公开(公告)号：US20050033954A1

公开(公告)日：2005-02-10

申请号：US10902829

申请日：2004-08-02

Applicant: Cheng-Fan Wang ,  Cheng-Ju Tsai ,  Chun-Ta Chen

Inventor： Cheng-Fan Wang ,  Cheng-Ju Tsai ,  Chun-Ta Chen

IPC: G06F15/177

CPC classification number: G06F11/1417

Abstract: A computer system with multiple Basic Input/Output System (BIOS) memory blocks has an internal memory block and an external memory block for the use of single or dual BIOS. When the external memory block is damaged or incorrect, the computer system automatically copies the content of the internal memory block to the external memory block. The booting information stored in the internal memory block is not alterable by a user so that the internal memory block booting information will continuingly serve the purpose of duplicating itself to the damaged external memory block for providing an unlimited number of salvages to the external memory block serving as the primary source for computer booting.

Abstract translation: 具有多个基本输入/输出系统（BIOS）存储器块的计算机系统具有内部存储器块和用于使用单个或双重BIOS的外部存储器块。 当外部存储器块损坏或不正确时，计算机系统将内部存储器块的内容自动复制到外部存储块。 存储在内部存储器块中的引导信息不可由用户改变，使得内部存储器块引导信息将继续用于将自身复制到损坏的外部存储器块的目的，以向外部存储器块提供无限数量的补救 作为计算机启动的主要来源。

公开(公告)号：US06295727B1

公开(公告)日：2001-10-02

申请号：US09227373

申请日：1999-01-08

Applicant: Yao-Kui Huang ,  Cheng-Fan Wang

Inventor： Yao-Kui Huang ,  Cheng-Fan Wang

IPC: H05K330

CPC classification number: H05K1/141 ,  H05K1/145 ,  H05K3/3405 ,  H05K3/368 ,  H05K2201/10037 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10689 ,  H05K2201/10939 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178

Abstract: A device and method for manufacturing an integrated real time clock integrated circuit (RTC IC) package is disclosed, in which the RTC IC and its related components are integrated into a single package. Therefore, the layout area required by the integrated RTC IC package is significantly reduced. Also, only a single manual assembling process is required. Furthermore, various examination steps are built into every process to manufacture the integrated RTC IC package to make sure the completed products are in normal condition. No extra examination and fix-up processes are required for the completed products so that manufacturing cost can be significantly reduced.

Abstract translation: 公开了用于制造集成实时时钟集成电路（RTC IC）封装的器件和方法，其中将RTC IC及其相关部件集成到单个封装中。 因此，集成RTC IC封装所需的布局面积大大减少。 此外，只需要一个手动组装过程。 此外，在制造集成的RTC IC封装的每个过程中都内置了各种检测步骤，以确保完成的产品处于正常状态。 完成的产品不需要额外的检查和修理流程，从而可以显着降低制造成本。