公开(公告)号：US20250114984A1

公开(公告)日：2025-04-10

申请号：US18986703

申请日：2024-12-19

Applicant: APIC YAMADA CORPORATION

Inventor： Makoto Kawaguchi ,  Masahiko Fujisawa ,  Yoshikazu Muramatsu ,  Minoru Hanazato

IPC: B29C43/34 ,  B29C43/02 ,  B29C43/18 ,  B29L31/34

Abstract: A resin supply apparatus includes a calculation unit for calculating a resin supply pattern based on the shape of a cavity of a resin sealing mold, and a supply unit for supplying a resin to an object to be coated along the resin supply pattern. The resin supply pattern has a plurality of linear paths, and one of mutually adjacent linear paths is inclined with respect to an axis of symmetry that divides a cavity in line symmetry, the other one of the mutually adjacent linear paths is inclined with respect to the one linear path, and a region between the mutually adjacent linear paths is opened to the outside of the object to be coated, at least on a side on which the other linear path is separated from the one linear path.

公开(公告)号：US12179395B2

公开(公告)日：2024-12-31

申请号：US17489806

申请日：2021-09-30

Applicant: APIC YAMADA CORPORATION

Inventor： Makoto Kawaguchi ,  Masahiko Fujisawa ,  Yoshikazu Muramatsu ,  Minoru Hanazato

IPC: B29C43/34 ,  B29C43/18 ,  B29C43/58 ,  B29L31/34

Abstract: A resin supply apparatus, a resin sealing apparatus, and a method for manufacturing a resin-sealed product are provided. A resin supply apparatus supplies a resin onto a workpiece on which elements are arranged in a first direction and a second direction intersecting the first direction, respectively. The resin supply apparatus includes: an acquisition unit for acquiring arrangement information of the elements on the workpiece; a supply unit for supplying the resin onto the workpiece; a calculation unit for calculating a resin supply pattern based on the arrangement information; and a drive unit for moving at least one of the workpiece and the supply unit relative to the other along the resin supply pattern. The resin supply pattern has linear paths extending along the first direction, and a region between the mutually adjacent linear paths in the plurality of linear paths is opened to the outside of the workpiece.

公开(公告)号：US20210362382A1

公开(公告)日：2021-11-25

申请号：US17238135

申请日：2021-04-22

Applicant: APIC YAMADA CORPORATION

Inventor： Masahiko FUJISAWA ,  Hirofumi SAITO

IPC: B29C43/58 ,  H01L21/67 ,  H01L21/68 ,  B29C43/18 ,  B29C43/36

Abstract: A resin molding device that can hold a thin and large-size workpiece without positional displacement when the workpiece is conveyed even if dimensional tolerance and rigidity are different, and can convey the workpiece to a mold frame without losing flatness or damage is provided.
When a loader (4) holds a workpiece (W) aligned by a preheating part (10), a center position of a loader hand (4b) is aligned with a center position of the workpiece (W) according to an amount of positional displacement between an external form position of the workpiece (W) and a reference position in the X-Y direction and the workpiece (W) is then held.

公开(公告)号：US20020017738A1

公开(公告)日：2002-02-14

申请号：US09884054

申请日：2001-06-20

Applicant: APIC YAMADA CORPORATION

Inventor： Fumio Miyajima

IPC: B29C045/14 ,  H01L021/56

CPC classification number: H01L24/75 ,  B29C45/14655 ,  B29C2045/14663 ,  H01L21/563 ,  H01L21/565 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/75315 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Under-fill molding is carried out by preferentially sending a sealing resin 22 under pressure into a clearance portion 21 between a semiconductor chip 6 and a substrate 2, and a molded component gate runner 25 that is connected to the under-fill portion 24 is separated at the substrate end position.

Abstract translation: 通过优先将密封树脂22在压力下进入半导体芯片6和基板2之间的间隙部分21中进行欠填充，并且连接到底部填充部分24的模制部件浇口浇道25被分离 在基板端部位置。

公开(公告)号：US20210335632A1

公开(公告)日：2021-10-28

申请号：US17242318

申请日：2021-04-28

Applicant: APIC YAMADA CORPORATION

Inventor： Masahiko Fujisawa ,  Hirofumi Saito

IPC: H01L21/67 ,  B29C43/18 ,  B29C43/58 ,  B29C43/36 ,  B29C43/52 ,  B29C43/34

Abstract: To provide a resin molding apparatus capable of correcting the bending of a workpiece during preheating or the like, improving production efficiency, and preventing the occurrence of defective products. A resin molding apparatus according to the present invention includes: a molding die which performs resin molding of a workpiece W having an electronic component mounted inside a carrier; and a loader which transports the workpiece, the loader includes a frame body which comes into contact with and separates from an outer edge portion of an upper surface of the workpiece, a moving device which moves the frame body up and down, and a chuck claw which comes into contact with an outer edge portion of a lower surface of the workpiece, and the frame body includes a contact portion which is provided over the entire circumference of the outer edge portion in the upper surface of the workpiece.

公开(公告)号：US20170077042A1

公开(公告)日：2017-03-16

申请号：US15362258

申请日：2016-11-28

Applicant: Apic Yamada Corporation

Inventor： Kazuhiko KOBAYASHI ,  Keisuke SUDA

IPC: H01L23/552 ,  H01L21/3205 ,  H01L23/00 ,  H01L21/326

CPC classification number: H01L23/552 ,  B05B5/025 ,  B05B5/14 ,  B29C33/58 ,  B29C33/72 ,  G03F7/0002 ,  G03F7/164 ,  H01L21/3205 ,  H01L21/321 ,  H01L21/326 ,  H01L21/6715 ,  H01L24/19 ,  H01L24/24 ,  H01L24/48 ,  H01L24/76 ,  H01L24/82 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/8592 ,  H01L2225/06524 ,  H01L2225/06537 ,  H01L2225/06562 ,  H01L2924/00011 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/11 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01005

Abstract: Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device (100), which forms a resist film (108) on a substrate by electrostatic spraying, comprises: a nozzle (102) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film (108) toward a substrate (105) having stepped portions (105a); a driving means (111) for causing relative movement of the substrate (105) or the nozzle (102); and a control means (110) for controlling such that the resist film (108) is formed on the substrate (105) having the stepped portions (105a) by the liquid particles.

Abstract translation: 提供了一种使用能够在工件上形成厚度均匀的薄膜的静电喷涂装置的抗蚀剂膜形成装置。 通过静电喷涂在基板上形成抗蚀剂膜（108）的抗蚀膜形成装置（100）包括：喷嘴（102），其在施加规定电压时喷射形成原料的液体颗粒 抗蚀剂膜（108）朝向具有台阶部（105a）的基板（105）。 用于引起所述基板（105）或所述喷嘴（102）的相对运动的驱动装置（111）; 以及控制装置（110），用于控制使得通过液体颗粒在具有台阶部分（105a）的基板（105）上形成抗蚀剂膜（108）。

公开(公告)号：US09589907B2

公开(公告)日：2017-03-07

申请号：US14648587

申请日：2013-11-11

Applicant: Apic Yamada Corporation

Inventor： Kazuhiko Kobayashi ,  Keisuke Suda

IPC: H01L23/552 ,  B05B5/025 ,  B29C33/58 ,  B29C33/72 ,  H01L21/67 ,  H01L23/00 ,  B05B5/14 ,  H01L21/3205 ,  H01L21/321 ,  H05K1/11

Abstract: Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device (100), which forms a resist film (108) on a substrate by electrostatic spraying, comprises: a nozzle (102) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film (108) toward a substrate (105) having stepped portions (105a); a driving means (111) for causing relative movement of the substrate (105) or the nozzle (102); and a control means (110) for controlling such that the resist film (108) is formed on the substrate (105) having the stepped portions (105a) by the liquid particles.

公开(公告)号：US20150303151A1

公开(公告)日：2015-10-22

申请号：US14648587

申请日：2013-11-11

Applicant: APIC YAMADA CORPORATION

Inventor： Kazuhiko KOBAYASHI ,  Keisuke SUDA

IPC: H01L23/552 ,  H05K1/11 ,  H01L21/321 ,  H01L21/3205

CPC classification number: H01L23/552 ,  B05B5/025 ,  B05B5/14 ,  B29C33/58 ,  B29C33/72 ,  G03F7/0002 ,  G03F7/164 ,  H01L21/3205 ,  H01L21/321 ,  H01L21/326 ,  H01L21/6715 ,  H01L24/19 ,  H01L24/24 ,  H01L24/48 ,  H01L24/76 ,  H01L24/82 ,  H01L24/85 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/11 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01005

Abstract: Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device (100), which forms a resist film (108) on a substrate by electrostatic spraying, comprises: a nozzle (102) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film (108) toward a substrate (105) having stepped portions (105a); a driving means (111) for causing relative movement of the substrate (105) or the nozzle (102); and a control means (110) for controlling such that the resist film (108) is formed on the substrate (105) having the stepped portions (105a) by the liquid particles.

Abstract translation: 提供了一种使用能够在工件上形成厚度均匀的薄膜的静电喷涂装置的抗蚀剂膜形成装置。 通过静电喷涂在基板上形成抗蚀剂膜（108）的抗蚀膜形成装置（100）包括：喷嘴（102），其在施加规定电压时喷射形成原料的液体颗粒 抗蚀剂膜（108）朝向具有台阶部（105a）的基板（105）。 用于引起所述基板（105）或所述喷嘴（102）的相对运动的驱动装置（111）; 以及控制装置（110），用于控制使得通过液体颗粒在具有台阶部分（105a）的基板（105）上形成抗蚀剂膜（108）。

公开(公告)号：US20130161879A1

公开(公告)日：2013-06-27

申请号：US13689222

申请日：2012-11-29

Applicant: APIC YAMADA CORPORATION

Inventor： Shusaku TAGAMI ,  Yoshikazu MURAMATSU ,  Masanori MAEKAWA ,  Hideaki NAKAZAWA ,  Masahiko FUJISAWA ,  Takuya MIYAMOTO

IPC: B29C43/18

CPC classification number: B29C43/18 ,  B29C33/68 ,  B29C2043/181 ,  H01L21/566 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The method is capable of resin-molding one side face of a work in a molding die set, in which the work is sucked and held on at least one of clamping faces and resin-molded in a cavity concave section. The method comprises the steps of: sucking and holding a release film which covers at least one of the clamping faces of the molding die set; setting the work in the molding die set; sucking the other side face of the work through a work sucking hole of the release film, which is formed before or after holding the release film, so as to hold the work on the clamping face; closing the molding die set so as to clamp the work; and pressurizing and heating the resin, which has been accommodated in the cavity concave section, with resin.

Abstract translation: 该方法能够将成型模具中的工件的一个侧面树脂成形，其中工件被吸入并保持在夹紧面中的至少一个上并且在模腔凹部中树脂模制。 该方法包括以下步骤：吸收和保持覆盖成型模具组的至少一个夹紧面的脱模膜; 在模具中设置工作; 通过在保持剥离膜之前或之后形成的脱模膜的工作吸孔吸附工件的另一侧面，以将工件保持在夹紧面上; 关闭成型模具组件以夹紧工件; 并且利用树脂对容纳在空腔凹部中的树脂进行加压加热。

公开(公告)号：US20250162204A1

公开(公告)日：2025-05-22

申请号：US18690738

申请日：2021-11-26

Applicant: APIC YAMADA CORPORATION

Inventor： Masahiko Fujisawa

IPC: B29C33/22

Abstract: A mold clamping device is provided with a movable platen that moves along a tie bar; a driving mechanism having multiple raising-lowering mechanisms, including a first raising-lowering mechanism and a second raising-lowering mechanism, and configured to be capable of introducing a difference so that a first portion of the movable platen corresponding to the first raising-lowering mechanism is set at a higher position or a lower position than a second portion of the movable platen corresponding to the second raising-lowering mechanism, the driving mechanism moving the movable platen; and a connecting structure, connecting the driving mechanism to the movable platen. The connecting structure is configured as a stopper that restricts movement of the movable platen so that the difference does not become greater than a prescribed value.