公开(公告)号：US20150069629A1

公开(公告)日：2015-03-12

申请号：US14543838

申请日：2014-11-17

Applicant: Chung Peng Jackson KONG ,  Chang-Tsung Fu ,  Telesphor Kamgaing ,  Chan Kim Lee ,  Ping Ping Ooi

Inventor： Chung Peng Jackson KONG ,  Chang-Tsung Fu ,  Telesphor Kamgaing ,  Chan Kim Lee ,  Ping Ping Ooi

IPC: H01L23/522 ,  H01L23/528

CPC classification number: H01L23/5226 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/528 ,  H01L2224/16

Abstract: “Hybrid” transmission line circuits employing multiple interconnect levels for the propagation, or return, of a single signal line across a package length are described. In package transmission line circuit embodiments, a signal line employs co-located traces in two different interconnect levels that are electrically coupled together. In further embodiments, a reference plane is provided above, below or co-planar with at least one of the co-locate traces. In embodiments, a balanced signal line pair includes first and second co-located traces in two adjacent interconnect levels as a propagation signal line and third and fourth co-located traces in the two adjacent interconnect levels as a return signal line with a ground plane co-planar with, and/or above and/or below the two adjacent interconnect levels.

Abstract translation: 描述了采用多个互连级别以跨越封装长度传播或返回单条信号线的“混合”传输线路电路。 在封装传输线路电路实施例中，信号线在电耦合在一起的两个不同的互连级别中使用共同定位的迹线。 在另外的实施例中，参考平面被提供在至少一个共定位轨迹的上方，下方或共面上。 在实施例中，平衡信号线对包括作为传播信号线的两个相邻互连级别中的第一和第二同位置迹线，以及在两个相邻互连级别中的第三和第四同位序列作为具有接地平面Co 平面，和/或上方和/或下方两个相邻互连层。

公开(公告)号：US08890302B2

公开(公告)日：2014-11-18

申请号：US13538887

申请日：2012-06-29

Applicant: Chung Peng (Jackson) Kong ,  Chang-Tsung Fu ,  Telesphor Kamgaing ,  Chan Kim Lee ,  Ping Ping Ooi

Inventor： Chung Peng (Jackson) Kong ,  Chang-Tsung Fu ,  Telesphor Kamgaing ,  Chan Kim Lee ,  Ping Ping Ooi

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L23/5226 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/528 ,  H01L2224/16

Abstract: “Hybrid” transmission line circuits employing multiple interconnect levels for the propagation, or return, of a single signal line across a package length are described. In package transmission line circuit embodiments, a signal line employs co-located traces in two different interconnect levels that are electrically coupled together. In further embodiments, a reference plane is provided above, below or co-planar with at least one of the co-locate traces. In embodiments, a balanced signal line pair includes first and second co-located traces in two adjacent interconnect levels as a propagation signal line and third and fourth co-located traces in the two adjacent interconnect levels as a return signal line with a ground plane co-planar with, and/or above and/or below the two adjacent interconnect levels.

Abstract translation: 描述了采用多个互连级别以跨越封装长度传播或返回单条信号线的“混合”传输线路电路。 在封装传输线路电路实施例中，信号线在电耦合在一起的两个不同的互连级别中使用共同定位的迹线。 在另外的实施例中，参考平面被提供在至少一个共定位轨迹的上方，下方或共面上。 在实施例中，平衡信号线对包括作为传播信号线的两个相邻互连级别中的第一和第二同位置迹线，以及在两个相邻互连级别中的第三和第四同位序列作为具有接地平面Co 平面，和/或上方和/或下方两个相邻互连层。

公开(公告)号：US20080067665A1

公开(公告)日：2008-03-20

申请号：US11524108

申请日：2006-09-20

Applicant: Azniza Binti Abd Aziz ,  Chan Kim Lee ,  Kuen Yew Lam

Inventor： Azniza Binti Abd Aziz ,  Chan Kim Lee ,  Kuen Yew Lam

IPC: H01L23/04

CPC classification number: H01L23/49827 ,  H01L23/481 ,  H01L23/50 ,  H01L2223/6622 ,  H01L2223/6638 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H05K1/0222 ,  H05K2201/09636 ,  H05K2201/09809 ,  H01L2924/014 ,  H01L2224/0401

Abstract: In one embodiment, the invention may include a semiconductor package substrate with a plated-through hole (PTH) via. One or more conduits for transmitting signals can be located in the PTH via. The PTH via may shield the signals in the conduits from environmental noise (e.g., EMI). Other embodiments are described and claimed.

Abstract translation: 在一个实施例中，本发明可以包括具有电镀通孔（PTH）通孔的半导体封装基板。 用于发送信号的一个或多个导管可以位于PTH通孔中。 PTH通道可以屏蔽导管中的信号免受环境噪声（例如EMI）的影响。 描述和要求保护其他实施例。

公开(公告)号：US20140001643A1

公开(公告)日：2014-01-02

申请号：US13538887

申请日：2012-06-29

Applicant: Chung Peng (Jackson) KONG ,  Chang-Tsung FU ,  Telesphor KAMGAING ,  Chan Kim LEE ,  Ping Ping OOI

Inventor： Chung Peng (Jackson) KONG ,  Chang-Tsung FU ,  Telesphor KAMGAING ,  Chan Kim LEE ,  Ping Ping OOI

IPC: H01L23/498

CPC classification number: H01L23/5226 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/528 ,  H01L2224/16

Abstract: “Hybrid” transmission line circuits employing multiple interconnect levels for the propagation, or return, of a single signal line across a package length are described. In package transmission line circuit embodiments, a signal line employs co-located traces in two different interconnect levels that are electrically coupled together. In further embodiments, a reference plane is provided above, below or co-planar with at least one of the co-locate traces. In embodiments, a balanced signal line pair includes first and second co-located traces in two adjacent interconnect levels as a propagation signal line and third and fourth co-located traces in the two adjacent interconnect levels as a return signal line with a ground plane co-planar with, and/or above and/or below the two adjacent interconnect levels.

Abstract translation: 描述了采用多个互连级别以跨越封装长度传播或返回单条信号线的“混合”传输线路电路。 在封装传输线路电路实施例中，信号线在电耦合在一起的两个不同的互连级别中使用共同定位的迹线。 在另外的实施例中，参考平面被提供在至少一个共定位轨迹的上方，下方或共面上。 在实施例中，平衡信号线对包括作为传播信号线的两个相邻互连级别中的第一和第二同位置迹线，以及在两个相邻互连级别中的第三和第四同位序列作为具有接地平面Co 平面，和/或上方和/或下方两个相邻互连层。