公开(公告)号：US20050217709A1

公开(公告)日：2005-10-06

申请号：US10816334

申请日：2004-03-31

Applicant: Reg Yang ,  Bird Lin ,  Channing Wel

Inventor： Reg Yang ,  Bird Lin ,  Channing Wel

IPC: B08B3/02 ,  B08B3/04 ,  B08B5/02 ,  B08B11/02

CPC classification number: B08B5/02 ,  B08B3/02 ,  B08B11/02

Abstract: A cleaning mechanism for an image sensor package, the cleaning mechanism a seal up body is formed with a cleaning room. A substrate formed with frame layer is fixed on the top end of the cleaning room, then, the chamber of the substrate being faced down direction from the cleaning room. A cleaning device is mounted on the bottom end of the cleaning room for cleaning the chamber of the substrate by cleaner.

Abstract translation: 一种用于图像传感器封装的清洁机构，清洁机构具有清洁室。 形成有框架层的基板固定在清洁室的顶端，然后基板的室朝向清洁室的方向。 清洁装置安装在清洁室的底端，用于通过清洁器清洁基板的室。

公开(公告)号：US20050098710A1

公开(公告)日：2005-05-12

申请号：US10705378

申请日：2003-11-10

Applicant: Jackson Hsieh ,  Jichen Wu ,  Channing Wel ,  Bird Lin

Inventor： Jackson Hsieh ,  Jichen Wu ,  Channing Wel ,  Bird Lin

IPC: H01L27/00 ,  H01L31/0203

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00

Abstract: The invention provides an image sensor package including a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate includes plural metal sheets, which are spaced apart and arranged in an alternating manner, each of the metal sheets have a first board and a second board positioned at different heights, the thicken of outside ends of the first board are smaller than the inside ends of the first board, a encapsulate layer encapsulated the plural metal sheets to form a upper surface and a lower surface, so that the outside ends of the first board and the second board are exposed from the encapsulate layer. The frame layer is formed around and under the substrate to form a cavity with the substrate. The photosensitive chip is positioned on upper surface of the substrate and within the cavity. The wires are electrically connecting the outside ends of the first boards to the photosensitive chip. The transparent layer placed on the frame layer to cover the photosensitive chip.

Abstract translation: 本发明提供一种图像传感器封装，其包括基板，框架层，感光芯片，多根导线和透明层。 该基板包括间隔开并交替排列的多个金属片，每个金属片具有位于不同高度的第一板和第二板，第一板的外侧端部的加厚度小于内侧 第一板的端部，封装层封装多个金属板以形成上表面和下表面，使得第一板和第二板的外端从封装层露出。 框架层形成在基底周围和下方，以与衬底形成空腔。 光敏芯片位于基板的上表面和腔内。 导线将第一板的外端电连接到感光芯片。 透明层放置在框架层上以覆盖感光芯片。

公开(公告)号：US20050012170A1

公开(公告)日：2005-01-20

申请号：US10621992

申请日：2003-07-16

Applicant: Jackson Hsieh ,  Jichen Wu ,  Channing Wel ,  Bird Lin

Inventor： Jackson Hsieh ,  Jichen Wu ,  Channing Wel ,  Bird Lin

IPC: H01L31/0203 ,  H01L31/0232

CPC classification number: H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An image sensor having an improved transparent layer includes a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate has an upper surface formed with a plurality of first connected points. The frame layer is arranged on the upper surface of the substrate so as to form a cavity together with the substrate. The photosensitive chip is mounted on the upper surface of the substrate and within the cavity. The plurality of wires are electrically connected the photosensitive chip to the first connected point of the substrate. The transparent layer is covered on the frame layer for covering the photosensitive chip so that the photosensitive chip may receive optical signals passing through the transparent layer, respectively, at the peripheries of the transparent layer are formed with cut-corners. Therefore, the transparent layer may be decreased collision and may be increased the cleanness of the transparent layer, therefore, simplifying the manufacturing processes and decreasing the manufacturing cost.

公开(公告)号：US06906397B2

公开(公告)日：2005-06-14

申请号：US10621992

申请日：2003-07-16

Applicant: Jackson Hsieh ,  Jichen Wu ,  Channing Wel ,  Bird Lin

Inventor： Jackson Hsieh ,  Jichen Wu ,  Channing Wel ,  Bird Lin

IPC: H01L31/0203 ,  H01L31/0232

CPC classification number: H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An image sensor having an improved transparent layer includes a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate has an upper surface formed with a plurality of first connected points. The frame layer is arranged on the upper surface of the substrate so as to form a cavity together with the substrate. The photosensitive chip is mounted on the upper surface of the substrate and within the cavity. The plurality of wires are electrically connected the photosensitive chip to the first connected point of the substrate. The transparent layer is covered on the frame layer for covering the photosensitive chip so that the photosensitive chip may receive optical signals passing through the transparent layer, respectively, at the peripheries of the transparent layer are formed with cut—corners. Therefore, the transparent layer may be decreased collision and may be increased the cleanness of the transparent layer, therefore, simplifying the manufacturing processes and decreasing the manufacturing cost.

Abstract translation: 具有改进的透明层的图像传感器包括基板，框架层，感光芯片，多根导线和透明层。 基板具有形成有多个第一连接点的上表面。 框架层布置在基板的上表面上，以与基板一起形成空腔。 感光芯片安装在基板的上表面和腔内。 多根导线将感光芯片电连接到基板的第一连接点。 透明层被覆盖在框架层上，用于覆盖感光芯片，使得感光芯片可以分别在透明层的周边处接收通过透明层的光信号，并且形成有切角。 因此，透明层可以减少碰撞，并且可以提高透明层的清洁度，因此简化制造工艺并降低制造成本。