公开(公告)号：US20080003715A1

公开(公告)日：2008-01-03

申请号：US11479091

申请日：2006-06-30

Applicant: Kevin J. Lee ,  Figen T. Akin ,  Kurt Schultz ,  Raman Vaidyanathan ,  Shane A. Nolen ,  Adwait Telang

Inventor： Kevin J. Lee ,  Figen T. Akin ,  Kurt Schultz ,  Raman Vaidyanathan ,  Shane A. Nolen ,  Adwait Telang

IPC: H01L21/00

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05186 ,  H01L2224/05572 ,  H01L2224/0558 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2924/0001 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/00014

Abstract: Embodiments of the invention include apparatuses and methods relating to die-side bumps having a tapered cross-section. In one embodiment, the tapered die-side bump is electrically coupled to a solder bump on a package substrate.

Abstract translation: 本发明的实施例包括与具有锥形横截面的模头侧凸起相关的装置和方法。 在一个实施例中，锥形模头侧凸起电耦合到封装衬底上的焊料凸块。