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    Computer including a carrier board and methods of assembly
    1.
    发明授权
    Computer including a carrier board and methods of assembly 失效
    计算机包括载板和组装方法

    公开(公告)号：US08286009B2

    公开(公告)日：2012-10-09

    申请号：US12551116

    申请日：2009-08-31

    Applicant: David S. Slaton

    Inventor： David S. Slaton

    IPC: G06F1/00

    CPC classification number: G06F1/26

    Abstract: A method is provided for assembling a computer that includes a carrier board having a board management controller (BMC), a power supply, and a carrier bus. The method includes coupling a module to the carrier board, determining, by the carrier board, a type of the module, and providing power to the module based on the module type such that a voltage component of the power is one of a first voltage and a second voltage that is different than the first voltage.

    Abstract translation: 提供一种用于组装包括具有板管理控制器（BMC），电源和载波总线的载板的计算机的方法。 该方法包括将模块耦合到载板，由载板确定模块的类型，并且基于模块类型向模块提供功率，使得功率的电压分量是第一电压和 与第一电压不同的第二电压。

    Heat sink and method of forming a heatsink using a wedge-lock system
    5.
    发明授权
    Heat sink and method of forming a heatsink using a wedge-lock system 失效
    散热器和使用楔形锁定系统形成散热器的方法

    公开(公告)号：US08347502B2

    公开(公告)日：2013-01-08

    申请号：US11966201

    申请日：2007-12-28

    Applicant: David S. Slaton ,  David L. McDonald

    Inventor： David S. Slaton ,  David L. McDonald

    IPC: B21D53/02

    CPC classification number: F28F21/02 ,  F28F3/02 ,  F28F21/084 ,  F28F21/085 ,  H01L21/4882 ,  H01L23/367 ,  H01L23/373 ,  H01L23/4006 ,  H01L2023/4068 ,  H01L2023/4075 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4935 ,  H01L2924/00

    Abstract: The present disclosure is related to a heatsink and a method for forming a heatsink. In one embodiment, a method for forming the heatsink includes forming at least one thermo pyrolytic graphite element. The at least one TPG element includes a first side having a wedge-shaped surface and a second side having a flat surface. The method further includes layering a metal material over the at least one TPG element, the metal configured to be complementary to the first side of the at least one TPG element, and applying pressure to fasten the metal material to the at least one TPG element.

    Abstract translation: 本公开涉及散热器和形成散热器的方法。 在一个实施例中，形成散热器的方法包括形成至少一个热解石墨元件。 所述至少一个TPG元件包括具有楔形表面的第一侧和具有平坦表面的第二侧。 所述方法还包括在所述至少一个TPG元件上层叠金属材料，所述金属被配置为与所述至少一个TPG元件的第一侧互补，并且施加压力以将所述金属材料紧固到所述至少一个TPG元件。

    Apparatus and method for transferring heat from processors
    6.
    发明授权
    Apparatus and method for transferring heat from processors 失效
    用于从处理器传送热量的装置和方法

    公开(公告)号：US07312992B2

    公开(公告)日：2007-12-25

    申请号：US10999725

    申请日：2004-11-30

    Applicant: Edward M. Jory ,  David S. Slaton

    Inventor： Edward M. Jory ,  David S. Slaton

    IPC: H05K7/20

    CPC classification number: G06F1/20 ,  H05K7/20727

    Abstract: A heat exchange apparatus having a housing that includes a first region and a second region, and a wall separating the first region from the second region, is disclosed. The second region includes a fluid flow entry port and a fluid flow exit port to define a fluid flow path, and a heat exchanger exposed to the fluid flow path. The heat exchanger includes first and second portions in thermal communication with each other, where the first portion is disposed at the first region and the second portion is disposed at the second region. The fluid flow path is isolated from the first region and provides for the removal of heat from the first region.

    Abstract translation: 公开了一种具有包括第一区域和第二区域的壳体以及将第一区域与第二区域分开的壁的热交换装置。 第二区域包括流体流入口和流体流出口以限定流体流动路径，以及暴露于流体流动路径的热交换器。 热交换器包括彼此热连通的第一和第二部分，其中第一部分设置在第一区域，第二部分设置在第二区域。 流体流动路径与第一区域隔离并且提供从第一区域去除热量。

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