公开(公告)号：US07528482B2

公开(公告)日：2009-05-05

申请号：US11672507

申请日：2007-02-07

Applicant: Cheng-Hung Huang ,  Hsien-Chieh Lin ,  Kuo-Chun Chiang ,  Shing-Fun Ho

Inventor： Cheng-Hung Huang ,  Hsien-Chieh Lin ,  Kuo-Chun Chiang ,  Shing-Fun Ho

IPC: H01L23/10

CPC classification number: H01L23/5389 ,  H01L23/36 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A Chip-in Substrate Package (CiSP) includes a double-sided metal clad laminate including a dielectric interposer, a first metal foil laminated on a first side of the dielectric interposer, and a second metal foil laminated on a second side of the dielectric interposer. A recessed cavity is etched into the second metal foil and the dielectric interposer with a portion of the first metal foil as its bottom. A die is mounted within the recessed cavity and makes thermal contact with the first metal foil. A build-up material layer covers the second metal foil and an active surface of the die. The build-up material layer also fills the gap between the die and the dielectric interposer. At least one interconnection layer is provided on the build-up material layer and is electrically connected with a bonding pad disposed on the active surface of the die via a plated through hole.

Abstract translation: 芯片衬底封装（CiSP）包括双面金属敷层层压板，其包括介电插入件，层叠在电介质插入件的第一侧上的第一金属箔和层叠在电介质插入件的第二侧上的第二金属箔 。 凹入的腔被蚀刻到第二金属箔和电介质插入件中，第一金属箔的一部分作为其底部。 模具安装在凹腔内并与第一金属箔热接触。 堆积材料层覆盖第二金属箔和模具的有效表面。 堆积材料层还填充了管芯和电介质插入件之间的间隙。 至少一个互连层设置在积层材料层上，并且通过电镀通孔与设置在管芯的有效表面上的焊盘电连接。

公开(公告)号：US20080149732A1

公开(公告)日：2008-06-26

申请号：US11673596

申请日：2007-02-12

Applicant: Hsing-Lun Lo ,  Hsien-Chieh Lin ,  Kuo-Chun Chiang ,  Shing-Fun Ho

Inventor： Hsing-Lun Lo ,  Hsien-Chieh Lin ,  Kuo-Chun Chiang ,  Shing-Fun Ho

IPC: G06K19/067

CPC classification number: H05K1/0266 ,  H05K1/0268 ,  H05K2201/09481 ,  H05K2201/09927

Abstract: A lot traceable printed circuit board (PCB) includes a substrate having thereon a patterned circuit layer and a working zone carrying production information related to the PCB itself. The working zone includes a plurality of code boxes, wherein each of the code boxes has a first probe region and second probe region. A single set of resistance test loop is disposed within the first probe region. Four sets of resistance test loops are disposed within the second probe region. A frying probe tester is used to probe the set of resistance test loops respectively for abstracting the production information recorded in the working zone.

Abstract translation: 许多可追溯的印刷电路板（PCB）包括其上具有图案化电路层的基板和承载与PCB本身相关的生产信息的工作区。 工作区域包括多个代码框，其中每个代码框具有第一探测区域和第二探测区域。 单个电阻测试环路设置在第一探测区域内。 四组电阻测试环设置在第二探针区域内。 使用油炸探针测试仪分别探测一组电阻测试回路，以抽取记录在工作区域中的生产信息。

公开(公告)号：US20070084823A1

公开(公告)日：2007-04-19

申请号：US11610512

申请日：2006-12-14

Applicant: Hung-En Hsu ,  Binwei Wang ,  Shing-Fun Ho

Inventor： Hung-En Hsu ,  Binwei Wang ,  Shing-Fun Ho

IPC: H01B13/00

CPC classification number: H05K3/426 ,  H05K3/0032 ,  H05K3/108 ,  H05K3/181 ,  H05K3/243 ,  H05K3/28 ,  H05K3/381 ,  H05K2203/1152 ,  Y10T29/49155

Abstract: The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad Laminate (CCL) whose copper foil surface has been removed. Next, an electro-less copper layer is plated on the substrate for forming a plurality of plated through holes. After a wire pattern is formed on the substrate, a solder preventive layer is formed on top of the wire pattern. Next, a plurality of openings is created in between the solder preventive layer for exposing the contact pads. Finally, a protective layer is plated on top of the contact pads.

Abstract translation: 本发明提供一种制造双面印刷电路板的方法。 首先通过在其铜箔表面被去除的铜包覆层（CCL）上形成多个通孔来形成绝缘基板。 接着，在基板上电镀无电镀铜层，形成多个电镀通孔。 在基板上形成线图案之后，在导线图案的顶部形成防焊层。 接下来，在用于暴露接触垫的防焊层之间产生多个开口。 最后，将保护层镀在接触垫的顶部。

公开(公告)号：US20060121328A1

公开(公告)日：2006-06-08

申请号：US11160207

申请日：2005-06-14

Applicant: Yung-Yi Liu ,  Shing-Fun Ho ,  James Shang ,  Yi-Chen Chen

Inventor： Yung-Yi Liu ,  Shing-Fun Ho ,  James Shang ,  Yi-Chen Chen

IPC: H01M8/24 ,  H01M4/90 ,  H01M8/10 ,  H01M2/08

CPC classification number: H01M8/1011 ,  H01M8/0232 ,  H01M8/0247 ,  H01M8/0269 ,  H01M8/0273 ,  H01M8/1097 ,  H01M8/242 ,  H01M2250/30 ,  H05K1/16 ,  Y02B90/18 ,  Y02E60/523

Abstract: A structure of an integrated packed fuel cell including an integrated cathode electrode sheet that further includes a substrate, at least a cathode electrode area, and at least a conductive opening, an intermediate bonding layer that further includes at least a bonding sheet and at least a conductive opening, an integrated anode electrode sheet that further includes a substrate, at least an anode electrode area, at least a conductive pad, a device combination, and a fuel container base.

Abstract translation: 一种包括集成阴极电极片的集成的包装燃料电池的结构，所述集成阴极电极片还包括基板，至少阴极电极区域和至少导电开口，中间结合层至少还包括粘合片和至少一个 导电开口，还包括衬底，至少阳极电极区域，至少导电焊盘，器件组合和燃料容器基底的集成阳极电极片。

公开(公告)号：US07597979B2

公开(公告)日：2009-10-06

申请号：US11160207

申请日：2005-06-14

Applicant: Yung-Yi Liu ,  Shing-Fun Ho ,  James Shang ,  Yi-Chen Chen

Inventor： Yung-Yi Liu ,  Shing-Fun Ho ,  James Shang ,  Yi-Chen Chen

IPC: H01M8/10 ,  H01M2/08

CPC classification number: H01M8/1011 ,  H01M8/0232 ,  H01M8/0247 ,  H01M8/0269 ,  H01M8/0273 ,  H01M8/1097 ,  H01M8/242 ,  H01M2250/30 ,  H05K1/16 ,  Y02B90/18 ,  Y02E60/523

Abstract: A structure of an integrated packed fuel cell including an integrated cathode electrode sheet that further includes a substrate, at least a cathode electrode area, and at least a conductive opening, an intermediate bonding layer that further includes at least a bonding sheet and at least a conductive opening, an integrated anode electrode sheet that further includes a substrate, at least an anode electrode area, at least a conductive pad, a device combination, and a fuel container base.

Abstract translation: 一种包括集成阴极电极片的集成的包装燃料电池的结构，所述集成阴极电极片还包括基板，至少阴极电极区域和至少导电开口，中间结合层至少还包括粘合片和至少一个 导电开口，还包括衬底，至少阳极电极区域，至少导电焊盘，器件组合和燃料容器基底的集成阳极电极片。

公开(公告)号：US07576287B2

公开(公告)日：2009-08-18

申请号：US11673596

申请日：2007-02-12

Applicant: Hsing-Lun Lo ,  Hsien-Chieh Lin ,  Kuo-Chun Chiang ,  Shing-Fun Ho

Inventor： Hsing-Lun Lo ,  Hsien-Chieh Lin ,  Kuo-Chun Chiang ,  Shing-Fun Ho

IPC: H05K1/00

CPC classification number: H05K1/0266 ,  H05K1/0268 ,  H05K2201/09481 ,  H05K2201/09927

Abstract: A lot traceable printed circuit board (PCB) includes a substrate having thereon a patterned circuit layer and a working zone carrying production information related to the PCB itself. The working zone includes a plurality of code boxes, wherein each of the code boxes has a first probe region and second probe region. A single set of resistance test loop is disposed within the first probe region. Four sets of resistance test loops are disposed within the second probe region. A frying probe tester is used to probe the set of resistance test loops respectively for abstracting the production information recorded in the working zone.

Abstract translation: 许多可追溯的印刷电路板（PCB）包括其上具有图案化电路层的基板和承载与PCB本身相关的生产信息的工作区。 工作区域包括多个代码框，其中每个代码框具有第一探测区域和第二探测区域。 单个电阻测试环路设置在第一探测区域内。 四组电阻测试环设置在第二探针区域内。 使用油炸探针测试仪分别探测一组电阻测试回路，以抽取记录在工作区域中的生产信息。

公开(公告)号：US07045460B1

公开(公告)日：2006-05-16

申请号：US11162801

申请日：2005-09-23

Applicant: Yi-Tang Weng ,  Wei-Hsin Lin ,  Shing-Fun Ho

Inventor： Yi-Tang Weng ,  Wei-Hsin Lin ,  Shing-Fun Ho

IPC: H01L21/44

CPC classification number: H05K3/243 ,  H01L2924/0002 ,  H05K3/242 ,  H05K3/28 ,  H05K3/426 ,  H05K2201/0959 ,  H05K2203/054 ,  H05K2203/0723 ,  H05K2203/1572 ,  H05K2203/1581 ,  H01L2924/00

Abstract: A packaging substrate is fabricated using two plating steps for respectively plating the gold-plating areas defined on two opposite sides of the substrate. Before plating, the gold-plating areas are defined by a layer of solder mask. By doing this, the plated gold layer will not overlap with the solder mask, thereby preventing peeling or reliability problems.

Abstract translation: 使用两个电镀步骤制造封装衬底，用于分别镀覆限定在衬底的两个相对侧上的镀金区域。 电镀前，镀金区域由一层阻焊剂界定。 通过这样做，镀金层不会与焊料掩模重叠，从而防止剥离或可靠性问题。

公开(公告)号：US07592093B2

公开(公告)日：2009-09-22

申请号：US11161076

申请日：2005-07-22

Applicant: Yung-Yi Liu ,  James Shang ,  Shing-Fun Ho ,  Yi-Chen Chen

Inventor： Yung-Yi Liu ,  James Shang ,  Shing-Fun Ho ,  Yi-Chen Chen

IPC: H01M8/00 ,  H01M2/14 ,  H01M4/00 ,  G03F1/00

CPC classification number: H01M8/2455 ,  H01M4/8807 ,  H01M4/8817 ,  H01M4/8853 ,  H01M8/1011 ,  H01M8/1097 ,  H01M8/2475 ,  H05K1/16 ,  H05K3/427 ,  H05K3/429 ,  Y02E60/523 ,  Y02P70/56

Abstract: A novel flat panel DMFC (direct methanol fuel cell) includes an integrated cathode electrode plate, a membrane electrode assembly (MEA) unit, an intermediate bonding layer, an integrated anode electrode plate, and a fuel container. The integrated cathode and anode electrode plates are manufactured by using PCB compatible processes. The integrated cathode and anode electrode plates have embedded metal layout and improved heat dissipation capability.

Abstract translation: 一种新颖的平板DMFC（直接甲醇燃料电池）包括集成阴极电极板，膜电极组件（MEA）单元，中间粘合层，集成阳极电极板和燃料容器。 集成阴极和阳极电极板通过使用PCB兼容工艺制造。 集成的阴极和阳极电极板具有嵌入式金属布局和改善的散热能力。

公开(公告)号：US07531263B2

公开(公告)日：2009-05-12

申请号：US10908158

申请日：2005-04-29

Applicant: Yung-Yi Liu ,  James Shang ,  Shing-Fun Ho ,  Tsang-Ming Chang ,  Feng-Yi Deng ,  Hsi-Ming Shu

Inventor： Yung-Yi Liu ,  James Shang ,  Shing-Fun Ho ,  Tsang-Ming Chang ,  Feng-Yi Deng ,  Hsi-Ming Shu

IPC: H01M8/10 ,  H01M2/08 ,  H01M4/00

CPC classification number: H01M8/2418 ,  H01M4/8657 ,  H01M8/0273 ,  H01M8/1011 ,  H01M8/1097 ,  H01M8/2404 ,  H01M8/246 ,  Y02E60/523 ,  Y02P70/56

Abstract: A flat panel direct methanol fuel cell (DMFC) includes an integrated cathode electrode plate, a set of membrane electrode assemblies, an intermediate bonding layer, an integrated anode electrode plate, and a fuel container base. The integrated cathode/anode electrode plates are conducive to mass production, and are manufactured by using PCB compatible processes.

Abstract translation: 平板直接甲醇燃料电池（DMFC）包括集成阴极电极板，一组膜电极组件，中间粘合层，集成阳极电极板和燃料容器基座。 集成阴极/阳极电极板有利于批量生产，并通过使用PCB兼容工艺制造。

公开(公告)号：US20060054588A1

公开(公告)日：2006-03-16

申请号：US11160067

申请日：2005-06-07

Applicant: Hung-En Hsu ,  Binwei Wang ,  Shing-Fun Ho

Inventor： Hung-En Hsu ,  Binwei Wang ,  Shing-Fun Ho

IPC: H01B13/00 ,  C23F1/00 ,  H05K3/02

CPC classification number: H05K3/426 ,  H05K3/0032 ,  H05K3/108 ,  H05K3/181 ,  H05K3/243 ,  H05K3/28 ,  H05K3/381 ,  H05K2203/1152 ,  Y10T29/49155

Abstract: The present invention provides a method of manufacturing a double-sided printed circuit board. An insulation substrate is first formed by creating a plurality of through holes on a Copper Clad Laminate (CCL) whose copper foil surface has been removed. Next, an electro-less copper layer is plated on the substrate for forming a plurality of plated through holes. After a wire pattern is formed on the substrate, a solder preventive layer is formed on top of the wire pattern. Next, a plurality of openings is created in between the solder preventive layer for exposing the contact pads. Finally, a protective layer is plated on top of the contact pads.

Abstract translation: 本发明提供一种制造双面印刷电路板的方法。 首先通过在其铜箔表面被去除的铜包覆层（CCL）上形成多个通孔来形成绝缘基板。 接着，在基板上电镀无电镀铜层，形成多个电镀通孔。 在基板上形成线图案之后，在导线图案的顶部形成防焊层。 接下来，在用于暴露接触垫的防焊层之间产生多个开口。 最后，将保护层镀在接触垫的顶部。