公开(公告)号：US20240036485A1

公开(公告)日：2024-02-01

申请号：US18269191

申请日：2021-12-02

Applicant: ASML Netheriands B. V. ,  ASML Holding N.V.

Inventor： Arjan Johannes Anton BEUKMAN ,  Sebastianus Adrianus GOORDEN ,  Stephen ROUX ,  Sergel SOKOLOV ,  Filippo ALPEGGIANI

IPC: G03F9/00 ,  G03F7/00

CPC classification number: G03F9/7065 ,  G03F7/70625 ,  G03F9/7046

Abstract: A method includes irradiating a target structure with sequential illumination shots, directing scattered beams from the target structure towards an imaging detector, generating a detection signal using the imaging detector, and determining a property of the target structure based on at least the detection signal. An integration time for each illumination shot of the sequential illumination shots is selected so to reduce a low frequency error.

公开(公告)号：US20240371599A1

公开(公告)日：2024-11-07

申请号：US18772486

申请日：2024-07-15

Applicant: ASML Netheriands B. V.

Inventor： Yixiang WANG ,  Shibing Liu ,  Shanhul Cao ,  Kangsheng Qiu ,  Juying Dou ,  Ying Luo ,  Yinglong Li ,  Qiang Li ,  Ronald Van Der Wilk ,  Jan-Gerard Cornelis Ven Der Toorn

IPC: H01J37/20 ,  H01L21/683

Abstract: Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A first method may include receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal; determining a first control parameter using at least the first value; and controlling a characteristic of the electric signal using the first control parameter and the first value. A second method for adjusting a grounding location for a wafer may include terminating an electric connection between the wafer and at least one grounding pin in contact the wafer; adjusting a relative position between the wafer and the grounding pin; and restoring the electric connection between the grounding pin and the wafer. A third method may include causing a grounding pin to penetrate through a coating on the wafer by impact; and establishing an electrical connection between the grounding pin and the wafer.