Abstract:
The invention relates to a method and apparatus for cutting a substrate using laser irradiation. A laser beam is scanned over a substrate. The beam ablates a first layer of the substrate. The beam is then refocused onto the newly revealed second layer and a further pass is performed. The process is repeated until complete separation occurs. The method and apparatus are particularly suitable for singulation of IC packages.
Abstract:
An apparatus and method of testing a magnetic medium at temperatures of interest is disclosed. Properties of the magnetic medium are determined by focusing light from a source of polarized light on a magnetic surface of the magnetic medium; measuring polarization of resulting reflected light due to the magneto-optical Kerr effect, using, for example a measuring subsystem; and varying the light source to heat the magnetic material where incident to pre-defined temperatures, thereby allowing determination of the magnetic properties using the magneto-optical Kerr effect at said pre-defined temperatures.
Abstract:
This invention relates to a method and apparatus for deflashing integrated circuit (IC) packages by laser irradiation. The method and apparatus include two lasers scanning flash area for performing deflashing operation. CO2 laser is used to remove top layer of flash and YAG laser is used to remove the thin layer of flash remained after CO2 laser deflashing. CO2 laser deflashing and following YAG laser deflashing can effectively remove flash and avoid damage of heat sinks as well as leads and bars in the IC packages.
Abstract translation:本发明涉及一种通过激光照射对集成电路(IC)封装进行消融的方法和装置。 该方法和装置包括两个激光扫描闪光区域,用于进行去抖动操作。 CO 2激光器用于去除闪光的顶层,并且使用YAG激光器去除CO 2激光束缚后残留的薄层。 CO 2激光束缚和随后的YAG激光束缚可以有效地去除闪光,并避免散热片以及IC封装中的引线和棒的损坏。
Abstract:
This invention relates to a method and apparatus for deflashing integrated circuit (IC) packages by laser irradiation. The method and apparatus include two lasers scanning flash area for performing deflashing operation. CO2 laser is used to remove top layer of flash and YAG laser is used to remove the thin layer of flash remained after CO2 laser deflashing. CO2 laser deflashing and following YAG laser deflashing can effectively remove flash and avoid damage of heat sinks as well as leads and bars in the IC packages.
Abstract:
A method and apparatus for testing a magnetic medium. The method comprises applying a magnetic field of a time-varying strength; directing a polarized optical beam towards a portion of the medium that is in the magnetic field, wherein the optical beam is reflected by a surface of the medium at a point of incidence in the magnetic field; moving the medium relative to the optical beam so as to cause the point of incidence to repeatedly traverse each of a plurality of sectors along a track on the surface; obtaining a series of Kerr signal measurements of the reflected optical beam; grouping measurements into ensembles such that the measurements in an individual ensemble are those obtained while the point of incidence was in a corresponding one of the sectors; and determining at least one magnetic property of at least one of the sectors from the measurements in the corresponding ensemble.
Abstract:
A method and apparatus for testing a magnetic medium. The method comprises applying a magnetic field of a time-varying strength; directing a polarized optical beam towards a portion of the medium that is in the magnetic field, wherein the optical beam is reflected by a surface of the medium at a point of incidence in the magnetic field; moving the medium relative to the optical beam so as to cause the point of incidence to repeatedly traverse each of a plurality of sectors along a track on the surface; obtaining a series of Kerr signal measurements of the reflected optical beam; grouping measurements into ensembles such that the measurements in an individual ensemble are those obtained while the point of incidence was in a corresponding one of the sectors; and determining at least one magnetic property of at least one of the sectors from the measurements in the corresponding ensemble.
Abstract:
This invention relates to a method and apparatus for deflashing integrated circuit (IC) packages by laser irradiation. The method and apparatus include two lasers scanning flash area for performing deflashing operation. CO2 laser is used to remove top layer of flash and YAG laser is used to remove the thin layer of flash remained after CO2 laser deflashing. CO2 laser deflashing and following YAG laser deflashing can effectively remove flash and avoid damage of heat sinks as well as leads and bars in the IC packages.
Abstract translation:本发明涉及一种通过激光照射对集成电路(IC)封装进行消融的方法和装置。 该方法和装置包括两个激光扫描闪光区域,用于进行去抖动操作。 CO 2激光器用于去除闪光的顶层,并且使用YAG激光器去除CO 2激光束缚后残留的薄层。 CO 2激光束缚和随后的YAG激光束缚可以有效地去除闪光,并避免散热片以及IC封装中的引线和棒的损坏。