公开(公告)号：US06458250B1

公开(公告)日：2002-10-01

申请号：US09697997

申请日：2000-10-26

Applicant: Martin L. Holliday ,  Craig Wilson ,  Colin G. Piearce

Inventor： Martin L. Holliday ,  Craig Wilson ,  Colin G. Piearce

IPC: B01J1908

CPC classification number: B05D1/045 ,  B05B5/032 ,  B05B7/22

Abstract: The present invention describes a process for the application of a powder coating to a non-conductive substrate by first exposing the non conductive substrate to a combination of steam and heat at temperatures between 70° C. and 140° C. for a period between 5 seconds and up to 10 minutes, followed by electrostatic application of a powder coating to the substrate which is grounded; this simple and reliable pre-treatment method allows an efficient application of powder coatings to non-conductive substrates resulting in uniform and even deposition of the powder coating over the whole surface including edges and with no adverse effects on the subsequent curing of the powder film.

Abstract translation: 本发明描述了一种通过首先在70℃至140℃之间的温度下将非导电衬底暴露于蒸汽和热的组合之间，将粉末涂层施加到非导电衬底上的过程，持续5 秒至多10分钟，然后将粉末涂料静电施加到接地的基底上; 这种简单和可靠的预处理方法允许粉末涂料有效地应用于非导电基材，导致粉末涂料在包括边缘的整个表面上均匀均匀地沉积，并且对随后的粉末膜的固化没有不利影响。