公开(公告)号：US20030226604A1

公开(公告)日：2003-12-11

申请号：US10440515

申请日：2003-05-16

Applicant: MICRONIT MICROFLUIDICS B.V.

Inventor： Stefan Schlautmann ,  Albert Van den Berg ,  Johannes Gerardus Elisabeth Gardeniers

IPC: F15C001/04

CPC classification number: B81C1/00119 ,  B01L3/502707 ,  B01L2200/10 ,  B01L2300/0874 ,  B01L2300/0883 ,  B01L2300/0887 ,  B01L2400/0418 ,  B81B2201/0214 ,  B81B2201/058 ,  B81B2203/0338 ,  B81C2201/0104 ,  G01N33/48707 ,  Y10T137/2191

Abstract: The present invention relates to a method of fabricating a microfluidic device including at least two substrates provided with a fluid channel, comprising the steps of: a) etching at least a channel and one or more fluid ports in a first and/or a second substrate; b) depositing a first layer on a surface of the second substrate; c) partially removing the first layer in accordance with a predefined geometry; d) depositing a second layer on top of the first layer and the substrate surface; e) planarizing the second layer so as to smooth the upper surface thereof; f) aligning the first and second substrate; g) bonding the first substrate on the planarized second layer of the second substrate.

Abstract translation: 本发明涉及一种制造微流体装置的方法，该微流体装置包括具有流体通道的至少两个基板，包括以下步骤：a）至少蚀刻第一和/或第二基板中的通道和一个或多个流体端口 ; b）在第二基板的表面上沉积第一层; c）根据预定几何部分去除第一层; d）在第一层和衬底表面的顶部上沉积第二层; e）平面化第二层以平滑其上表面; f）对准所述第一和第二基板; g）将第一衬底接合在第二衬底的平坦化的第二层上。

公开(公告)号：US09387475B2

公开(公告)日：2016-07-12

申请号：US12439780

申请日：2007-08-31

Applicant: Ronny Van't Oever ,  Marko Theodoor Blom

Inventor： Ronny Van't Oever ,  Marko Theodoor Blom

IPC: G01N33/00 ,  B01L3/00

CPC classification number: B01L3/502715 ,  B01L3/502707 ,  B01L3/5635 ,  B01L2200/027 ,  B01L2200/0642 ,  B01L2300/0645

Abstract: An assembly comprising at least one microfluidic device and a mounting piece, this microfluidic device comprising at least one material layer and at least one first fluidic port, which first fluidic port it situated at least partially in an end surface of the material layer and which mounting piece comprises at least one fluidic component, wherein the mounting piece is coupled to the microfluidic device by means of first coupling means provided for this purpose such that the fluidic component is connected to the first fluidic port. The invention also relates to such a mounting piece.

Abstract translation: 一种包括至少一个微流体装置和安装件的组件，该微流体装置包括至少一个材料层和至少一个第一流体端口，该至少一个第一流体端口至少部分地位于材料层的端表面中，并且其安装 其包括至少一个流体部件，其中通过为此目的提供的第一联接装置将安装件联接到微流体装置，使得流体部件连接到第一流体端口。 本发明还涉及这种安装件。

公开(公告)号：US20140246801A1

公开(公告)日：2014-09-04

申请号：US13782752

申请日：2013-03-01

Applicant: MICRONIT MICROFLUIDICS B.V.

Inventor： Marinus Bernardus OLDE RIEKERINK ,  Wilfred BUESINK ,  Arenda Hendrika Jacoba KOELEWIJN-HUBERS ,  Marko Theodoor BLOM ,  Ronny VAN 'T OEVER

IPC: B29C63/00

CPC classification number: B01L3/502707 ,  B01J2219/00286 ,  B01J2219/00585 ,  B01J2219/00637 ,  B01L9/527 ,  B01L2300/0816 ,  B01L2300/0883 ,  B01L2300/16 ,  B29C69/005 ,  B29C70/545 ,  B29C2793/0009 ,  B29C2793/0027 ,  B29C2793/0063 ,  B81B2201/058 ,  B81C1/00206 ,  Y10T137/8593 ,  Y10T156/1052

Abstract: The invention relates to a method for manufacturing microfluidic chips having at least one capillary for through-flow of a fluid, comprising the steps of: (a) providing a starting material; (b) forming at least one shared capillary in the starting material, said shared capillary comprising an fluidic inlet and an fluidic outlet; (c) functionalizing the chips by supplying a functionalization fluid to the shared capillary; and (d) dividing the starting material into separate chips. The invention further relates to a device for functionalizing microfluidic chips having at least one capillary for through-flow of a fluid, said device comprising a material holder for holding a starting material in a fixed position during functionalization, said material holder comprising at least one inlet connector for connecting at least one shared capillary formed in the starting material to a functionalization fluid supply.The invention further relates to a microfluidic chip and a device for holding a microfluidic chip.

Abstract translation: 本发明涉及一种用于制造具有至少一个用于流体流通的毛细管的微流体芯片的方法，包括以下步骤：（a）提供起始材料; （b）在原料中形成至少一个共用毛细管，所述共用毛细管包括流体入口和流体出口; （c）通过向共用毛细管提供官能化流体来使芯片功能化; 和（d）将原料分成单独的碎片。 本发明还涉及一种用于对具有至少一个用于流体流通的毛细管进行功能化的微流体芯片的装置，所述装置包括用于在官能化期间将起始材料保持在固定位置的材料保持器，所述材料保持器包括至少一个入口 连接器，用于将形成在起始材料中的至少一个共用毛细管连接到功能化流体供应源。 本发明还涉及微流控芯片和用于保持微流控芯片的装置。

公开(公告)号：US09748136B2

公开(公告)日：2017-08-29

申请号：US14440814

申请日：2013-11-05

Applicant: MICRONIT MICROFLUIDICS B.V.

Inventor： Ronny Van 'T Oever ,  Marko Theodoor Blom ,  Jeroen Haneveld ,  Johannes Oonk ,  Peter Tijssen

IPC: H01L21/768 ,  H01L23/14 ,  H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  B81C1/00

CPC classification number: H01L21/76879 ,  B81C1/00095 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/147 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for forming an electrically conductive via in a substrate that includes the steps of: forming a through hole in a first substrate; bringing a first surface of a second substrate into contact with the first surface of the first substrate, such that the through hole in the first substrate is covered by the first surface of the second substrate; filling the through hole in the first substrate with an electrically conductive material by electroplating to form the electrically conductive via, and removing the second substrate, wherein the first surface of the first and the second substrate each have a surface roughness Ra of less than 2 nm, preferably less than 1 nm, more preferably less than 0.5 nm, and the first surface of the first and the second substrate are brought in direct contact with each other, such that a direct bond is formed there between.

公开(公告)号：US09573804B2

公开(公告)日：2017-02-21

申请号：US14361683

申请日：2012-12-21

Applicant: Micronit Microfluidics B.V.

Inventor： Ronny Van 'T Oever ,  Marko Theodoor Blom ,  Jeroen Haneveld ,  Johannes Oonk ,  Marinus Bernardus Olde Riekerink ,  Peter Tijssen ,  Hendrik Jan Hildebrand Tigelaar ,  Jean-Noël Fehr ,  Jean-Christophe Roulet ,  Amitava Gupta

IPC: B81C1/00 ,  H01L23/10 ,  H01L21/50 ,  B81C3/00 ,  C23F1/02

CPC classification number: B81C1/00269 ,  B81B2201/058 ,  B81C3/001 ,  B81C2201/0132 ,  B81C2203/0118 ,  B81C2203/019 ,  C23F1/02 ,  H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  Y10T428/239 ,  H01L2924/00

Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.

Abstract translation: 本发明涉及通过使用用于提供接合的中间薄膜金属层将至少两个基板（例如由玻璃，硅，陶瓷，铝或硼制成）接合的方法，所述方法包括以下步骤：a） 提供所述两个基板; b）将所述薄膜金属层沉积在所述两个基板的第一基板的表面的至少一部分上; c）使所述第二基板的表面与所述第一基板的所述表面上的所述薄膜金属层接触，从而提供所述第二基板和所述第一基板上的所述薄膜金属层之间的接合; 以及d）至少局部加强第一基板上的第二基板和薄膜金属层之间的接合。 本发明还涉及包括例如由玻璃，硅，陶瓷，铝或硼制成的两个基底和中间薄膜金属层的器件。

公开(公告)号：US20100239462A1

公开(公告)日：2010-09-23

申请号：US12439780

申请日：2007-08-31

Applicant: Ronny Van't Oever ,  Marko Theodoor Blom

Inventor： Ronny Van't Oever ,  Marko Theodoor Blom

IPC: G01N33/00

CPC classification number: B01L3/502715 ,  B01L3/502707 ,  B01L3/5635 ,  B01L2200/027 ,  B01L2200/0642 ,  B01L2300/0645

Abstract: An assembly comprising at least one microfluidic device and a mounting piece, this microfluidic device comprising at least one material layer and at least one first fluidic port, which first fluidic port it situated at least partially in an end surface of the material layer and which mounting piece comprises at least one fluidic component, wherein the mounting piece is coupled to the microfluidic device by means of first coupling means provided for this purpose such that the fluidic component is connected to the first fluidic port. The invention also relates to such a mounting piece.

Abstract translation: 一种包括至少一个微流体装置和安装件的组件，该微流体装置包括至少一个材料层和至少一个第一流体端口，该至少一个第一流体端口至少部分地位于材料层的端表面中，并且其安装 其包括至少一个流体部件，其中通过为此目的提供的第一联接装置将安装件联接到微流体装置，使得流体部件连接到第一流体端口。 本发明还涉及这种安装件。

公开(公告)号：US07256106B2

公开(公告)日：2007-08-14

申请号：US10499292

申请日：2002-12-19

Applicant: Ronny Van't Oever

Inventor： Ronny Van't Oever

IPC: H01L21/00 ,  H01L21/30 ,  H01L21/46

CPC classification number: B81C1/00888

Abstract: The present invention relates to a method for dividing a substrate into a number of individual chip parts, comprising the steps of: forming a number of chip parts in the substrate, comprising, for each chip part, of arranging recesses in the substrate for containing fluid; arranging one or more breaking grooves in the substrate along individual chip parts; applying mechanical force to the substrate to break the substrate along the breaking grooves. The invention also relates to a substrate as well as a chip part.

Abstract translation: 本发明涉及一种将基板分割为多个单独的芯片部件的方法，包括以下步骤：在基板中形成多个芯片部件，每个芯片部分包括在用于容纳流体的基板中设置凹槽 ; 沿着各个芯片部件在基板中布置一个或多个断开槽; 向基板施加机械力以沿着断裂槽破坏基板。 本发明还涉及基板以及芯片部分。

公开(公告)号：US08343441B2

公开(公告)日：2013-01-01

申请号：US12823530

申请日：2010-06-25

Applicant: Ronny van 't Oever ,  Marko Theodoor Blom

Inventor： Ronny van 't Oever ,  Marko Theodoor Blom

IPC: B01L3/00

CPC classification number: B81C99/004 ,  B81B2201/058 ,  Y10T29/49764

Abstract: Aspects of the invention include methods and devices for manufacturing and testing microfluidic chips having at least one capillary for through-flow of a fluid.

Abstract translation: 本发明的方面包括用于制造和测试具有至少一个用于流体流通的毛细管的微流体芯片的方法和装置。

公开(公告)号：US20100320748A1

公开(公告)日：2010-12-23

申请号：US12666497

申请日：2008-06-23

Applicant: Ronny Van't Oever ,  Marko Theodoor Blom ,  Wilfred Buesink

Inventor： Ronny Van't Oever ,  Marko Theodoor Blom ,  Wilfred Buesink

IPC: F16L55/00 ,  B23P19/02

CPC classification number: B01L3/502715 ,  B01L3/565 ,  B01L9/527 ,  B01L2200/025 ,  B01L2200/027 ,  B01L2300/0816 ,  Y10T29/49945 ,  Y10T29/5367 ,  Y10T29/53678 ,  Y10T29/53709 ,  Y10T29/53783 ,  Y10T29/53943 ,  Y10T29/53983 ,  Y10T29/53987 ,  Y10T29/53996

Abstract: A system for fluidic coupling and uncoupling of fluidic conduits and a microfluidic chip, wherein the fluidic conduits are connected mechanically to a first structural part and the microfluidic chip is carried by a second structural part. The structural parts are moved perpendicularly toward and away from each other by means of a mechanism provided for this purpose. Outer ends of the fluidic conduits can thus be moved over a determined distance substantially perpendicularly to the outer surface of the microfluidic chip and connecting openings in the outer surface of the microfluidic chip. This enables accurate realization of fluidic coupling and uncoupling without the occurrence of undesirable moments of force and with minimal risk of damage to the fluidic conduits or the connecting openings. With such system requirements which can be set in respect of convenience, speed, temperature resistance, sealing, chemical resistance, reproducibility and so forth, can be fulfilled.

Abstract translation: 一种用于流体连接和解耦流体导管和微流体芯片的系统，其中流体导管机械地连接到第一结构部件，并且微流体芯片由第二结构部件承载。 通过为此目的提供的机构，结构部件彼此垂直移动并远离彼此。 因此，流体导管的外端可以大致垂直于微流体芯片的外表面确定的距离和微流体芯片的外表面中的连接开口移动。 这使得能够精确地实现流体耦合和解耦，而不会出现不期望的力矩并且具有损坏流体导管或连接开口的最小风险。 可以满足在便利性，速度，耐温性，密封性，耐化学性，再现性等方面可以设定的这种系统要求。

公开(公告)号：US20050148158A1

公开(公告)日：2005-07-07

申请号：US10499292

申请日：2002-12-19

Applicant: Ronny Van't Oever

Inventor： Ronny Van't Oever

IPC: B81C1/00 ,  H01L21/301 ,  H01L21/46

CPC classification number: B81C1/00888

Abstract: The present invention relates to a method for dividing a substrate into a number of individual chip parts, comprising the steps of: forming a number of chip parts in the substrate, comprising, for each chip part, of arranging recesses in the substrate for containing fluid; arranging one or more breaking grooves in the substrate along individual chip parts; applying mechanical force to the substrate to break the substrate along the breaking grooves. The invention also relates to a substrate as well as a chip part.

Abstract translation: 本发明涉及一种将基板分割为多个单独的芯片部件的方法，包括以下步骤：在基板中形成多个芯片部件，每个芯片部分包括在用于容纳流体的基板中设置凹槽 ; 沿着各个芯片部件在基板中布置一个或多个断开槽; 向基板施加机械力以沿着断裂槽破坏基板。 本发明还涉及基板以及芯片部分。