公开(公告)号：US20060163721A1

公开(公告)日：2006-07-27

申请号：US11040726

申请日：2005-01-21

Applicant: Frederick Kuhlman ,  Brentt Duff ,  Michael Pepples ,  Raymond Anton ,  Daniel Harshbarger

Inventor： Frederick Kuhlman ,  Brentt Duff ,  Michael Pepples ,  Raymond Anton ,  Daniel Harshbarger

IPC: H01L23/10

CPC classification number: H05K3/3452 ,  H05K1/181 ,  H05K3/3442 ,  H05K3/3489 ,  H05K2201/09772 ,  H05K2201/09909 ,  H05K2201/10022 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic assembly includes a substrate and at least one surface mounted electronic component. The substrate includes a first side and a second side opposite the first side. The first side of the substrate includes a plurality of conductive traces formed thereon. The plurality of conductive traces includes a first conductive trace and a second conductive trace. The electronic component is electrically coupled between the first and second conductive traces. A component body of the electronic component is subject to interaction with a flux, which is utilized during electrical coupling of the electronic component to the first and second conductive traces, to form a current leakage path. The substrate is configured to prevent the formation of the current leakage path.

Abstract translation: 电子组件包括基板和至少一个表面安装的电子部件。 基板包括与第一侧相对的第一侧和第二侧。 基板的第一面包括形成在其上的多个导电迹线。 多个导电迹线包括第一导电迹线和第二导电迹线。 电子部件电耦合在第一和第二导电迹线之间。 电子部件的组件主体经受与焊剂的相互作用，焊剂在电子部件与第一和第二导电迹线的电耦合期间被利用，以形成电流泄漏路径。 衬底被配置为防止形成电流泄漏路径。