公开(公告)号：US20050077607A1

公开(公告)日：2005-04-14

申请号：US10683837

申请日：2003-10-09

Applicant: Jackson Hsieh ,  Jichen Wu ,  Worrell Tsai ,  Bruce Chen

Inventor： Jackson Hsieh ,  Jichen Wu ,  Worrell Tsai ,  Bruce Chen

IPC: H01L23/13 ,  H01L23/31 ,  H01L25/065 ,  H01L23/02 ,  H01L23/34

CPC classification number: H01L23/3107 ,  H01L23/13 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/06136 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A small memory card includes a substrate, a plurality of memory chips, a plurality of wires, and a glue layer, the substrate is formed with a plurality of through slots, then the plurality of memory chips be mounted on the substrate, so that the plurality of bounding pads of the memory chip from through slot may be revealed, and use a plurality of wires electrically connecting to the substrate, finally use the glue layer encapsulating a plurality of memory chips at the same time. Thus, the small memory card of present invention has small packed volume, and the manufacturing processes may be convenient.

Abstract translation: 小型存储卡包括基板，多个存储芯片，多根导线和胶合层，基板形成有多个通孔，然后将多个存储芯片安装在基板上， 可以显示从通槽的存储芯片的多个边界焊盘，并且使用电连接到基板的多根电线，最后同时使用封装多个存储芯片的胶层。 因此，本发明的小存储卡具有小的封装体积，并且制造工艺可以是方便的。

公开(公告)号：US20050077362A1

公开(公告)日：2005-04-14

申请号：US10683838

申请日：2003-10-09

Applicant: Jackson Hsieh ,  Jichen Wu ,  Abnet Chen

Inventor： Jackson Hsieh ,  Jichen Wu ,  Abnet Chen

IPC: G06K19/02 ,  G06K19/077 ,  H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  G06K19/06

CPC classification number: G06K19/0773 ,  G06K19/02 ,  G06K19/077 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0206 ,  H05K1/144 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/043 ,  H01L2924/00014

Abstract: A stacked small memory card includes an upper memory card and a lower memory card, the upper memory card and the lower memory card respectively formed a first heat sink and a second heat sink, the first heat sink and the second heat sink are stacked together, so that, the heat of the upper memory card and the lower memory card may be dispersed via the first heat sink and the second heat sink. Thus, the stacked small memory card of present invention having high function of disperses heat to promote its durability and lifetime effectively.

Abstract translation: 堆叠式小存储卡包括上存储卡和下存储卡，上存储卡和下存储卡分别形成第一散热器和第二散热器，第一散热器和第二散热器堆叠在一起， 使得上存储卡和下存储卡的热量可以经由第一散热器和第二散热器分散。 因此，本发明的堆叠式小型存储卡具有高散热功能，有效地提高了其耐久性和寿命。

公开(公告)号：US06870208B1

公开(公告)日：2005-03-22

申请号：US10671038

申请日：2003-09-24

Applicant: Irving You ,  Jichen Wu ,  Hsiu Wen Tu ,  Jason Chang ,  Figo Hsieh

Inventor： Irving You ,  Jichen Wu ,  Hsiu Wen Tu ,  Jason Chang ,  Figo Hsieh

IPC: H01L21/336 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/062

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An image sensor module includes a substrate, a frame layer, a photosensitive chip, a transparent layer and a lens barrel. The substrate has a plurality of lead frame arranged in a matrix to form an upper surface, which is formed with a opening, and a lower surface, which is formed with a cavity penetrated from the opening. The frame layer is integrally formed with the substrate, and arranged at the periphery of the upper surface of the substrate to define a chamber together with the substrate, an internal thread being formed on the inner wall of the chamber. The photosensitive chip is mounted within the cavity of the substrate, and electrically coupled each of the lead frames in a flip chip manner. The transparent layer is covered onto the upper surface of the substrate to cover the opening. The lens barrel has a top surface, a bottom surface opposed to the top surface and a transparent region, a external thread formed between the top surface and the bottom surface, the lens barrel being arranged within the chamber of the frame layer, the external thread being screwed on the internal thread of the chamber.

Abstract translation: 图像传感器模块包括基板，框架层，感光芯片，透明层和镜筒。 基板具有以矩阵形式布置的多个引线框架，以形成形成有开口的上表面和形成有从开口穿入的空腔的下表面。 框架层与衬底一体地形成，并且布置在衬底的上表面的周边以与衬底一起限定腔室，内腔形成在腔室的内壁上。 感光芯片安装在基板的腔内，并以倒装芯片的方式电耦合每个引线框架。 透明层被覆盖在基板的上表面上以覆盖开口。 镜筒具有顶表面，与顶表面相对的底表面和透明区域，形成在顶表面和底表面之间的外螺纹，镜筒设置在框架层的腔室内，外螺纹 被拧在腔室的内螺纹上。

公开(公告)号：US06680525B1

公开(公告)日：2004-01-20

申请号：US10340251

申请日：2003-01-09

Applicant: Jackson Hsieh ,  Jichen Wu ,  Bruce Chen

Inventor： Jackson Hsieh ,  Jichen Wu ,  Bruce Chen

IPC: H01L2302

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An image sensor to be mounted to a printed circuit board. The module includes a substrate, an integrated circuit, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate is composed of metal sheets arranged in a matrix, and a middle board positioned in a central region surrounded by the metal sheets. Each metal sheet has a first board and a second board connected to the printed circuit board. A slot is formed under the substrate. The integrated circuit is arranged within the slot and electrically connected to the substrate. The chip is placed on the middle board. The wires electrically connect the first boards, to the chip. The transparent layer is placed on the frame layer to cover the chip.

Abstract translation: 要安装到印刷电路板的图像传感器。 该模块包括基板，集成电路，框架层，感光芯片，多根导线和透明层。 基板由布置成矩阵状的金属板和位于由金属板包围的中央区域的中间板构成。 每个金属片具有连接到印刷电路板的第一板和第二板。 在基底下方形成槽。 集成电路布置在槽内并与衬底电连接。 芯片放在中间板上。 电线将第一板电连接到芯片。 透明层被放置在框架层上以覆盖芯片。

公开(公告)号：US06646316B2

公开(公告)日：2003-11-11

申请号：US09770049

申请日：2001-01-24

Applicant: Jichen Wu ,  Hsiu Wen Tu ,  Kuo Feng Peng ,  C. H. Chen ,  Wen Chuan Chen

Inventor： Jichen Wu ,  Hsiu Wen Tu ,  Kuo Feng Peng ,  C. H. Chen ,  Wen Chuan Chen

IPC: H01L310203

CPC classification number: H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: A package structure of an image sensor is characterized in that an image sensing chip is directly packaged on a flexible circuit board by way of flip chip bonding. The package structure of an image sensor includes an image sensing chip, a flexible circuit board, and a transparent layer. A plurality of electrical circuits are formed on the image sensing chip. Each of the electrical circuits is formed with bonding pads. A flexible circuit board has an upper surface and a lower surface. Signal input terminals are formed on the lower surface and at positions corresponding to each of the bonding pads of the image sensing chip, respectively, for electrically connecting to the corresponding bonding pads of the image sensing chip. The signal input terminals are electrically connected to signal output terminals, respectively, for electrically connecting to the printed circuit board. The transparent layer is used for covering the upper surface of the flexible circuit board. The image sensing chip receives image signals via the transparent layer, transforms the image signals into electrical signals, and transmits the electrical signals from the flexible circuit board to the printed circuit board.

Abstract translation: 图像传感器的封装结构的特征在于，通过倒装芯片接合将图像感测芯片直接封装在柔性电路板上。 图像传感器的封装结构包括图像感测芯片，柔性电路板和透明层。 在图像感测芯片上形成多个电路。 每个电路由接合焊盘形成。 柔性电路板具有上表面和下表面。 信号输入端子分别形成在下表面和对应于图像感测芯片的每个接合焊盘的位置处，用于电连接到图像感测芯片的相应接合焊盘。 信号输入端子分别电连接到信号输出端子，用于电连接到印刷电路板。 透明层用于覆盖柔性电路板的上表面。 图像感测芯片通过透明层接收图像信号，将图像信号转换为电信号，并将电信号从柔性电路板传输到印刷电路板。

公开(公告)号：US06906397B2

公开(公告)日：2005-06-14

申请号：US10621992

申请日：2003-07-16

Applicant: Jackson Hsieh ,  Jichen Wu ,  Channing Wel ,  Bird Lin

Inventor： Jackson Hsieh ,  Jichen Wu ,  Channing Wel ,  Bird Lin

IPC: H01L31/0203 ,  H01L31/0232

CPC classification number: H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An image sensor having an improved transparent layer includes a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate has an upper surface formed with a plurality of first connected points. The frame layer is arranged on the upper surface of the substrate so as to form a cavity together with the substrate. The photosensitive chip is mounted on the upper surface of the substrate and within the cavity. The plurality of wires are electrically connected the photosensitive chip to the first connected point of the substrate. The transparent layer is covered on the frame layer for covering the photosensitive chip so that the photosensitive chip may receive optical signals passing through the transparent layer, respectively, at the peripheries of the transparent layer are formed with cut—corners. Therefore, the transparent layer may be decreased collision and may be increased the cleanness of the transparent layer, therefore, simplifying the manufacturing processes and decreasing the manufacturing cost.

Abstract translation: 具有改进的透明层的图像传感器包括基板，框架层，感光芯片，多根导线和透明层。 基板具有形成有多个第一连接点的上表面。 框架层布置在基板的上表面上，以与基板一起形成空腔。 感光芯片安装在基板的上表面和腔内。 多根导线将感光芯片电连接到基板的第一连接点。 透明层被覆盖在框架层上，用于覆盖感光芯片，使得感光芯片可以分别在透明层的周边处接收通过透明层的光信号，并且形成有切角。 因此，透明层可以减少碰撞，并且可以提高透明层的清洁度，因此简化制造工艺并降低制造成本。

公开(公告)号：US20050098865A1

公开(公告)日：2005-05-12

申请号：US10705377

申请日：2003-11-10

Applicant: Jackson Hsieh ,  Jichen Wu ,  Worrell Tsai ,  Abnet Chen

Inventor： Jackson Hsieh ,  Jichen Wu ,  Worrell Tsai ,  Abnet Chen

IPC: H01L23/02 ,  H01L23/48 ,  H01L31/0203

CPC classification number: H01L31/0203 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An image sensor package includes plural lower metal sheets, plural upper metal sheets stacked on the lower metal sheets, and an encapsulant for encapsulating the lower and upper metal sheets. The lower metal formed with a first hole, the upper metal sheets formed a second hole penetrated from the upper surface to the lower surface. Wherein the encapsulant filled into the second hole and first hole to tighten the upper metal sheets and the lower metal sheets. A photosensitive chip arranged within the chamber, plural wires for electrically connecting the chip to the upper surfaces of the lower metal sheets, and a transparent layer arranged on the frame layer to cover the chip.

Abstract translation: 图像传感器封装包括多个下金属片，堆叠在下金属片上的多个上金属片，以及用于封装下金属片和上金属片的密封剂。 形成有第一孔的下部金属，上部金属板形成从上表面向下表面贯穿的第二孔。 其中密封剂填充到第二孔和第一孔中以收紧上金属片和下金属片。 布置在室内的感光芯片，用于将芯片电连接到下金属片的上表面的多根电线以及布置在框架层上以覆盖芯片的透明层。

公开(公告)号：US20050078457A1

公开(公告)日：2005-04-14

申请号：US10683839

申请日：2003-10-09

Applicant: Jackson Hsieh ,  Jichen Wu ,  Abnet Chen

Inventor： Jackson Hsieh ,  Jichen Wu ,  Abnet Chen

IPC: H05K7/20

CPC classification number: H05K7/20463

Abstract: A small memory card includes a first substrate, a heat sink, a second substrate, at least one upper memory chip, at least one bottom memory chip and a glue layer. The heat sink is arranged between the first substrate and second substrate, and contacted with the metal, which are filled within the plurality of through holes, which formed between the first substrate and second substrate. And each of the upper memory chips and bottom memory chips are mounted on the first substrate and the second substrate, so that the heat of the upper and bottom memory chips may be traveled to the heat sink via the metal, which is filled within the through hole, then the heat will be dispersed. Thus, the small memory card of present invention having high function of disperses heat to promote its durability and lifetime effectively, the manufacturing processes must be simplified and the manufacturing cost must decrease also.

Abstract translation: 小型存储卡包括第一基板，散热器，第二基板，至少一个上部存储器芯片，至少一个底部存储器芯片和胶合层。 散热器布置在第一基板和第二基板之间，并且与形成在第一基板和第二基板之间的多个通孔中填充的金属接触。 并且上部存储器芯片和底部存储器芯片中的每一个安装在第一基板和第二基板上，使得上部和下部存储器芯片的热量可以经由金属行进到散热器，该金属填充在通孔 孔，那么热会分散。 因此，本发明的小型存储卡具有高散热功能以有效提高其耐用性和寿命，因此制造工艺必须简化，制造成本也必须降低。

公开(公告)号：US20050012027A1

公开(公告)日：2005-01-20

申请号：US10621991

申请日：2003-07-16

Applicant: Jackson Hsieh ,  Jichen Wu

Inventor： Jackson Hsieh ,  Jichen Wu

IPC: H01L27/00 ,  H01L27/146 ,  H01L31/00 ,  H01L31/0203

CPC classification number: H01L27/14618 ,  H01L31/0203 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/00

Abstract: An image sensor includes plural lower metal sheets, plural upper metal sheets stacked on the lower metal sheets, and an encapsulant for encapsulating the lower and upper metal sheets, wherein the upper surfaces of the upper metal sheets are exposed from the encapsulant, the lower surfaces of the lower metal sheets are exposed from the encapsulant, and the encapsulant is formed with a frame layer around the upper surfaces of the upper metal sheets to define a chamber together with the upper metal sheets. The image sensor further includes a photosensitive chip arranged within the chamber, plural wires for electrically connecting the chip to the upper surfaces of the upper metal sheets, and a transparent layer arranged on the frame layer to cover the chip.

Abstract translation: 图像传感器包括多个下金属片，堆叠在下金属片上的多个上金属片和用于封装下金属片和上金属片的密封剂，其中上金属片的上表面从密封剂露出，下表面 的下部金属片从密封剂露出，并且密封剂在上金属片的上表面周围形成有框架层，以与上金属片一起限定室。 图像传感器还包括布置在腔室内的感光芯片，用于将芯片电连接到上金属片的上表面的多根电线以及布置在框架层上以覆盖芯片的透明层。

公开(公告)号：US20050012026A1

公开(公告)日：2005-01-20

申请号：US10621990

申请日：2003-07-16

Applicant: Jackson Hsieh ,  Jichen Wu ,  Shuen Yang ,  Worrell Tsai

Inventor： Jackson Hsieh ,  Jichen Wu ,  Shuen Yang ,  Worrell Tsai

IPC: H01L27/00 ,  H01L27/146 ,  H01L31/00 ,  H01L31/0203

CPC classification number: H01L27/14618 ,  H01L31/0203 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An image sensor includes a lower metal sheet set, an upper metal sheet set, an encapsulant, a photosensitive chip, plural wires, and a transparent layer. The lower metal sheet set includes plural lower metal sheets and a lower middle board arranged among and flush with the lower metal sheets. The upper metal sheet set includes plural upper metal sheets and an upper middle board arranged among and flush with the upper metal sheets. The encapsulant encapsulates the lower metal sheets, lower middle board, upper metal sheets and upper middle board with the upper metal sheets, lower metal sheets, lower middle board, and upper middle board exposed from the encapsulant, and with a frame layer formed around the upper metal sheets to define a chamber. The photosensitive chip is arranged on the upper surface of the upper middle board and located within the chamber.

Abstract translation: 图像传感器包括下金属片组，上金属片组，密封剂，感光芯片，多根线和透明层。 下部金属板组包括多个下部金属片和布置在下部金属片中并与之相齐平的下部中间板。 上金属片组包括多个上金属片和布置在上金属片中并与之齐平的上中间板。 密封剂用从密封剂露出的上金属片，下金属片，下中间板和上中间板封装下金属片，下中间板，上金属片和上中间板，并且围绕 上部金属板来限定一个室。 感光芯片布置在上中间板的上表面上并位于室内。