公开(公告)号：US20070084823A1

公开(公告)日：2007-04-19

申请号：US11610512

申请日：2006-12-14

Applicant: Hung-En Hsu ,  Binwei Wang ,  Shing-Fun Ho

Inventor： Hung-En Hsu ,  Binwei Wang ,  Shing-Fun Ho

IPC: H01B13/00

CPC classification number: H05K3/426 ,  H05K3/0032 ,  H05K3/108 ,  H05K3/181 ,  H05K3/243 ,  H05K3/28 ,  H05K3/381 ,  H05K2203/1152 ,  Y10T29/49155

Abstract: The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad Laminate (CCL) whose copper foil surface has been removed. Next, an electro-less copper layer is plated on the substrate for forming a plurality of plated through holes. After a wire pattern is formed on the substrate, a solder preventive layer is formed on top of the wire pattern. Next, a plurality of openings is created in between the solder preventive layer for exposing the contact pads. Finally, a protective layer is plated on top of the contact pads.

Abstract translation: 本发明提供一种制造双面印刷电路板的方法。 首先通过在其铜箔表面被去除的铜包覆层（CCL）上形成多个通孔来形成绝缘基板。 接着，在基板上电镀无电镀铜层，形成多个电镀通孔。 在基板上形成线图案之后，在导线图案的顶部形成防焊层。 接下来，在用于暴露接触垫的防焊层之间产生多个开口。 最后，将保护层镀在接触垫的顶部。

公开(公告)号：US20060054588A1

公开(公告)日：2006-03-16

申请号：US11160067

申请日：2005-06-07

Applicant: Hung-En Hsu ,  Binwei Wang ,  Shing-Fun Ho

Inventor： Hung-En Hsu ,  Binwei Wang ,  Shing-Fun Ho

IPC: H01B13/00 ,  C23F1/00 ,  H05K3/02

CPC classification number: H05K3/426 ,  H05K3/0032 ,  H05K3/108 ,  H05K3/181 ,  H05K3/243 ,  H05K3/28 ,  H05K3/381 ,  H05K2203/1152 ,  Y10T29/49155

Abstract: The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad Laminate (CCL) whose copper foil surface has been removed. Next, an electro-less copper layer is plated on the substrate for forming a plurality of plated through holes. After a wire pattern is formed on the substrate, a solder preventive layer is formed on top of the wire pattern. Next, a plurality of openings is created in between the solder preventive layer for exposing the contact pads. Finally, a protective layer is plated on top of the contact pads.

Abstract translation: 本发明提供一种制造双面印刷电路板的方法。 首先通过在其铜箔表面被去除的铜包覆层（CCL）上形成多个通孔来形成绝缘基板。 接着，在基板上电镀无电镀铜层，形成多个电镀通孔。 在基板上形成线图案之后，在导线图案的顶部形成防焊层。 接下来，在用于暴露接触垫的防焊层之间产生多个开口。 最后，将保护层镀在接触垫的顶部。

公开(公告)号：US07524429B2

公开(公告)日：2009-04-28

申请号：US11610512

申请日：2006-12-14

Applicant: Hung-En Hsu ,  Binwei Wang ,  Shing-Fun Ho

Inventor： Hung-En Hsu ,  Binwei Wang ,  Shing-Fun Ho

IPC: H01B13/00

CPC classification number: H05K3/426 ,  H05K3/0032 ,  H05K3/108 ,  H05K3/181 ,  H05K3/243 ,  H05K3/28 ,  H05K3/381 ,  H05K2203/1152 ,  Y10T29/49155

Abstract: The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad Laminate (CCL) whose copper foil surface has been removed. Next, an electro-less copper layer is plated on the substrate for forming a plurality of plated through holes. After a wire pattern is formed on the substrate, a solder preventive layer is formed on top of the wire pattern. Next, a plurality of openings is created in between the solder preventive layer for exposing the contact pads. Finally, a protective layer is plated on top of the contact pads.

Abstract translation: 本发明提供一种制造双面印刷电路板的方法。 首先通过在其铜箔表面被去除的铜包覆层（CCL）上形成多个通孔来形成绝缘基板。 接着，在基板上电镀无电镀铜层，形成多个电镀通孔。 在基板上形成线图案之后，在导线图案的顶部形成防焊层。 接下来，在用于暴露接触垫的防焊层之间产生多个开口。 最后，将保护层镀在接触垫的顶部。