Abstract:
The application is directed to a ladder assist that may be secured to a ladder for preventing falls when persons are using a ladder. The ladder assist is operationally configured to prevent falls during access and egress of a fixed ladder of a structure, e.g., a fixed ladder of a transportation container or a building.
Abstract:
System and method for disabling a RFID tag. A preferred embodiment comprises attenuating a signal received at an antenna of the RFID tag based upon a status of the RFID tag and responding to an instruction in the received signal if the attenuated signal is detectable. The attenuation of the received signal requires that the received signal have a signal strength greater than a specified threshold in order for the instruction in the received signal to be detectable. This means that for a given signal transmit power, the RFID tag must be within a certain distance from a RFID reader attempting to retrieve information from the RFID tag. By setting the attenuation amount at a sufficiently high level, the method ensures that the RFID reader must be substantially adjacent to the RFID tag, preventing the unintended retrieval of unique identification information by RFID readers remotely located from the RFID tag.
Abstract:
An apparatus comprises a gauge for measuring a parameter. The gauge has a sensing section configured to react to exposure to the parameter in a manner indicative of the parameter. The gauge further has a port through which the sensing section is exposed to the parameter. A cap is configured to be removably attached to the gauge such that the cap covers the port to protect the port from damage. The cap has a hole configured to allow coupling of the cap to another device.
Abstract:
System and method for integrated circuit manufacturing. A preferred embodiment comprises transmitting a first set of data to integrated circuits (ICs) while they are in an on-wafer state and having each IC store the first set of data into memory, transmitting a second set of data to the ICs and having the ICs compare the second set of data with the first set of data stored in the memory, reading out the results of the comparisons, and marking an IC as being defective if the comparison indicates that that the first set of data did not match the second set of data. Each IC features an antenna formed in the scribe line region adjacent to the IC so that communications can take place while the IC remains on the wafer without the need to use electrical probes.
Abstract:
Systems and methods are disclosed to for detecting movement of an object. In one embodiment, a system is disclosed to detect movement of an object (e.g., a tire). The system includes a sensor that is operative to sense at least a pressure condition within an enclosed space of the object based on an operating mode of the system. A control system controls the operating mode of the system based at least in part on whether movement of the object is detected. The movement of the object is detected based on a variation in the at least a pressure condition over time. The system can be implemented as part of a tire pressure monitoring system.
Abstract:
Techniques are described for reducing inductance in ball grid array (BGA) packages for integrated circuits (ICs). The BGA package comprises a set of contacts disposed near an outer edge of the BGA package that receives signal lines and isolated power and ground lines. One area of excess parasitic inductance within the BGA package is in the wire bonds that couple the set of contacts to the IC. The techniques described herein shorten the wire bonds in order to reduce the amount of parasitic inductance. The techniques include extending traces from a subset of the contacts inward into the BGA package toward the IC mounted. The wire bonds then couple the traces to the IC, thereby electrically coupling the subset of contacts to the IC. The presence of the traces substantially reduces lengths of the wire bonds relative to wire bonds that directly couple the set of contacts to the IC.
Abstract:
An input cell to the core logic on an electrical component and an output cell from the core logic on an electrical component are provided with a first signal path for data, a second signal path for scan data, a flip flop positioned near the pad of the core logic for selecting between said first signal path for data and second signal path for scan data. The scan data is used to input special signals or vectors to the core logic and to read the results of the scan data after it has passed through the core data and has been manipulated thereby. Several of the electrical components can be electrically connected to one another. The output cell of a first chip is electrically attached to the input cell of a second electrical component. The individual electrical components are connected on a printed circuit board and typically there are electrical conductors associated with the printed circuit board that are used to electrically connect the first chip or electrical component and the second chip or electrical component.