tsuboi

IPC: H05K1/18 ,  H01L23/498 ,  H05K3/34 ,  H05K1/14

CPC classification number: H05K1/181 ,  H01L23/49816 ,  H05K3/3452 ,  H05K3/3485 ,  H05K1/148 ,  H05K2201/0989 ,  H05K2201/10015 ,  H05K2201/1053 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/048 ,  H05K2203/306

Abstract: A semiconductor module includes a semiconductor device having a first land, a second land, and a third land, a wiring board having a substrate, and a fourth land, a fifth land, and a sixth land disposed on the main surface of the substrate, a chip component having a first electrode and a second electrode disposed across a distance in the longitudinal direction and being disposed between the wiring board and the semiconductor device, a first solder joint for bonding the first land, the fourth land, and the first electrode, a second solder joint for bonding the second land, the fifth land, and the second electrode, and a third solder joint for bonding the third land and the sixth land. The volume of the first solder joint and the volume of the second solder joint are each larger than the volume of the third solder joint.

公开(公告)号：US20190221488A1

公开(公告)日：2019-07-18

申请号：US16329057

申请日：2016-10-01

Applicant: Intel Corporation

Inventor： Quan QI ,  Carlton E. HANNA

IPC: H01L23/13 ,  H01L23/538 ,  H01L21/48 ,  H01L23/00 ,  H01L21/683 ,  H01L23/498 ,  H01L25/18 ,  H01L25/16

CPC classification number: H01L23/13 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/16 ,  H01L25/18 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19102 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/183 ,  H05K3/0097 ,  H05K3/205 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/0989 ,  H05K2201/10674 ,  H01L2924/00014

Abstract: Embodiments are generally directed to module installation on printed circuit boards with embedded trace technology. An embodiment of a printed circuit board includes one or more layers including a top layer; multiple embedded traces that are contained in an area of a surface of a first layer of the one or more layers of the printed circuit board; and a first module, the first module being installed on the plurality of printed traces in the area.

公开(公告)号：US20180124916A1

公开(公告)日：2018-05-03

申请号：US15662837

申请日：2017-07-28

Applicant: KYOCERA Corporation

Inventor： Seiji HATTORI

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/113 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/16225 ,  H05K1/0262 ,  H05K1/0298 ,  H05K1/114 ,  H05K1/181 ,  H05K2201/09227 ,  H05K2201/0989 ,  H05K2201/10674

Abstract: A wiring board according to the present disclosure includes an insulating substrate having a semiconductor-element mount portion, a constant-voltage-regulator mount portion, and an external connection surface; semiconductor-element connection pads; constant-voltage-regulator connection pads; external connection pads; and wiring conductors including a wiring conductor for signal connected to the semiconductor-element connection pad for signal in an outer peripheral portion of the insulating substrate and extending in the insulating substrate from an area below the semiconductor-element mount portion to the outer peripheral portion. The wiring conductor for signal extends on a surface of a build-up insulating layer of the insulating substrate, on which the solid conductor for grounding or for power supply extends, to the outer peripheral portion without passing through an area below an intermediate portion between the semiconductor-element mount portion and the constant-voltage-regulator mount portion.

公开(公告)号：US20170280554A1

公开(公告)日：2017-09-28

申请号：US15503752

申请日：2016-08-01

Applicant: NIPPON MEKTRON, LTD.

Inventor： Ryoichi TOYOSHIMA

IPC: H05K1/02 ,  H05K3/38 ,  H05K3/28 ,  H05K3/46 ,  H05K3/06

CPC classification number: H05K1/028 ,  H05K1/0218 ,  H05K3/062 ,  H05K3/28 ,  H05K3/384 ,  H05K3/421 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0154 ,  H05K2201/0989 ,  H05K2203/072 ,  Y10T29/49165

Abstract: [Problem to be Solved]A multilayer flexible printed circuit board having a strip line advantageous to folding is provided.[Solution]A multilayer flexible printed circuit board 100 of an embodiment is a multilayer flexible printed circuit board having a strip line foldable at a folding part F1, the board including: a flexible insulative substrate 30; an inner layer circuit pattern 5 provided inside the flexible insulative substrate 30 and including a signal line 6 extending in a predetermined direction; a ground thin film 14a constituting a ground layer at least in the folding part F1 out of a ground layer of the strip line and constituted of a nonelectrolytic plating coat 14 formed on the flexible insulative substrate 30; and a protective layer 20 that covers the ground thin film 14a and is in close contact with an exposed part 19 from which the flexible insulative substrate 30 is exposed.

公开(公告)号：US09392695B2

公开(公告)日：2016-07-12

申请号：US14321068

申请日：2014-07-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Min Gi Cho

IPC: H05K1/16 ,  H05K7/00 ,  H05K1/18 ,  H05K1/14 ,  H05K3/28 ,  H01L23/498 ,  H01L21/56 ,  H01L23/13 ,  H05K1/02 ,  H05K1/11 ,  H01L23/31 ,  H01L23/50

CPC classification number: H05K1/181 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/1531 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0251 ,  H05K1/113 ,  H05K1/144 ,  H05K3/28 ,  H05K2201/09436 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10378 ,  H05K2201/2018 ,  H05K2203/1327

Abstract: There is provided an electronic component module capable of increasing the degree of integration by mounting electronic components on both surfaces of a substrate. The electronic component module according to an exemplary embodiment of the present disclosure includes a first substrate having one surface on which at least one electronic component is mounted; and a second substrate bonded to one surface of the first substrate and including at least one component accommodating part in which the at least one electronic component is accommodated, wherein the second substrate includes a core layer, and metal wiring layers formed on both surfaces of the core layer and having a plurality of electrode pads.

Abstract translation: 提供了一种能够通过将电子部件安装在基板的两个表面上而增加集成度的电子部件模块。 根据本公开的示例性实施例的电子部件模块包括具有一个表面的第一基板，至少一个电子元件安装在该表面上; 以及第二基板，其接合到所述第一基板的一个表面并且包括容纳所述至少一个电子部件的至少一个部件容纳部，其中所述第二基板包括芯层，以及形成在所述第二基板的两个表面上的金属布线层 并具有多个电极焊盘。

公开(公告)号：US20150351244A1

公开(公告)日：2015-12-03

申请号：US14700320

申请日：2015-04-30

Applicant: FUJITSU LIMITED

Inventor： Keiichi Yamamoto ,  Takashi Fukuda

IPC: H05K1/18

CPC classification number: H05K3/321 ,  H05K3/28 ,  H05K2201/0989 ,  H05K2201/10628

Abstract: A printed board unit includes: a base material; an electrode formed on the base material; a resist film formed on the base material, the resist film has an opening to expose the electrode; a recess part formed on an inner wall of the resist film; an electronic component including a lead terminal electrically coupled to the electrode; and a bonding material which bonds the lead terminal to the electrode in the opening, a portion of the bonding material being mounted on the lead terminal at an inner side of the opening opposite to the recess part.

Abstract translation: 印刷电路板单元包括：基材; 形成在基材上的电极; 形成在基材上的抗蚀剂膜，抗蚀剂膜具有露出电极的开口; 形成在抗蚀膜的内壁上的凹部; 电子部件，包括电连接到所述电极的引线端子; 以及接合材料，其将引线端子与开口中的电极接合，接合材料的一部分在与凹部相对的开口的内侧安装在引线端子上。

公开(公告)号：US20150156865A1

公开(公告)日：2015-06-04

申请号：US14199326

申请日：2014-03-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Kwan LEE ,  Myung Sam KANG ,  Joo Hwan JUNG ,  Ju Hee PARK ,  Seung Yeop KOOK

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K3/4682 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2924/13055 ,  H01L2924/15156 ,  H01L2924/18161 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/10674 ,  Y10T29/49147 ,  H01L2924/00

Abstract: Disclosed herein are a coreless board for a semiconductor package and a method of manufacturing the same. The coreless board for the semiconductor package includes: a support; a build-up layer formed on the support; an external connection terminal formed on the build-up layer; and a solder resist layer formed on the build-up layer so as to expose the external connection terminal.

Abstract translation: 本文公开了一种用于半导体封装的无芯板及其制造方法。 半导体封装的无芯板包括：支架; 形成在支撑体上的积聚层; 形成在积聚层上的外部连接端子; 以及形成在积聚层上以使外部连接端子露出的阻焊层。

公开(公告)号：US08971006B2

公开(公告)日：2015-03-03

申请号：US13362562

申请日：2012-01-31

Applicant: Yuuki Mikami ,  Toru Itabashi ,  Takahiko Furuta ,  Ryoichi Shiraishi ,  Yusuke Takahashi ,  Hiroaki Nakamura ,  Shigeki Nishiyama

Inventor： Yuuki Mikami ,  Toru Itabashi ,  Takahiko Furuta ,  Ryoichi Shiraishi ,  Yusuke Takahashi ,  Hiroaki Nakamura ,  Shigeki Nishiyama

IPC: H01H85/08 ,  H01H85/10 ,  H02H5/04 ,  H05K1/02 ,  H01H85/046

CPC classification number: H02H5/047 ,  H01H85/046 ,  H01H85/08 ,  H01H85/10 ,  H05K1/0265 ,  H05K1/0293 ,  H05K2201/09263 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10181

Abstract: An electronic control device includes a substrate, a plurality of component-mounted wires, a plurality of electronic components, a common wire, an interrupt wire and a protective layer. The component-mounted wires and the common wire are disposed on the substrate. The electronic components are mounted on the respective component-mounted wires and are coupled with the common wire. The interrupt wire is coupled between one component-mounted wire and the common wire, and is configured to melt in accordance with heat generated by an overcurrent to interrupt a coupling between the component-mounted wire and the common wire. The protective layer covers a surface of the substrate including the interrupt wire and defines an opening portion so that at least a portion of the interrupt wire is exposed.

公开(公告)号：US08790130B2

公开(公告)日：2014-07-29

申请号：US12285243

申请日：2008-09-30

Applicant: Chang-Yong Yun

Inventor： Chang-Yong Yun

IPC: H01M10/42 ,  H01M2/10

CPC classification number: H01M10/42 ,  H01M2/1061 ,  H01M2/30 ,  H01M10/425 ,  H01M2200/00 ,  H05K1/148 ,  H05K3/281 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/0989 ,  Y10T29/49126

Abstract: A flexible Printed Circuit (PC) board, junction method thereof and battery pack using the flexible PC board prevents cracking of terminal units of a flexible PC board and reducing degradation thereof due to deformation by increasing its tensile strength. The flexible PC board has a multi-layered structure including wiring with terminal units, a first insulating layer and a second insulating layer arranged both over and under the wiring. An end of the second insulating layer is arranged between an end of the terminal units and an end of the first insulating layer.

Abstract translation: 使用柔性PC板的柔性印刷电路板（PC）板，其接合方法和电池组防止柔性PC板的端子单元的破裂，并通过增加其拉伸强度来减少由于变形而的劣化。 柔性PC板具有多层结构，包括布线与端子单元，第一绝缘层和布置在布线下方的第二绝缘层。 第二绝缘层的端部设置在端子单元的端部和第一绝缘层的端部之间。