公开(公告)号：US08148971B2

公开(公告)日：2012-04-03

申请号：US12393955

申请日：2009-02-26

Applicant: Yi-Chang Lu ,  Cheng-Hung Li ,  Chung-Yui Kuo ,  Tsung-Yu Wu

Inventor： Yi-Chang Lu ,  Cheng-Hung Li ,  Chung-Yui Kuo ,  Tsung-Yu Wu

IPC: G05F3/16

CPC classification number: G05F3/08

Abstract: A layout of a voltage/current reference system is disclosed. A first voltage/current reference circuit (for example, a bandgap reference circuit) and a second voltage/current reference circuit are respectively laid out on either side of a substrate, such as edges or perimeter sides of the substrate. A reference voltage/current is derived by averaging respective output reference voltage/current values of the first and the second voltage/current reference circuits. Accordingly, the noise influence on the voltage/current reference system is minimized.

Abstract translation: 公开了电压/电流参考系的布局。 第一电压/电流参考电路（例如，带隙参考电路）和第二电压/电流参考电路分别布置在诸如衬底的边缘或周边侧的衬底的任一侧上。 通过平均第一和第二电压/电流参考电路的各个输出参考电压/电流值来导出参考电压/电流。 因此，对电压/电流参考系统的噪声影响被最小化。

公开(公告)号：US20110068283A1

公开(公告)日：2011-03-24

申请号：US12695557

申请日：2010-01-28

Applicant: Shey-Shi Lu ,  Ying-Jay Yang ,  Shuo-Hung Chang ,  Jian-Yu Hsieh ,  Kuan-Ting Lin ,  Tao Wang ,  Chih-Chung Su ,  Cheng-Hung Li ,  Neng-Kai Chang

Inventor： Shey-Shi Lu ,  Ying-Jay Yang ,  Shuo-Hung Chang ,  Jian-Yu Hsieh ,  Kuan-Ting Lin ,  Tao Wang ,  Chih-Chung Su ,  Cheng-Hung Li ,  Neng-Kai Chang

IPC: G21F1/10

CPC classification number: H05K9/0088

Abstract: The invention provides electromagnetic wave absorption components and device. The electromagnetic wave absorption component includes an electromagnetic shield constituted by at least one material selected from the group consisting of a carbon nanocoil and a carbon fiber, and a solidified layer formed of a mixture of a solidifiable material and the electromagnetic shield after solidification. Another embodiment of the electromagnetic wave absorption component includes an electromagnetic shield constituted by at least one material selected from the group consisting of a carbon nanocoil and a carbon fiber, and a solidified layer, formed by solidifying a solidifiable material, applicable to encapsulating the electromagnetic shield. Further, the electromagnetic wave absorption device is formed by stacking at least two of the above-mentioned electromagnetic wave absorption components.

Abstract translation: 本发明提供电磁波吸收组件和装置。 电磁波吸收部件包括由选自碳纳米线和碳纤维的至少一种材料构成的电磁屏蔽，以及在固化后由可固化材料和电磁屏蔽的混合物形成的固化层。 电磁波吸收部件的另一实施例包括由选自碳纳米线和碳纤维的至少一种材料构成的电磁屏蔽，以及通过固化可固化材料形成的固化层，其可用于封装电磁屏蔽 。 此外，电磁波吸收装置通过堆叠至少两个上述电磁波吸收组件而形成。

公开(公告)号：US07952229B2

公开(公告)日：2011-05-31

申请号：US12393994

申请日：2009-02-26

Applicant: Yi-Chang Lu ,  Cheng-Hung Li ,  Chung-Yui Kuo ,  Tsung-Yu Wu

Inventor： Yi-Chang Lu ,  Cheng-Hung Li ,  Chung-Yui Kuo ,  Tsung-Yu Wu

IPC: H05K1/02

CPC classification number: H02J1/06 ,  H05K1/0265 ,  H05K2201/09254 ,  H05K2201/09727 ,  H05K2201/0979 ,  Y10T307/492

Abstract: A power distribution system is disclosed. The system includes a first power line and a second power line laid out on a substrate. The first power line is spaced apart from the second power line. The system also includes at least one conductive connecting line that electrically couples the first power line at one end and the second power line at another end. A power supply supplies power to the first power line and the second power line. A supply node on the conductive connecting line is then used to provide the supplied power.

Abstract translation: 公开了配电系统。 该系统包括布置在基板上的第一电源线和第二电源线。 第一电力线与第二电力线隔开。 该系统还包括至少一个导电连接线，其在一端电耦合第一电力线和在另一端电耦合第二电力线。 电源为第一电力线和第二电力线供电。 然后使用导电连接线上的供电节点来提供所供电的电力。

公开(公告)号：US20100200947A1

公开(公告)日：2010-08-12

申请号：US12366654

申请日：2009-02-06

Applicant: Cheng-Chou Hung ,  Victor-Chiang Liang ,  Jui-Meng Jao ,  Cheng-Hung Li ,  Sheng-Yi Huang ,  Tzung-Lin Li ,  Huai-Wen Zhang ,  Chih-Yu Tseng

Inventor： Cheng-Chou Hung ,  Victor-Chiang Liang ,  Jui-Meng Jao ,  Cheng-Hung Li ,  Sheng-Yi Huang ,  Tzung-Lin Li ,  Huai-Wen Zhang ,  Chih-Yu Tseng

IPC: H01L29/06

CPC classification number: H01L23/585 ,  H01L21/76229 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A die seal ring disposed outside of a die region of a semiconductor substrate is disclosed. The die seal ring includes a first isolation structure, a second isolation structure, and at least one third isolation structure disposed between the first isolation structure and the second isolation structure; a plurality of first regions between the first isolation structure, the second isolation structure and the third isolation structure; a second region under the first region and the third isolation structure; and a third region under the first isolation structure.

Abstract translation: 公开了设置在半导体衬底的管芯区域的外侧的管芯密封环。 模具密封环包括第一隔离结构，第二隔离结构以及设置在第一隔离结构和第二隔离结构之间的至少一个第三隔离结构; 所述第一隔离结构，所述第二隔离结构和所述第三隔离结构之间的多个第一区域; 第一区域和第三隔离结构之下的第二区域; 和第一隔离结构下的第三区域。

公开(公告)号：US08357988B2

公开(公告)日：2013-01-22

申请号：US12366654

申请日：2009-02-06

Applicant: Cheng-Chou Hung ,  Victor-Chiang Liang ,  Jui-Meng Jao ,  Cheng-Hung Li ,  Sheng-Yi Huang ,  Tzung-Lin Li ,  Huai-Wen Zhang ,  Chih-Yu Tseng

Inventor： Cheng-Chou Hung ,  Victor-Chiang Liang ,  Jui-Meng Jao ,  Cheng-Hung Li ,  Sheng-Yi Huang ,  Tzung-Lin Li ,  Huai-Wen Zhang ,  Chih-Yu Tseng

IPC: H01L21/70

CPC classification number: H01L23/585 ,  H01L21/76229 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A die seal ring disposed outside of a die region of a semiconductor substrate is disclosed. The die seal ring includes a first isolation structure, a second isolation structure, and at least one third isolation structure disposed between the first isolation structure and the second isolation structure; a plurality of first regions between the first isolation structure, the second isolation structure and the third isolation structure; a second region under the first region and the third isolation structure; and a third region under the first isolation structure.

Abstract translation: 公开了设置在半导体衬底的管芯区域的外侧的管芯密封环。 模具密封环包括第一隔离结构，第二隔离结构以及设置在第一隔离结构和第二隔离结构之间的至少一个第三隔离结构; 所述第一隔离结构，所述第二隔离结构和所述第三隔离结构之间的多个第一区域; 第一区域和第三隔离结构之下的第二区域; 和第一隔离结构下的第三区域。

公开(公告)号：US20100213918A1

公开(公告)日：2010-08-26

申请号：US12393955

申请日：2009-02-26

Applicant: Yi-Chang Lu ,  Cheng-Hung Li ,  Chung-Yui Kuo ,  Tsung-Yu Wu

Inventor： Yi-Chang Lu ,  Cheng-Hung Li ,  Chung-Yui Kuo ,  Tsung-Yu Wu

IPC: G05F3/00

CPC classification number: G05F3/08

Abstract: A layout of a voltage/current reference system is disclosed. A first voltage/current reference circuit (for example, a bandgap reference circuit) and a second voltage/current reference circuit are respectively laid out on either side of a substrate, such as edges or perimeter sides of the substrate. A reference voltage/current is derived by averaging respective output reference voltage/current values of the first and the second voltage/current reference circuits. Accordingly, the noise influence on the voltage/current reference system is minimized.

Abstract translation: 公开了电压/电流参考系的布局。 第一电压/电流参考电路（例如，带隙参考电路）和第二电压/电流参考电路分别布置在诸如衬底的边缘或周边侧的衬底的任一侧上。 通过平均第一和第二电压/电流参考电路的各个输出参考电压/电流值来导出参考电压/电流。 因此，对电压/电流参考系统的噪声影响被最小化。

公开(公告)号：US20100213764A1

公开(公告)日：2010-08-26

申请号：US12393994

申请日：2009-02-26

Applicant: Yi-Chang Lu ,  Cheng-Hung Li ,  Chung-Yui Kuo ,  Tsung-Yu Wu

Inventor： Yi-Chang Lu ,  Cheng-Hung Li ,  Chung-Yui Kuo ,  Tsung-Yu Wu

IPC: H05K1/11

CPC classification number: H02J1/06 ,  H05K1/0265 ,  H05K2201/09254 ,  H05K2201/09727 ,  H05K2201/0979 ,  Y10T307/492

Abstract: A power distribution system is disclosed. The system includes a first power line and a second power line laid out on a substrate. The first power line is spaced apart from the second power line. The system also includes at least one conductive connecting line that electrically couples the first power line at one end and the second power line at another end. A power supply supplies power to the first power line and the second power line. A supply node on the conductive connecting line is then used to provide the supplied power.

Abstract translation: 公开了配电系统。 该系统包括布置在基板上的第一电源线和第二电源线。 第一电力线与第二电力线隔开。 该系统还包括至少一个导电连接线，其在一端电耦合第一电力线和在另一端电耦合第二电力线。 电源为第一电力线和第二电力线供电。 然后使用导电连接线上的供电节点来提供所供电的电力。