公开(公告)号：US07547243B2

公开(公告)日：2009-06-16

申请号：US11840499

申请日：2007-08-17

Applicant: Andreas Norbert Wiswesser ,  Ramiel Oshana ,  Kerry F. Hughes ,  Jay Rohde ,  David Datong Huo ,  Dominic J. Benvegnu

Inventor： Andreas Norbert Wiswesser ,  Ramiel Oshana ,  Kerry F. Hughes ,  Jay Rohde ,  David Datong Huo ,  Dominic J. Benvegnu

IPC: B24B49/12

CPC classification number: B24B37/205 ,  B24B37/013 ,  B24B49/12

Abstract: A polishing layer of a polishing has a window member with a top surface positioned a predetermined distance below the polishing surface. A transparent layer can be positioned below the polishing layer and supporting the window member.

Abstract translation: 研磨抛光层具有窗构件，其顶表面位于抛光表面下方预定的距离处。 透明层可以位于抛光层下方并支撑窗构件。

公开(公告)号：US06659842B2

公开(公告)日：2003-12-09

申请号：US09929903

申请日：2001-08-14

Applicant: Andreas Norbert Wiswesser ,  Judon Tony Pan ,  Buguslaw Swedek ,  Manoocher Birang

Inventor： Andreas Norbert Wiswesser ,  Judon Tony Pan ,  Buguslaw Swedek ,  Manoocher Birang

IPC: B24B4900

CPC classification number: B24B37/013 ,  B24B49/04 ,  B24B49/12 ,  G01B11/0683 ,  H01L21/3212

Abstract: An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so that the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate. Light beam reflections from the substrate are detected, and used to determine polishing parameters, detect process repeatability, and qualify processes.

公开(公告)号：US06506097B1

公开(公告)日：2003-01-14

申请号：US09764733

申请日：2001-01-16

Applicant: Bret W. Adams ,  Boguslaw A. Swedek ,  Rajeev Bajaj ,  Savitha Nanjangud ,  Andreas Norbert Wiswesser ,  Stan D. Tsai ,  David A. Chan ,  Fred C. Redeker ,  Manoocher Birang

Inventor： Bret W. Adams ,  Boguslaw A. Swedek ,  Rajeev Bajaj ,  Savitha Nanjangud ,  Andreas Norbert Wiswesser ,  Stan D. Tsai ,  David A. Chan ,  Fred C. Redeker ,  Manoocher Birang

IPC: B24B100

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B49/04 ,  B24B49/12 ,  H01L21/30625

Abstract: An optical monitoring system for a two-step polishing process which generates a reflectance trace for each of plurality of radial zones. The CMP apparatus may switch from a high-selectivity slurry to a low-selectivity slurry when any of the reflectance traces indicate initial clearance of the metal layer, and polishing may halt when all of the reflectance traces indicate that oxide layer has been completely exposed.

Abstract translation: 一种用于两步抛光工艺的光学监视系统，其为多个径向区域中的每一个产生反射迹线。 当任何反射迹线表示金属层的初始间隙时，CMP设备可以从高选择性浆料切换到低选择性浆料，并且当所有反射迹线表示氧化物层已经完全暴露时，抛光可能停止。

公开(公告)号：US06832950B2

公开(公告)日：2004-12-21

申请号：US10282730

申请日：2002-10-28

Applicant: Jason R. Wright ,  Andreas Norbert Wiswesser ,  Boguslaw A. Swedek

Inventor： Jason R. Wright ,  Andreas Norbert Wiswesser ,  Boguslaw A. Swedek

IPC: B24D1700

CPC classification number: B24B37/205 ,  B24B37/22 ,  B24B37/24 ,  Y10T428/28

Abstract: Polishing pads with a window, systems containing such polishing pads, and processes that use such polishing pads are disclosed. In embodiments, a polishing pad includes a backing layer having an opening, a polishing layer having an opening aligned with the opening in the backing layer, a solid window of a first material in the opening of the polishing layer, a layer of a first adhesive material between the backing layer and the solid window, and a layer of a second adhesive material between the layer of the first adhesive material and the window.

Abstract translation: 公开了具有窗的抛光垫，包含这种抛光垫的系统，以及使用这种抛光垫的工艺。 在实施例中，抛光垫包括具有开口的背衬层，具有与背衬层中的开口对准的开口的抛光层，在抛光层的开口中的第一材料的固体窗口，第一粘合剂层 背衬层和实心窗之间的材料，以及第一粘合材料层与窗之间的第二粘合材料层。

公开(公告)号：US06632124B2

公开(公告)日：2003-10-14

申请号：US10339959

申请日：2003-01-10

Applicant: Bret W. Adams ,  Boguslaw A. Swedek ,  Rajeev Bajaj ,  Savitha Nanjangud ,  Andreas Norbert Wiswesser ,  Stan D. Tsai ,  David A. Chan ,  Fred C. Redeker ,  Manoocher Birang

Inventor： Bret W. Adams ,  Boguslaw A. Swedek ,  Rajeev Bajaj ,  Savitha Nanjangud ,  Andreas Norbert Wiswesser ,  Stan D. Tsai ,  David A. Chan ,  Fred C. Redeker ,  Manoocher Birang

IPC: B24B100

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B49/04 ,  B24B49/12 ,  H01L21/30625

Abstract: An optical monitoring system for a two-step polishing process which generates a reflectance trace for each of plurality of radial zones. The CMP apparatus may switch from a high-selectivity slurry to a low-selectivity slurry when any of the reflectance traces indicate initial clearance of the metal layer, and polishing may halt when all of the reflectance traces indicate that oxide layer has been completely exposed.

Abstract translation: 一种用于两步抛光工艺的光学监视系统，其为多个径向区域中的每一个产生反射迹线。 当任何反射迹线表示金属层的初始间隙时，CMP设备可以从高选择性浆料切换到低选择性浆料，并且当所有反射迹线表示氧化物层已经完全暴露时，抛光可能停止。

公开(公告)号：US06524165B1

公开(公告)日：2003-02-25

申请号：US09695002

申请日：2000-10-23

Applicant: Andreas Norbert Wiswesser ,  Walter Schoenleber ,  Boguslaw Swedek

Inventor： Andreas Norbert Wiswesser ,  Walter Schoenleber ,  Boguslaw Swedek

IPC: B24B4900

CPC classification number: G01B11/06 ,  B24B37/04 ,  B24B49/12 ,  B24D7/12 ,  G01B9/02021 ,  G01B9/02027

Abstract: The thickness of a layer on a substrate is measured in-situ during chemical mechanical polishing. A light beam is divided through a window in a polishing pad, and the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate surface. An interference signal produced by the light beam reflecting off the substrate is monitored, and a plurality of intensity measurements are extracted from the interference signal. Each intensity measurement corresponds to a sampling zone in the path across the substrate surface. A radial position is determined for each sampling zone, and the intensity measurements are divided into a plurality of radial ranges according to the radial positions. The layer thickness is computed for each radial range from the intensity measurements associated with that radial range.

公开(公告)号：US06764380B2

公开(公告)日：2004-07-20

申请号：US10342653

申请日：2003-01-14

Applicant: Andreas Norbert Wiswesser ,  Walter Schoenleber ,  Boguslaw Swedek

Inventor： Andreas Norbert Wiswesser ,  Walter Schoenleber ,  Boguslaw Swedek

IPC: B24B4900

CPC classification number: G01B11/06 ,  B24B37/04 ,  B24B49/12 ,  B24D7/12 ,  G01B9/02021 ,  G01B9/02027

Abstract: The thickness of a layer on a substrate is measured in-situ during chemical mechanical polishing. A light beam is divided through a window in a polishing pad, and the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate surface. An interference signal produced by the light beam reflecting off the substrate is monitored, and a plurality of intensity measurements are extracted from the interference signal. Each intensity measurement corresponds to a sampling zone in the path across the substrate surface. A radial position is determined for each sampling zone, and the intensity measurements are divided into a plurality of radial ranges according to the radial positions. The layer thickness is computed for each radial range from the intensity measurements associated with that radial range.

Abstract translation: 在化学机械抛光期间原位测量基底上的层的厚度。 光束通过抛光垫中的窗口分割，并且抛光垫相对于基板的运动导致光束在穿过基板表面的路径中移动。 监测由反射离开衬底的光束产生的干涉信号，并且从干扰信号中提取多个强度测量值。 每个强度测量对应于穿过衬底表面的路径中的采样区域。 对于每个采样区域确定径向位置，并且根据径向位置将强度测量值分成多个径向范围。 从与该径向范围相关联的强度测量的每个径向范围计算层厚度。

公开(公告)号：US06652355B2

公开(公告)日：2003-11-25

申请号：US09874086

申请日：2001-06-04

Applicant: Andreas Norbert Wiswesser ,  Judon Tony Pan ,  Boguslaw Swedek

Inventor： Andreas Norbert Wiswesser ,  Judon Tony Pan ,  Boguslaw Swedek

IPC: B24B4900

CPC classification number: B24B37/013 ,  B24B49/04 ,  B24B49/12 ,  G01B11/0683 ,  H01L21/3212

Abstract: An apparatus, as well as a method, determines an endpoint of chemical mechanical polishing a metal layer on a substrate. The method of the apparatus includes bringing a surface of a substrate into contact with a polishing pad that has a window; causing relative motion between the substrate and the polishing pad; directing a light beam through the window, the motion of the polishing pad relative to the substrate causing the light beam to move in a path across the substrate; detecting light beam reflections from the substrate and a retaining ring; generating reflection data associated with the light beam reflections; dividing the reflection data into a plurality of radial ranges; and identifying the predetermined pattern from the reflection data in the plurality of radial ranges to establish the endpoint.

Abstract translation: 一种装置以及一种方法确定化学机械抛光衬底上的金属层的终点。 该装置的方法包括使基板的表面与具有窗口的抛光垫接触; 引起基板和抛光垫之间的相对运动; 将光束引导通过窗口，抛光垫相对于基底的运动导致光束在穿过基底的路径中移动; 检测来自基板和保持环的光束反射; 产生与光束反射相关联的反射数据; 将反射数据分割成多个径向范围; 以及根据所述多个径向范围内的反射数据识别所述预定图案以建立所述端点。

公开(公告)号：US06296548B1

公开(公告)日：2001-10-02

申请号：US09591187

申请日：2000-06-08

Applicant: Andreas Norbert Wiswesser ,  Judon Tony Pan ,  Boguslaw Swedek ,  Manoocher Birang

Inventor： Andreas Norbert Wiswesser ,  Judon Tony Pan ,  Boguslaw Swedek ,  Manoocher Birang

IPC: B24B4900

CPC classification number: B24B37/013 ,  B24B49/04 ,  B24B49/12 ,  G01B11/0683 ,  H01L21/3212

Abstract: An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so that the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate. Light beam reflections from the substrate are detected, and used to determine polishing parameters, detect process repeatability, and qualify processes.

Abstract translation: 一种装置以及方法使基板的表面与具有窗口的抛光垫接触，引起基板和抛光垫之间的相对运动，并引导光束通过窗口，使得运动 抛光垫相对于基底使得光束在穿过基底的路径中移动。 检测来自基板的光束反射，并用于确定抛光参数，检测过程重复性和限定工艺。

公开(公告)号：US06280289B1

公开(公告)日：2001-08-28

申请号：US09184767

申请日：1998-11-02

Applicant: Andreas Norbert Wiswesser ,  Judon Tony Pan ,  Boguslaw Swedek

Inventor： Andreas Norbert Wiswesser ,  Judon Tony Pan ,  Boguslaw Swedek

IPC: B24B4900

CPC classification number: B24B37/013 ,  B24B49/04 ,  B24B49/12 ,  G01B11/0683 ,  H01L21/3212

Abstract: An apparatus, as well as a method, determines an endpoint of chemical mechanical polishing a metal layer on a substrate. The method of the apparatus includes bringing a surface of a substrate into contact with a polishing pad that has a window; causing relative motion between the substrate and the polishing pad; directing a light beam through the window, the motion of the polishing pad relative to the substrate causing the light beam to move in a path across the substrate; detecting light beam reflections from the substrate and a retaining ring; generating reflection data associated with the light beam reflections; dividing the reflection data into a plurality of radial ranges; and identifying the predetermined pattern from the reflection data in the plurality of radial ranges to establish the endpoint.