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公开(公告)号:US20100139087A1
公开(公告)日:2010-06-10
申请号:US12332075
申请日:2008-12-10
Applicant: Keith W. Whites , Anthony K. Amert , Brian B. Glover
Inventor: Keith W. Whites , Anthony K. Amert , Brian B. Glover
IPC: H05K3/36
CPC classification number: H05K3/36 , H01P1/20372 , H01P11/007 , H05K1/0237 , H05K1/0295 , H05K1/141 , H05K1/147 , H05K2201/09954 , Y10T29/49126 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208 , Y10T29/5313
Abstract: A system of rapid prototyping, having: a plurality of thin sheets of low loss dielectric film, each sheet having a different metallization pattern formed thereon; and a base onto which each of the plurality of thin sheets of low loss dielectric film can be received, wherein the base comprises a metallization pattern formed thereon, and wherein placement of each of the plurality of thin sheets of low loss dielectric film onto the base results in a different circuit being formed across the thin sheet and the base.
Abstract translation: 一种快速成型系统,具有:多片低损耗介电薄片,每片具有形成在其上的不同的金属化图案; 以及可以容纳多个薄膜的低损耗介电膜中的每一个的基底,其中所述基底包括形成在其上的金属化图案,并且其中将所述多个低损耗电介质薄片中的每一个放置在所述基底上 导致在薄片和基底上形成不同的电路。
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公开(公告)号:US08196297B2
公开(公告)日:2012-06-12
申请号:US12332075
申请日:2008-12-10
Applicant: Keith W. Whites , Anthony K Amert , Brian B Glover
Inventor: Keith W. Whites , Anthony K Amert , Brian B Glover
CPC classification number: H05K3/36 , H01P1/20372 , H01P11/007 , H05K1/0237 , H05K1/0295 , H05K1/141 , H05K1/147 , H05K2201/09954 , Y10T29/49126 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208 , Y10T29/5313
Abstract: A method of rapid prototyping of a microwave device, by: providing a plurality of thin sheets of low loss dielectric film, each sheet having a different metallization pattern formed thereon; providing a base onto which each of the plurality of thin sheets of low loss dielectric film can be received, wherein the base comprises a metallization pattern formed thereon such that the placement of each of the plurality of thin sheets thereon forms a different circuit; and sequentially placing each of the plurality of thin sheets of low loss dielectric film onto the base, thereby sequentially forming different circuits across the thin sheet and the base.
Abstract translation: 一种通过以下方式快速成型微波器件的方法:提供多个薄片的低损耗介电膜,每个片材上形成有不同的金属化图案; 提供可以容纳所述多个低损耗介电膜薄片中的每一个的基底,其中,所述基底包括形成在其上的金属化图案,使得所述多个薄片中的每一个在其上的放置形成不同的电路; 并且将多个低损耗电介质薄膜的每一个顺序地放置在基底上,从而顺序地在薄片和基底上形成不同的电路。
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